Patents Assigned to Henkel Corporation
  • Publication number: 20150238997
    Abstract: A dispense for dispensing an adhesive onto a remote surface, such as a case mouth and primer ammunition. The dispense includes a reservoir containing an adhesive; a positive displacement pump; and a nozzle having a tapered tip. The positive displacement pump delivers a predetermined amount of the adhesive, preferably an anaerobic adhesive, from the reservoir to the nozzle at predetermined intervals. The nozzle discharges the predetermined amount of adhesive through the air and at least 1/16-inch onto the remote surface.
    Type: Application
    Filed: August 9, 2013
    Publication date: August 27, 2015
    Applicant: Henkel Corporation
    Inventors: Steven J. Hemsen, Bryan DesRoches, Edward A.Y. Fisher
  • Patent number: 8883941
    Abstract: This invention provides methods for controlled single electron transfer living radical polymerization (SET-LRP) of monomers with increased conversion, high molecular weights and low polydispersity by allowing the polymerization to proceed at low temperatures via a tubular reactor either made of copper or containing copper metal surface.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: November 11, 2014
    Assignee: Henkel Corporation
    Inventors: Anthony F. Jacobine, John G. Woods, Scott Senuta, David P. Dworak, Debora E. Duch, John Mazzullo
  • Publication number: 20140262014
    Abstract: A prepreg curing process for preparing composites having superior surface finish and high fiber consolidation is provided.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: Raymond S. Wong, Wei Helen Li, Huabing Zheng
  • Publication number: 20140272214
    Abstract: The invention provides hot melt adhesives comprising (A) a mixture of polymers consisting of (1) an amorphous alpha olefin, (2) an ethylene copolymer that has a Tg value equal to or less than ?35° C.; and (3) a styrene block copolymer; and (B) a polyethylene wax grafted with a functional group. These hot melt adhesives have high heat resistance and good low temperature performance, making them particularly well suited for end-of-line packaging application.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Applicants: Henkel Ltd., Henkel Corporation
    Inventors: Richard Ellis, Geetanjaliben Shah, Andrea Eodice
  • Publication number: 20140273694
    Abstract: A prepreg curing process for preparing composites having superior surface finish and high fiber consolidation is provided.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: Wei Helen Li, Bryce Floryancic, Michael D. Halbasch
  • Publication number: 20140264822
    Abstract: Thermosetting resin compositions with low coefficient of thermal expansion are provided herein.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: Masashi Horikiri, Jie Bai
  • Publication number: 20140275448
    Abstract: This invention provides methods for controlled single electron transfer living radical polymerization (SET-LRP) of monomers with increased conversion, high molecular weights and low polydispersity by allowing the polymerization to proceed at low temperatures via a tubular reactor either made of copper or containing copper metal surface.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: Anthony F. Jacobine, John G. Woods, Scott Senuta, David P. Dworak, Debora E. Duch, John Mazzullo
  • Publication number: 20140264165
    Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: Puwei Liu, Donghang Xie, Emilie Barriau, Shengqian Kong
  • Publication number: 20140262022
    Abstract: The invention provides anaerobic curable compositions, and methods of their production and use. These compositions provide excellent adhesion especially on oily surfaces.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: Jianping Liu, Andrus Maandi
  • Publication number: 20140272219
    Abstract: The invention provides a hot melt adhesive comprising a polymer mixture of an ethylene vinyl acetate polymer with low vinyl acetate content and a functionalized metallocene catalyzed polyethylene copolymer. The hot melt adhesive has wide service temperature ranges for bonding cellulosic substrates together. The adhesive is well suited for case, tray, carton and bag sealing applications.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Applicant: HENKEL CORPORATION
    Inventors: Chuiwah Alice Cheung, Stephane Belmudes
  • Publication number: 20140268579
    Abstract: Provided herein are electronic devices assembled with a heat absorbing and/or thermally insulating composition.
