Abstract: The present invention provides curable poly(acrylate) compositions, cured reaction products of which demonstrate improved resistance to shrinkage when exposed to hydrocarbon fluids, such as transmission fluids and oil- and fuel-based fluids.

Abstract: The present invention provides curable poly(acrylate) compositions, cured reaction products of which demonstrate improved resistance to shrinkage when exposed to hydrocarbon fluids, such as transmission fluids and oil-and fuel-based fluids.

Abstract: This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (“snap cure underfills”), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55° C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.

Abstract: Provided is a complex of hydrogen peroxide and at least one compound represented by Formula I: wherein X is: —C(R3)3, —C?C(R3), —O(R3), —N(R3)2, or —S(R3); and R1, R2, and R3 are each independently selected from H, alkyl, alkenyl, alkynyl, aralkyl, aryl, heteroaryl heteroarylalkyl, heterocyclyl, and cycloalkyl, or R2 and an R3 are optionally taken together to form an alicyclic ring. Also provided are anaerobic cure systems and curable compositions employing the complexes described herein.

Abstract: This document provides components comprising a predetermined sealing surface and a curable composition thereon. The cured reaction product of the curable composition forms a seal having improved resistance to vapor permeation when exposed to hydrocarbon fluids and especially to hydrocarbon fluids comprising low molecular weight components, oxygenated compounds, polar compounds or blends containing polar and non-polar compounds such as alcohol and alcohol containing fuels.

Abstract: The present invention concerns improved polymerizable anaerobic compositions which contain (meth)acrylic ester monomers, peroxy polymerization initiators, saccharin a saccharin derivative or a related sulfimide derivative and an activator containing a ferrocene moiety.

Abstract: A moisture-curable hot-melt adhesive having an excellent balance of environmental friendliness, compatibility of ingredients, early-stage adhesive strength, heat resistance after moisture curing, tack free time, etc. and a method of manufacture for this hot-melt adhesive. A moisture-curable hot-melt adhesive which contains a urethane polymer that has a terminal isocyanate group and a moisture-curable hot-melt adhesive that contains urethane modified resin, has a residual percentage of isocyanate compound of 5 wt. % or less, and has a heat-resistant softening temperature after moisture curing of 60° C. or higher, has an excellent balance of the aforementioned. Urethane modified resin can be obtained by reacting a resin derivative that has a hydroxyl group with an isocyanate compound, and a moisture-curable hot-melt adhesive can be produced by mixing urethane-modified resin, polymer, and isocyanate compound.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer.

Abstract: The subject invention is a system for dispensing a controlled amount of fluid product from a dispensing container which includes a pneumatically driven dispensing actuator. This actuator includes a dispensing cylinder and a movable dispensing piston. The dispensing piston is movable under pneumatic pressure within the cylinder, the cylinder including a volume of hydraulic fluid under the pneumatic pressure acting against the dispensing piston to selectively prevent movement of the dispensing piston. The invention further includes a means for selectively reducing the volume of the hydraulic fluid in the dispensing cylinder to allow the controlled movement of the dispensing piston. The controlled movement of the dispensing piston causes controlled displacement of the fluid product from the dispensing container. Advantageously, with the subject invention, a force may be generated and applied to a plunger, which can be accurately controlled.

Abstract: The present invention relates to new cure accelerator systems for anaerobic curable compositions. These anaerobic cure systems include tetraalkyl ammonium oxidizing salts that are soluble in the (meth)acrylate component of the composition.

Abstract: The present invention relates to prepregs, towpregs and preforms made from curable compositions of (a) benzoxazines, (b) a combination of adducts a first of which is prepared from hydroxy-containing compounds, isocyanate-containing compounds and phenolic compounds and the second of which is prepared from the first adduct and epoxy-containing compounds, (c) components reactive with the benzoxazine, such as epoxy resins, episulfide resins and oxetane resins, (d) tougheners, such as polyether sulfones, ATBN and core shell materials and (e) a silica component, where the silica has a mean particle diameter on the order of 10?9 meters.

Abstract: The present invention is directed to photoinitiated cationic epoxy compositions including: (a) at least one substantially saturated epoxy material comprising at least two glycidyl ether groups; (b) about 0.1 to about 20 weight percent on a basis of total weight of the composition of at least one polymer comprising at least one vinyl chloride segment and at least one vinyl acetate segment; and (c) at least one cationic photoinitiator; and bonded substrates and methods of bonding including the same.

Abstract: A photo-curable resin composition for the UV-LED light source, which is rapidly cured and particularly has excellent surface curing property, is disclosed. The resin composition contains (a) polybutadiene (meth)acrylate; (b) a polythiol compound; and (c) a photo radical initiator and is photo-curable by an irradiation with an ultraviolet light-LED. Accordingly, production efficiency can be significantly increased in the production of liquid crystal displays and electrical and electronic components.

Abstract: The present invention relates to curable silicone compositions which include a fluorescent agent for detection purposes and which have a cure system which enables the silicone compositions to possess improved depth of cure. The silicone compositions are photocurable, and may also be moisture or heat curable.

Abstract: The disclosure provides a self adhesive, flexible tape for flashing exterior wall openings. The tape is a composite comprising a barrier layer having an exterior surface and an interior surface and an adhesive layer overlying the interior surface. The barrier layer exterior surface is patterned to provide a gravity drainage path in both the tape machine direction (MD) and tape cross machine direction (CD).

Abstract: The resistance of hollow microspheres towards shear and pressure may be enhanced by forming a non-tacky, solid, non-particulate outer coating comprised of a non-thermoset film-forming material on the outer surfaces of such microspheres.

Abstract: A dry-to-the-touch moisture curing composition useful as a sealant and adhesive which includes a reactive modified methylene diisocyanate polymer component having isocyanate functionality of about 8% to about 18% by weight of the polymer.

Abstract: Hollow polymeric microspheres may be rendered nonflammable by coating with one or more flame retardants, while maintaining a composite density of not greater than 0.05 g/cm3.

Abstract: The present invention provides one-component silicone compositions, particularly useful as sealants, having low modulus and high elongation, as well as good resistance to high temperatures and humidity, and methods for preparing these sealants. In particular, the present invention provides compositions including a chain-extended curable polyorganosiloxane, a high molecular weight silicone gum and a cure system. The compositions may be used, for example, in sealing the stitching of automotive airbags.