Patents Assigned to Henkel Corporation
  • PRE-CUT WAFER APPLIED UNDERFILL FILM
    Publication number: 20130210239
    Abstract: A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through-silica-vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer.
    Type: Application
    Filed: March 13, 2013
    Publication date: August 15, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Adhesive Composition and Use Thereof
    Publication number: 20130203900
    Abstract: The invention provides adhesives comprising at least one polymer component which contains at least 65 weight percent propylene, at least one nucleator and at least one functionalized wax. The inventive adhesives have increased heat resistance and decreased set-time, making them particularly well suited for assembly and packaging applications.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 8, 2013
    Applicants: HENKEL CORPORATION, HENKEL AG & CO. KGAA
    Inventors: HENKEL AG & CO. KGAA, HENKEL CORPORATION
  • LOW TEMPERATURE HOT MELT ADHESIVES FOR DISPOSABLE ARTICLES WITH HIGH CREEP RESISTANCE
    Publication number: 20130202787
    Abstract: The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 8, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • STRETCH FILM LAMINATION ADHESIVE
    Publication number: 20130202902
    Abstract: The invention provides stretch film laminant adhesives, methods of using the adhesives to bond substrates together, and to articles of manufacture comprising the adhesives. It has been discovered that a stretch film lamination adhesive, which comprises a metallocene catalyzed polyolefin copolymer with a density greater or equal to 0.870 g/cm3 and a peak melting point greater than 100° C., a plasticizer having a number average molecular weight greater than 1,000 g/mol, and a tackifier with a softening point greater than 110° C., has high creep resistance and low plasticizer migration and bleed-through making them particularly well suited for disposable personal care garments.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 8, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Wax replacement specialty formulated corrugating adhesive
    Patent number: 8501326
    Abstract: Adhesive compositions have properties that make them particularly well suited for recyclable corrugated boards for use in transporting and storing perishable foods such as fresh and frozen produce, seafood and meats together with ice, or under refrigeration.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: August 6, 2013
    Assignee: Henkel Corporation
    Inventors: Shawn E. DeJong, Michael Kircher
  • PRE-CUT WAFER APPLIED UNDERFILL FILM ON DICING TAPE
    Publication number: 20130196472
    Abstract: A method for preparing a semiconductor with preapplied underfill comprises (a) providing a thinned silicon semiconductor wafer having a plurality of metallic bumps on its active face and, optionally, through-silica-vias vertically through the silicon semiconductor wafer; (b) providing an underfill material on a dicing support tape, in which the underfill material is precut to the shape of the semiconductor wafer; (c) aligning the underfill material on the dicing support tape with the semiconductor wafer and laminating the underfill material to the semiconductor wafer.
    Type: Application
    Filed: March 13, 2013
    Publication date: August 1, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • SELF-ALIGNED GRAPHENE POLYMER NANOCOMPOSITES
    Publication number: 20130197158
    Abstract: Highly-oriented graphene polymer nanocomposites are produced from an aqueous dispersion of graphene oxide in polyurethane latex followed by chemical reduction to form graphene sheets.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 1, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES
    Publication number: 20130197130
    Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
    Type: Application
    Filed: March 13, 2013
    Publication date: August 1, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • ADHESIVE COMPOSITIONS
    Publication number: 20130189532
    Abstract: Moisture curable poly(acrylate) compositions having more environmentally acceptable catalysts and/or faster skin over time. The compositions demonstrate resistance to hydrocarbon fluids, such as transmission fluids, oils and fuels and are useful as gasketing materials.
    Type: Application
    Filed: March 12, 2013
    Publication date: July 25, 2013
    Applicants: Henkel AG & Co. KGaA, Henkel Corporation
    Inventors: Henkel Corporation, Henkel AG & Co. KGaA
  • SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS
    Publication number: 20130187102
    Abstract: A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.
    Type: Application
    Filed: March 13, 2013
    Publication date: July 25, 2013
    Applicants: HENKEL CORPORATION, HENKEL AG & CO. KGAA
    Inventors: HENKEL AG & CO. KGAA, HENKEL CORPORATION
  • Self adhering window flashing tape with multi-directional drainage plane
    Patent number: 8490338
    Abstract: The disclosure provides a self adhesive, flexible tape for flashing exterior wall openings. The tape is a composite comprising a barrier layer having an exterior surface and an interior surface and an adhesive layer overlying the interior surface. The barrier layer exterior surface is patterned to provide a gravity drainage path in both the tape machine direction (MD) and tape cross machine direction (CD).
