Abstract: The present invention relates to primer compositions for adhesive bonding systems. The primer compositions may be in the form of sprayable aqueous dispersions, which are shelf stable at ambient temperatures for up to three months under ambient temperature conditions, and demonstrate a cure profile of 45 to 120 minutes within the temperature range of 220° F. to 350° F. within 60 minutes of application. Significantly, the inventive primer compositions are substantially free of chromate.
Type:
Application
Filed:
July 8, 2005
Publication date:
June 17, 2010
Applicants:
Henkel KGaA, Henkel Corporation
Inventors:
Marcel Roth, Jurgen Foll, Sven Wucherpfennig, Thomas Huver, Ulrike Schmidt-Freytag, Angela Gand, Thomas W. Regulski
Abstract: The present invention provides one-component silicone compositions, particularly useful as sealants, having low modulus and high elongation, as well as good resistance to high temperatures and humidity, and methods for preparing these sealants. In particular, the present invention provides compositions including a chain-extended curable polyorganosiloxane, a high molecular weight silicone gum and a cure system. The compositions may be used, for example, in sealing the stitching of automotive airbags.
Abstract: A composition of matter in liquid form at a temperature of 50° C. or less comprising a monofunctional benzoxazine compound embraced by the structure where R is a member selected from C1-40 alkyl, C2-40 alkenyl, each of which being optionally substituted or interrupted by one or more O, N, S, C?O, COO, and NHC?O, and C6-20 aryl, m is 0-4, and R1-R5 are independently selected from C1-10 alkyl, C2-40 alkenyl, each of which being optionally substituted or interrupted by one or more O, N, S, C?O, COOH, and NHC?O, and C6-20 aryl, and at least one of R1-R5 are present, is provided.
Type:
Application
Filed:
December 18, 2009
Publication date:
June 10, 2010
Applicant:
Henkel Corporation
Inventors:
Qing Ji, Puwei Liu, My N. Nguyen, Michael Todd
Abstract: This invention relates to compositions useful as adhesives and more particularly to epoxy-based adhesive compositions with improved impact resistance.
Abstract: An anti-seize composition which is non-flowable and dimensionally stable at temperatures greater than about 120° F. and dispensable at room temperature without the application of heat is provided. The composition includes a solid anti-seize lubricant, such as of metallic copper, metallic nickel, metallic aluminum, metallic lead, metallic zinc, graphite, calcium oxide, calcium carbonate, calcium fluoride, calcium stearate, lithium, molybdenum disulfide, boron nitride, barium sulfate. or combinations thereof. The anti-seize lubricant is dispersed in a carrier which is a solid at about room temperature. The carrier includes a grease with an ASTM D 217 penetration at 25° C. from about 200 to about 400 mm, a matrix material, and a naphthenic petroleum oil having a viscosity of less than about 300 SUS at 100° F. and having an API gravity at 60° F. from about 23 to about 25. The matrix material is a polymeric material. Optionally, a refined petroleum wax may also be included.
Abstract: A sealed multi-compartment package includes a wipe and a mold release agent which are kept separate from one another until the time of use. The package includes a first compartment for containing a fabric-like wipe and a second compartment in sealed separation from the first compartment containing a mold release agent. The first and second compartments are in communication and separated by a displaceable seal. Upon displacement of the seal, the mold release agent and the wipe are brought into mutual contact.
Type:
Grant
Filed:
May 1, 2007
Date of Patent:
May 18, 2010
Assignee:
Henkel Corporation
Inventors:
Zheng Lu, Dennis L. Cardoza, Richard Varien
Abstract: A photoinitiated cationically curable composition is provided, including at least one substantially saturated epoxy component comprising at least two glycidyl ether groups; at least one acrylonitrile/butadiene copolymer; and at least one cationic photoinitiator. The compositions exhibit excellent strength properties as well as reduced color formation upon curing, particularly after post-curing thermal treatments. Methods of bonding substrates with such compositions and articles prepared therefrom are also provided through the invention.
Abstract: The invention relates to waterbome adhesive compositions that make them suited for use in bonding to fire retardant treated wood and wood composites. The waterborne adhesive comprises resin emulsion stabilized by dextrin and/or surfactant. The invention is also directed to a method for bonding fire retardant treated wood or wood composite substrate to a similarly treated or to a dissimilar substrate. The invention is further directed to articles manufactured using the adhesive composition of the invention. The manufactured fire retardant articles are well suited for use in public places where large number of people assemble, e.g. offices, schools, hospitals, and the like.
Abstract: Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin in advanced processes, such as resin transfer molding, vacuum assisted transfer molding and resin film infusion, and their use in such advanced processes form the basis of the present invention.
