Abstract: A dispense for dispensing an adhesive onto a remote surface, such as a case mouth and primer ammunition. The dispense includes a reservoir containing an adhesive; a positive displacement pump; and a nozzle having a tapered tip. The positive displacement pump delivers a predetermined amount of the adhesive, preferably an anaerobic adhesive, from the reservoir to the nozzle at predetermined intervals. The nozzle discharges the predetermined amount of adhesive through the air and at least 1/16-inch onto the remote surface.

Abstract: This invention provides methods for controlled single electron transfer living radical polymerization (SET-LRP) of monomers with increased conversion, high molecular weights and low polydispersity by allowing the polymerization to proceed at low temperatures via a tubular reactor either made of copper or containing copper metal surface.

Abstract: A prepreg curing process for preparing composites having superior surface finish and high fiber consolidation is provided.

Abstract: This invention provides methods for controlled single electron transfer living radical polymerization (SET-LRP) of monomers with increased conversion, high molecular weights and low polydispersity by allowing the polymerization to proceed at low temperatures via a tubular reactor either made of copper or containing copper metal surface.

Abstract: The invention provides anaerobic curable compositions, and methods of their production and use. These compositions provide excellent adhesion especially on oily surfaces.

Abstract: A prepreg curing process for preparing composites having superior surface finish and high fiber consolidation is provided.

Abstract: The invention provides hot melt adhesives comprising (A) a mixture of polymers consisting of (1) an amorphous alpha olefin, (2) an ethylene copolymer that has a Tg value equal to or less than ?35° C.; and (3) a styrene block copolymer; and (B) a polyethylene wax grafted with a functional group. These hot melt adhesives have high heat resistance and good low temperature performance, making them particularly well suited for end-of-line packaging application.

Abstract: Thermosetting resin compositions with low coefficient of thermal expansion are provided herein.

Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.

Abstract: Provided herein are electronic devices assembled with a heat absorbing and/or thermally insulating composition.

Abstract: The invention provides a hot melt adhesive comprising a polymer mixture of an ethylene vinyl acetate polymer with low vinyl acetate content and a functionalized metallocene catalyzed polyethylene copolymer. The hot melt adhesive has wide service temperature ranges for bonding cellulosic substrates together. The adhesive is well suited for case, tray, carton and bag sealing applications.

Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl(meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.

Abstract: The present invention relates to elastic attachment adhesives that comprise non-metallocene catalyzed polymers. The elastic attachment adhesives have stable creep performance under prolonged aging parameters, making these adhesives particularly well suited for elastic applications.

Abstract: An internal mold release agent (IMRA) which effectively releases a cured polyurethane (PU) material from a metal, in particular steel, mold. The IMRA is a surface active agent containing phosphorus or a combination (blend or reaction product) of the agent with other chemicals. In one embodiment the agent is a phosphate ester. In one embodiment the agent is polyoxyethylene alkyl phosphate ester. A polyurethane formulation comprising the IMRA has high formulation stability, clean release, low release strength, and high product transparency.

Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.

Abstract: The present invention relates to thiol-ene curing compositions, which cure upon exposure to ultraviolet (UV) light and/or heat. The compositions include components having alkenyl (or “ene”) functionality and components having thiol functionality, which undergo thiol-ene curing. The compositions also include a cure system. More specifically, in some embodiments, the curable compositions include a vinyl polymer bearing alkenyl or thiol terminal functional group(s) and a cross-linking agent having the opposing functionality, i.e., thiol cross-linking agents with alkenyl-terminated vinyl polymers and vinyl cross-linking agents with thiol-terminated vinyl polymers. Also provided are methods of making and using the compositions, such as for sealants for in-place gasketing applications.

Abstract: The present invention relates to photocurable elastomer compositions and methods of preparation and use of such compositions for cure-in-place applications such as gaskets. The curable compositions generally include an elastomer component, a monofunctional and/or multifunctional reactant and a photoinitiator that in various aspects may be a visible and/or UV curing initiator. The various components may be present in different amounts, depending on the combination of components and composition desired.

Abstract: A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.

Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.

Abstract: Living radical polymerization processes, reaction products of such processes, and compositions containing such reaction products are provided. More particularly, a living radical polymerization of (meth)acrylic acid monomers employing having a defined order of introduction of the reactants and/or a specific set of reaction conditions, is provided.