    Type: Application
    Filed: March 16, 2013
    Publication date: September 18, 2014
    Applicant: Henkel Corporation
    Inventors: My N. Nguyen, Jason Brandi
  • Publication number: 20140238603
    Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl(meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 28, 2014
    Applicants: Henkel AG & Co. KGaA, Henkel Ireland Limited, Henkel Corporation
    Inventors: Marcus Heemann, Charles W. Paul, Maria Xenidou, Maja Schroeder, Sebastian Kostyra, Marisa Phelan
  • Publication number: 20140232041
    Abstract: An internal mold release agent (IMRA) which effectively releases a cured polyurethane (PU) material from a metal, in particular steel, mold. The IMRA is a surface active agent containing phosphorus or a combination (blend or reaction product) of the agent with other chemicals. In one embodiment the agent is a phosphate ester. In one embodiment the agent is polyoxyethylene alkyl phosphate ester. A polyurethane formulation comprising the IMRA has high formulation stability, clean release, low release strength, and high product transparency.
    Type: Application
    Filed: February 19, 2013
    Publication date: August 21, 2014
    Applicants: Henkel Corporation, Henkel AG & Co. KGaA
    Inventors: Qiwen Han, Andreas Ferencz, Olaf Lammerschop, Yongxia Wang
  • Publication number: 20140235127
    Abstract: The present invention relates to elastic attachment adhesives that comprise non-metallocene catalyzed polymers. The elastic attachment adhesives have stable creep performance under prolonged aging parameters, making these adhesives particularly well suited for elastic applications.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 21, 2014
    Applicant: Henkel Corporation
    Inventors: Maria Cristina Barbosa DeJesus, Charles Paul, Valerie Alexis
  • Publication number: 20140225283
    Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 14, 2014
    Applicant: HENKEL CORPORATION
    Inventors: Gyanendra Dutt, Qizhuo Zhuo, Elizabeth Hoang, Stephen Ruatta
  • Publication number: 20140216649
    Abstract: The present invention relates to thiol-ene curing compositions, which cure upon exposure to ultraviolet (UV) light and/or heat. The compositions include components having alkenyl (or “ene”) functionality and components having thiol functionality, which undergo thiol-ene curing. The compositions also include a cure system. More specifically, in some embodiments, the curable compositions include a vinyl polymer bearing alkenyl or thiol terminal functional group(s) and a cross-linking agent having the opposing functionality, i.e., thiol cross-linking agents with alkenyl-terminated vinyl polymers and vinyl cross-linking agents with thiol-terminated vinyl polymers. Also provided are methods of making and using the compositions, such as for sealants for in-place gasketing applications.
    Type: Application
    Filed: April 3, 2008
    Publication date: August 7, 2014
    Applicants: Henkel Corporation
    Inventors: John G. Woods, Richard O. Angus, JR., Joel D. Schall
  • Publication number: 20140193652
    Abstract: The present invention relates to photocurable elastomer compositions and methods of preparation and use of such compositions for cure-in-place applications such as gaskets. The curable compositions generally include an elastomer component, a monofunctional and/or multifunctional reactant and a photoinitiator that in various aspects may be a visible and/or UV curing initiator. The various components may be present in different amounts, depending on the combination of components and composition desired.
    Type: Application
    Filed: March 10, 2014
    Publication date: July 10, 2014
    Applicant: Henkel Corporation
    Inventors: James E. Lionberger, John G. Woods, Joel D. Schall
  • Publication number: 20140141185
    Abstract: A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 22, 2014
    Applicant: Henkel Corporation
    Inventors: Tianjian Huang, Kristina Thompson, James Layser, John Harrington, John Meccia, Robert Mammerella
  • Publication number: 20140127445
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 8, 2014
    Applicant: Henkel Corporation
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • Publication number: 20140107283
    Abstract: Living radical polymerization processes, reaction products of such processes, and compositions containing such reaction products are provided. More particularly, a living radical polymerization of (meth)acrylic acid monomers employing having a defined order of introduction of the reactants and/or a specific set of reaction conditions, is provided.
    Type: Application
    Filed: March 12, 2013
    Publication date: April 17, 2014
    Applicant: Henkel Corporation
    Inventors: Qinyan Zhu, David P. Dworak, John G. Woods, Anthony F. Jacobine