Type:
Grant
Filed:
August 5, 2004
Date of Patent:
May 4, 2010
Assignee:
Henkel Corporation
Inventors:
Stanley L. Lehmann, Wei Helen Li, Raymond S. Wong
Abstract: The present invention relates to new cure accelerators for anaerobic curable compositions. These anaerobic cure accelerators are generally sulfonimide derivatives and sulfonamide derivatives.
Abstract: The present invention relates to two-part, curable, (meth)acrylic adhesives containing naturally occurring fillers which inhibit free radical cure, such as wood flour, and oxygen scavenging components. Also provided are methods of preparing such adhesive compositions and methods of bonding substrates together with such adhesive compositions.
Type:
Application
Filed:
January 5, 2010
Publication date:
April 29, 2010
Applicant:
Henkel Corporation
Inventors:
Charles F. Schuft, Douglas E. Frost, David N. Mason, III
Abstract: The present invention relates to liquid stable thiol-acrylate and thiol-vinyl ether compositions. More particularly, in accordance with some embodiments, the compositions may include a (meth)acrylate, a thiol component, an organic acid stabilizer, and a curing initiator. In other embodiments, the compositions may include a curable component selected from a (meth)acrylate, vinyl ether and/or alkenyl ether, a reactive diluent having vinyl ether and acrylate functionality, a thiol component and a stabilizer selected from an organic acid, a hemiacetal ester derivative of an organic acid and/or a phenol acetal.
Type:
Application
Filed:
November 11, 2005
Publication date:
April 29, 2010
Applicant:
HENKEL CORPORATION
Inventors:
Eerik Maandi, Edwin Perez, John G. Woods, Joel D. Schall, Seamus Grant
Abstract: The present invention is directed to reaction products prepared from at least one Michael addition donor material including two or more active methylene hydrogens; and at least one material capable of reacting with a Michael addition donor, the material having one Michael addition acceptor and at least one functional group selected from the group consisting of hydroxy, hydroxyalkyl, vinyl ether, amino, aminoalkyl, carboxy, carboxyalkyl, cyano, and cyanoalkyl groups; or reaction products prepared from (a) at least one Michael addition donor material comprising at least one Michael Addition donor group selected from the group consisting of cyano functional groups and phosphono functional groups; and (b) at least one material capable of reacting with the at least one Michael addition donor group, the material having at least one Michael addition acceptor, wherein the above reaction products are capable of forming free radicals upon exposure to actinic radiation; as well as compositions, and processes for making
Type:
Grant
Filed:
July 23, 2007
Date of Patent:
April 27, 2010
Assignee:
Henkel Corporation
Inventors:
Anthony F. Jacobine, John G. Woods, Joel D. Schall, Steven T. Nakos, Andrew D. Messana, David M. Glaser
Abstract: A room temperature curable water-based mold release agent that is useful for demolding composite parts, such as epoxy and polyester based polymer materials. The mold release agent is curable at low temperatures, such as room temperature, but is thermally stable up to conventional epoxy based composite molding temperatures, e.g., greater than 200 or 280° C. The mold release agent is useful for demolding large composite parts that are cured in large ovens at high temperature when the molds themselves are prepped at room temperature before placing in the oven. The mold release agent is also useful for demolding polyester composite parts that are prepared and cured at low temperature such as room temperature.
Abstract: Room temperature curing structural adhesive compositions including polyurethane oligomers having multi-methacrylate functionality, cycloalkylmethacrylate, at least one maleimide-functionalized compound and a cure system are disclosed. These compositions exhibit enhanced high temperature properties, including hot strength, heat/humidity strength, and heat aging strength, without compromising initial tensile strength and fixture speeds and still possessing a room temperature cure.
Type:
Application
Filed:
December 8, 2009
Publication date:
April 8, 2010
Applicant:
Henkel Corporation
Inventors:
Susan Lamtroung Levandoski, Christopher J. Verosky, Brian M. Czabaj
Abstract: The present invention generally relates to a moisture curable composition in the form of a hot melt. The inventive compositions contain hydrolyzable silyl groups connected to a polymer which is capable of crosslinking when exposed to moisture.
Type:
Grant
Filed:
October 29, 2007
Date of Patent:
April 6, 2010
Assignee:
Henkel Corporation
Inventors:
Thomas Fay-Oy Lim, David Dworak, Jessica Fedorchick, Hsien-Kun Chu
Abstract: Adhesive compositions useful for laminating cellulosic substrates are formulated using an aqueous emulsion of a vinyl ester polymer such as polyvinyl acetate, one or more monomers or oligomers functionalized with (meth)acrylate groups, and a photoinitiator. The adhesive is cured by drying and exposing the adhesive to UV or visible light and is particularly useful for attaching clear films to cellulosic substrates such as paper and boxboard (e.g., in the manufacture of envelopes or folding cartons having windows).
Type:
Grant
Filed:
September 6, 2006
Date of Patent:
March 30, 2010
Assignee:
Henkel Corporation
Inventors:
Alexander P. Mgaya, Balasubramaniam Ramalingam