Patents Assigned to Henkel Corporation
  • Publication number: 20130025784
    Abstract: Aqueous polyurethane dispersions made from aromatic polyisocyanates and mixtures of aromatic polyisocyanates and compositions thereof are provided. Advantageously, the methods disclosed herein provide aqueous polyurethane dispersions which are produced more economically with no added organic solvent in the aqueous polyurethane dispersions. Such polyurethane dispersions are environmentally friendly and are useful as adhesives, sealants and coatings for laminating or bonding substrates such as paper, wood, metals, plastics and other synthetic materials.
    Type: Application
    Filed: October 1, 2012
    Publication date: January 31, 2013
    Applicant: Henkel Corporation
    Inventor: Henkel Corporation
  • Patent number: 8362112
    Abstract: The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants. The cure accelerators are constructed as urethane/urea/thiourethane (meth)acrylate resins from diols and include a unit embraced within structure A where X is C1-20 alkyl, C2-20 alkenyl, or C7-20 alkaryl, any of which may be interrupted by one or more hereto atoms, and which are functionalized by at least one and preferably at least two groups selected from —OH, —NH2 or —SH and z is 1-3.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: January 29, 2013
    Assignees: Henkel Ireland Limited, Henkel Corporation
    Inventors: David P. Birkett, Martin Wyer, Andrew Messana, David P. Dworak, Anthony F. Jacobine
  • Publication number: 20130023603
    Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.
    Type: Application
    Filed: September 21, 2012
    Publication date: January 24, 2013
    Applicants: Henkel AG & Co. KGaA, Henkel Corporation
    Inventors: Henkel Corporation, Henkel AG & Co. KGaA
  • Publication number: 20130020025
    Abstract: The present invention relates to moisture-curable silane-reactive hot melt compositions having an acrylate-urethane copolymer moiety. Desirably, the silane groups contain alkoxy functionality to enable and enhance moisture curing. Such compositions provide enhanced green strength without sacrificing other desirable properties.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 24, 2013
    Applicant: Henkel Corporation
    Inventors: Yingjie Li, Shuhui Qin
  • Publication number: 20130018122
    Abstract: Macro-photoinitiators having defined polymer chain structure are provided. The macro-photoinitiators are terminated with residues of thiol and/or hydroxyl functional photoinitiators. The macro-photoinitiators may be prepared by controlled radical polymerization methods, such as atom transfer radical polymerization and single electron transfer polymerization methods. Also provided are curable (e.g., photocurable) compositions that include the macro-photoinitiators of the present invention.
    Type: Application
    Filed: September 21, 2012
    Publication date: January 17, 2013
    Applicant: Henkel Corporation
    Inventor: Henkel Corporation
  • Patent number: 8353651
    Abstract: A dry-to-the-touch moisture curing composition useful as a sealant and adhesive which includes a reactive modified methylene diisocyanate polymer component having isocyanate functionality of about 8% to about 18% by weight of the polymer.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: January 15, 2013
    Assignee: Henkel Corporation
    Inventors: Susan Lamtruong Levandoski, Shabbir Attarwala, Alfred A. DeCato, Chris Ifeanyi Broderick
  • Publication number: 20130011999
    Abstract: A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 10, 2013
    Applicant: HENKEL CORPORATION
    Inventors: Hwang Kyu Yun, Jeffrey Leon, Raj Peddi, YounSang Kim
  • Publication number: 20130012653
    Abstract: A novel silicone-acrylic copolymer which comprises a covalently bonded silicone polymer with an acrylic polymer through the —Si—O—Si— linkage is described. The silicone-acrylic copolymer is a reaction product of (a) a silicone polymer, (bi) a mixture of acrylic monomers wherein at least one acrylic monomer comprises a silane (meth)acrylic monomer and/or a siloxane (meth)acrylic macromer with a radical initiator to form an acrylic prepolymer or (bii) an acrylic polymer which comprises a silane or a siloxane functional group; and (c) a scrambling catalyst, wherein the ratio of the silicone polymer (a) and the mixture of acrylic monomers (bi) or polymer (bii) is from 50:1 to 1:50. The silicone-acrylic copolymer is useful as an adhesive, sealant, coating, and the like.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 10, 2013
    Applicant: HENKEL CORPORATION
    Inventor: Yuxia Liu
  • Patent number: 8349988
    Abstract: Substrates, particularly low surface energy substrates, can be bonded using certain solvent-free liquid polyurethane adhesives. The adhesive cures through reaction with moisture and/or an active hydrogen-containing curing agent to form a tough, strong, thermoset polymer having excellent chemical and heat resistance. The adhesive is based on a polyurethane prepolymer obtained by reacting a stoichiometric excess of at least one polyfunctional isocyanate having a functionality of less than 2.2 with at least one polyether polyol and at least one polyester polyol containing isophthalic acid moieties but relatively few if any phthalic acid or terephthalic acid moieties.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: January 8, 2013
    Assignee: Henkel Corporation
    Inventors: Zhengzhe Song, Yingjie Li
  • Patent number: 8349123
    Abstract: The invention provides adhesive and sealant compositions prepared from urethane prepolymers. The urethane prepolymers are obtained by reacting the novel urethane diols, polyester polyols and polyether polyols with an excess of diisocyanate. The urethane diols are prepared by reacting excess low molecular weight diols and diisocyanates. The invention is particularly useful in end use applications such as panel lamination.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: January 8, 2013
    Assignee: Henkel Corporation
    Inventors: Yue S. Zhang, Louis A. Moore
  • Patent number: 8338536
    Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: December 25, 2012
    Assignee: Henkel Corporation
    Inventors: My Nguyen, Tadashi Takano, Puwei Liu
  • Publication number: 20120322926
    Abstract: The present invention relates to new improved adhesives for binding books and related articles and the production of such adhesives. In particular, the adhesives have reduced content of monomeric diisocyanates or no monomeric diisocyanate content.