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 23, 2013
    Assignee: Henkel Corporation
    Inventor: William Longo
  • ADHESIVE COMPOSITIONS AND USE THEREOF
    Publication number: 20130184384
    Abstract: The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. The adhesives find particular use as case, carton, and tray forming, and as sealing adhesives, including heat sealing applications, for example in the packaging of cereals, cracker and beer products.
    Type: Application
    Filed: March 5, 2013
    Publication date: July 18, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • Thermally decomposable polymer coated metal powders
    Patent number: 8486498
    Abstract: The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: July 16, 2013
    Assignees: Henkel Corporation, Henkel Ireland Limited
    Inventors: Puwei Liu, Matthew James Holloway, Blake Olsen
  • PHOTOCURABLE DICING DIE BONDING TAPE
    Publication number: 20130178585
    Abstract: A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
    Type: Application
    Filed: March 5, 2013
    Publication date: July 11, 2013
    Applicant: HENKEL CORPORATION
    Inventor: Henkel Corporation
  • Cure accelerators for anaerobic curable compositions
    Patent number: 8481659
    Abstract: The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: July 9, 2013
    Assignees: Henkel Corporation, Henkel Ireland Ltd.
    Inventors: David P. Birkett, Martin Wyer, Andrew Messana, Philip Klemarczyk, Anthony F. Jacobine
  • METHODS FOR MEASURING DEGREE OF CURE OR SOLDIFICATION OF A COMPOSITION
    Publication number: 20130171651
    Abstract: The present invention is directed to methods of measuring the degree of cure or solidification of a composition. Desirably, such methods are quantitative and ascertain the degree of cure or solidification in a non-destructive manner such that they are adaptable for on-line, real-time monitoring.
    Type: Application
    Filed: February 26, 2013
    Publication date: July 4, 2013
    Applicant: Henkel Corporation
    Inventor: Henkel Corporation
  • ONE COMPONENT EPOXY RESIN COMPOSITION
    Publication number: 20130165600
    Abstract: Problem to be solved of the invention is to provide a one component epoxy resin composition having a high curing property, wherein a cured resin thereof exhibits a physical strength equal to that in the case where a latent curing agent is predominantly used. Means for solving the problem is a one component epoxy resin composition comprising (a) 100 parts by weight of liquid epoxy resin; (b) suitable amounts for curing the liquid epoxy resin of a latent curing agent; and (c) not more than 30 parts by weight of liquid phenol resin.
    Type: Application
    Filed: February 26, 2013
    Publication date: June 27, 2013
    Applicant: Henkel Corporation
    Inventor: Henkel Corporation
  • ADHESIVE HAVING INSULATIVE PROPERTIES
    Publication number: 20130160945
    Abstract: An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plurality of expandable microspheres. Products having improved insulation capabilities and methods of making the products having improved insulation capabilities are also provided. The present adhesive and products including the adhesive is environmentally friendly.
    Type: Application
    Filed: February 25, 2013
    Publication date: June 27, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • LOW APPLICATION TEMPEARATURE AMORPHOUS POLY-a-OLEFIN ADHESIVE
    Publication number: 20130158176
    Abstract: It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105° C. and viscosity of less than about 1,900 cP at 190° C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.
    Type: Application
    Filed: February 20, 2013
    Publication date: June 20, 2013
    Applicant: HENKEL CORPORATION
    Inventor: HENKEL CORPORATION
  • HARDENER FOR EPOXY RESINS
    Publication number: 20130146223
    Abstract: The present application is directed to use of a thioether compound, obtainable from a first educt that comprises at least two thiol groups and from a second educt that comprises at least one ?,?-unsaturated amide group as well as at least one tertiary amine group, for the hardening of reactive resins.
    Type: Application
    Filed: February 1, 2013
    Publication date: June 13, 2013
    Applicants: Henkel Corporation, Henkel AG Co., KGaA
    Inventors: Henkel AG & Co. KGaA, Henkel Corporation