Abstract: A fluid dispensing apparatus includes an operable peristaltic pump. The pump supports a rigid container which includes an aggressive fluid which is to be dispensed from the container. A vent tube and a dispensing tube extends from the container through the pump. Operation of the pump causes fluid to be pumped out from the container through the dispensing tube while air is pumped into the container through the vent tube. This equalizes pressure in the container and allows fluid to be dispensed from a rigid container.

Abstract: A spin coating apparatus for applying adhesive to a substrate includes: a rotatable chuck configured to receive and hold a substrate thereon; a nozzle positioned above the rotatable chuck and configured to dispense the adhesive onto a surface of the substrate; a containment pan surrounding the rotatable chuck and configured to contain excess adhesive; a collection container in fluid communication with the containment pan; and a removal device positioned within the containment pan configured to direct the excess adhesive into the collection container.

Abstract: Pressure sensitive adhesive formulations of an acrylic polymer grafted with a macromer are particularly well suited for use in the manufacture of impact resistant articles such as impact resistant glass laminates and products comprising such laminates.

Abstract: The present invention relates to mold release agents. More particularly, it relates to a two-component, high gloss, semi permanent water-based mold release agent.

Abstract: A process of controlled radical polymerization, and products made therefrom is disclosed. The process includes performing controlled radical polymerization on a composition comprising a polymerizable compound, an initiator, a ligand, and a catalyst; permitting the controlled radical polymerization reaction to proceed until a desired level of conversion is attained, but prior to complete conversion to obtain an intermediate polymerization product; and further reacting the intermediate polymerization product with a reactant having a cluster of multiple reactive sites to provide a polymer reaction product having a cluster of pendent multiple reactive sites adjacent to said terminal ends of said polymer reaction product.

Abstract: A cartridge for a flowable material, e.g. caulking compounds, sealants and adhesives, includes a tubular container, an end plate disposed at a first end to a tubular container, a nozzle extending from the end plate, a plunger received in the tubular container, and a barb extending inwardly from the tubular container. The end plate includes an opening. The nozzle is in communication with the opening. The barb is configured to limit movement of the plunger in a first axial direction. A method for packaging a flowable material includes introducing flowable material into a tubular container, inserting a plunger into the container, and deforming the tubular container at a location axially spaced from an end of the container at a location axially spaced from an end of the container to create a mechanical stop.

Abstract: A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.

Abstract: This invention is a dual cure adhesive that can be designed to have a proper balance of properties by choosing formulation materials to meet certain inequalities. The dual cure adhesive comprises ethylenically unsaturated compounds capable of UV-initiated free radical polymerization and epoxy compounds and their corresponding curing agents capable of thermal cure. In a particular embodiment, the dual cure adhesive comprises (A) one or more monofunctional acrylate compounds containing an oxygen-containing cyclic unit, (B) one or more monofunctional acrylate compounds in which the ester group contains a hydrocarbon group consisting of at least six carbon atoms, and (C) one or more thermoplastic, solid, amorphous epoxy compounds having a softening point or melting point between 60° C. and 100° C.

Abstract: A two part, curable, epoxy composition useful for potting or sealing electrical devices for use in hazardous locations. Cured reaction products of the epoxy composition meet most or all UL 674 requirements and are useful to seal apertures in electrical equipment. Equipment sealed with the disclosed compositions can meet the UL 674 requirement.

Abstract: A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.

Abstract: A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less than the first phase, characterized in that the phases are generated in situ as the composition cures.

Abstract: A two component polyurethane adhesive composition having one or more polyols as a first component and one or more isocyanates as a second component. The composition also comprises a catalyst and a hydroxyalkyl-8-hydroxy quinoline blocking agent to delay the initial part of the curing reaction. The blocking agent links to the adhesive matrix during cure. The composition provides long open time, improved wet out of the substrates to be bonded, a rapid cure rate and bonding of the blocking agent to the cured adhesive matrix. The adhesive is useful to bond layers of a flexible food pouch sheet. Also a flexible food pouch made using the adhesive.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts are provided.

Abstract: A method of assembling an appliance using a curable silicone composition optionally containing spacer beads of an appropriate size to permit adhesively joining the appliance parts in a desirably spaced-apart arrangement.

Abstract: A method of forming a bonded shingle stacked die package is provided. The method includes providing a wafer, singulating the wafer into a plurality of strips, applying to at least a portion of at least one mating surface of each of the plurality of strips a material capable of reacting with the other mating surface, stacking the plurality of strips in an overlapping stair-step configuration, exposing the stacked strips to conditions sufficient to bond the plurality of strips together, and dicing the stacked strips into individual die shingle stack configurations.

Abstract: The present disclosure relates to liquid injection molding of a curable gasket composition to form mold-in-place gaskets. The curable gasket composition is prepared from at least an actinic radiation curable acrylic component and (meth)acrylate-functionalized silica.

Abstract: Natural oils, fats and other fatty acid triglycerides are transesterified with polyalcohols such as trimethylolpropane or glycerol to yield polyhydroxyl-functionalized reaction products which are useful materials in the formulation of two component laminating adhesives.

Abstract: A wearing compound slurry comprising an inorganic binder, ceramic particles, ceramic powder, diluent and optionally filler and discontinuous fibers. The slurry is applied to a wearable surface and exposed to heat to remove diluent and cure the wearing compound into a hard layer. The cured wearing compound layer remains intact after exposure to extremely high temperatures.

Abstract: Curable compositions, such as oxazine-based ones, are useful in applications within the aerospace industry, such as for example as a thermosetting resin composition for use as a matrix resin in processes, such as resin transfer molding, vacuum assisted transfer molding, resin film infusion, prepregging and towpregging, where the composites or laminates so prepared have superior surface finish and high fiber consolidation.