    Type: Application
    Filed: June 22, 2012
    Publication date: December 20, 2012
    Applicant: Henkel Corporation
    Inventors: Wu Suen, Charles Paul
  • Patent number: 8333866
    Abstract: Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts are provided.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: December 18, 2012
    Assignee: Henkel Corporation
    Inventors: Jeremy Kostick, Loren Nauss, Alessandro Machado Jesus, Gary Patch, Gary Tremley, Kyle Zukauskas, Berryinne Decker
  • Patent number: 8324299
    Abstract: A moisture-curable hot-melt adhesive having an excellent balance of environmental friendliness, compatibility of ingredients, early-stage adhesive strength, heat resistance after moisture curing, tack free time, etc. and a method of manufacture for this hot-melt adhesive. A moisture-curable hot-melt adhesive which contains a urethane polymer that has a terminal isocyanate group and a moisture-curable hot-melt adhesive that contains urethane modified resin, has a residual percentage of isocyanate compound of 5 wt. % or less, and has a heat-resistant softening temperature after moisture curing of 60° C. or higher, has an excellent balance of the aforementioned. Urethane modified resin can be obtained by reacting a resin derivative that has a hydroxyl group with an isocyanate compound, and a moisture-curable hot-melt adhesive can be produced by mixing urethane-modified resin, polymer, and isocyanate compound.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: December 4, 2012
    Assignee: Henkel Corporation
    Inventors: Hideyuki Yamakoshi, Tsuyoshi Tamogami
  • Publication number: 20120292339
    Abstract: A portable gun provides for the dispensing of flowable adhesives. The gun accommodates a flowable adhesive contained in a collapsible container which adhesive is dispensed through an extending dispensing nozzle.
    Type: Application
    Filed: May 16, 2012
    Publication date: November 22, 2012
    Applicant: Henkel Corporation
    Inventor: Michael Terhardt
  • Patent number: 8313799
    Abstract: Adhesive compositions useful for bonding fluorescent material-containing cellulosic substrates such as envelopes may be formulated using an adhesive polymer such as an emulsion of polyvinyl acetate in water and one or more compounds capable of reducing the degree of fluorescence exhibited by the substrate in areas of the substrate surface having the adhesive coated thereon. When irradiated by short wavelength light, the surface areas containing the adhesive coating appear darker than the surface areas that are free of adhesive, allowing quality control problems associated with application of the adhesive to be readily monitored and corrected. At the same time, however, the adhesive may be formulated such that the fluorescence-reducing compound does not alter the appearance of the adhesive coating when viewed under normal daylight conditions.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: November 20, 2012
    Assignee: Henkel Corporation
    Inventors: Vincent A. Lauria, Jason Gillen, Ron McKinley
  • Publication number: 20120285999
    Abstract: The present invention relates to an anti-drip valve for precision dispensing fluid from a cartridge. The anti-drip valve includes a y-shaped anti-drip valve body and a poppet extending therethrough. The body and poppet create a seal within the anti-drip valve and control the flow of fluid from the valve to a dispense tip.
    Type: Application
    Filed: April 20, 2012
    Publication date: November 15, 2012
    Applicant: Henkel Corporation
    Inventors: John P. BREAULT, Andrew J. Bardon, Karl E. Gabrielson
  • Publication number: 20120279892
    Abstract: The invention provides packaging and shipping containers used to store and transport a wide variety of materials at substantially lower cost and with less waste.
    Type: Application
    Filed: July 20, 2012
    Publication date: November 8, 2012
    Applicant: Henkel Corporation
    Inventors: Michael Gefri, Kenneth Forlenza
  • Publication number: 20120283370
    Abstract: The present invention provides a method for producing a moisture-curable hot melt adhesive. This moisture-curable hot melt adhesive is environmentally friendly, is compatible with the components therein, has high initial adhesion strength, has long open time and has high heat resistance after moisture curing. The moisture-curable hot melt adhesive comprises a (A) urethane prepolymer having an isocyanate group at the terminus, comprising, a (A) urethane-modified rosin, and a (B) copolymer of ethylene and a (meth)acrylic acid derivative, wherein the urethane prepolymer is obtained by the reaction of polyol with an isocyanate compound.
    Type: Application
    Filed: May 30, 2012
    Publication date: November 8, 2012
    Applicant: Henkel Corporation
    Inventors: Tsuyoshi Tamogami, Yoshio Yoshida
  • Patent number: D674019
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: January 8, 2013
    Assignee: Henkel Corporation
    Inventors: Jeremy Kostick, Loren Nauss, Alessandro Machado Jesus, Gary Patch, Gary Tremley, Kyle Zukauskas