Patents Assigned to Henkel Corporation
  • Molding compositions
    Patent number: 7683138
    Abstract: A curable composition exhibiting excellent moldability without mold staining or delamination is provided, including an epoxy resin, a curing agent for the epoxy resin, and a polyphenylene oxide compound having a glass transition temperature between about 165° C. and about 190° C. The polyphenylene oxide compound may be provided as a melt blended mixture of two polyphenylene oxide compounds having distinct glass transition temperatures. The curable compositions may further include a bulk filler, and are therefore particularly useful as molding compounds encapsulation of electrical and/or electronic parts in transfer molding operations.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: March 23, 2010
    Assignee: Henkel Corporation
    Inventor: Charles S. Bischof
  • FLOWABLE NON-SAGGING ADHESIVE COMPOSITIONS
    Publication number: 20100065210
    Abstract: This invention provides an acrylic epoxy adhesive as a two part composition, wherein each part is of suitable viscosity for use in pumping apparatus, but after mixing, the composition increases in viscosity, so that it will not sag, drip, or migrate after application to a surface during the open time. This effect is achieved with a reactive acid component that gels on mixing with the epoxy portion of the composition. Also provided is a method of preparing the adhesive composition, and method of using the composition to form laminated materials.
    Type: Application
    Filed: November 2, 2007
    Publication date: March 18, 2010
    Applicant: HENKEL CORPORATION
    Inventors: Charles F. Schuft, James Murray
  • DRY-TO-THE-TOUCH ANAEROBICALLY CURABLE COMPOSITIONS AND PRODUCTS MADE THEREFROM
    Publication number: 20100061823
    Abstract: Dry-to-the-touch compositions containing a polymeric matrix and a anaerobically curable component present within the polymeric matrix are disclosed. In a particularly desirable form, the compositions are moisture curable. The compositions are non-flowable, at high temperatures, and have an improved solvent resistance once cured.
    Type: Application
    Filed: November 19, 2009
    Publication date: March 11, 2010
    Applicant: Henkel Corporation
    Inventors: Shabbir Attarwala, Ifeanyi C. Broderick, Qinyan Zhu, Roger J. Grismala
  • Curable foam elastomeric compositions
    Patent number: 7674838
    Abstract: A two-part curable foaming composition comprising: (A) A first part comprising: (i) an alkoxysilyl capped prepolymer; and (ii) a polyhydrogen siloxane; (iii) optionally a catalyst which accelerates both foaming and cross-linking through said alkoxysilyl groups; and (B) A second part comprising: (i) a nitrogen-containing compound having an active hydrogen; (ii) water; and (iii) optionally a catalyst which accelerates both foaming and cross-linking through said alkoxysilyl groups; provided that at least one of the parts contain a catalyst and wherein after mixing together the first and second parts a cured elastomeric foam is formed.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: March 9, 2010
    Assignee: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, James E. Lionberger, Steven T. Nakos
  • Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
    Patent number: 7671114
    Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: March 2, 2010
    Assignee: Henkel Corporation
    Inventors: John G. Woods, Yuhshi Lu, Bruce C. B. Chan, Philip T. Klemarczyk, Andrew D. Messana
  • Nanoparticle silica filled benzoxazine compositions
    Patent number: 7666938
    Abstract: Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an adhesive, and form the basis of the present invention.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: February 23, 2010
    Assignee: Henkel Corporation
    Inventors: Wei Helen Li, Stanley L. Lehmann, Raymond S. Wong
  • Deformable soft molding compositions
    Patent number: 7660427
    Abstract: A curable composition and method for producing a tear resistant, yet soft and deformable in-the-ear product yielding the user greater comfort and durability. The curable composition incorporated into a hearing aid apparatus provides a deformable, yet tear resistant housing, which may be mated to a soft tip component. The hearing aid housing provides better comfort, durability and acoustic performance for a variety of ear canal shapes. The curable composition that provides these properties includes at least one urethane acrylate oligomer, at least one reactive diluent and a cure system. The composition when cured desirably produces a tear strength of at least about 75 pli and a hardness of about Shore A 60 to about 75.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: February 9, 2010
    Assignee: Henkel Corporation
    Inventors: Alan Edward Litke, JoAnn DeMarco, Victor Karol Kadziela
  • ADHESIVE TAPE DISPENSER AND APPLICATOR
    Publication number: 20100018653
    Abstract: A one handed reusable tape dispenser and applicator comprises side walls, a top wall and a separate bottom wall which may be opened to allow loading of a roll of tape through an open front. Further, the tape dispenser is provided with tabs, a button and a pressing bar which present a leading length of tape in an arched condition across its width extending forwardly from the dispenser ready to be applied to a substrate; and an enlarged pressing surface allowing a user to easily dispense tape onto substrates such as wrapping paper.
    Type: Application
    Filed: July 25, 2008
    Publication date: January 28, 2010
    Applicant: HENKEL CORPORATION
    Inventors: Dan Dureiko, Michael J. Maczuzak, Brian A. Vulpitta, Migdalia McKenzie
  • Curable compositions
    Patent number: 7649037
    Abstract: Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an adhesive, and form the basis of the present invention.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: January 19, 2010
    Assignee: Henkel Corporation
    Inventors: Wei Helen Li, Stanley L. Lehmann, Raymond S. Wong
  • Curable compositions
    Patent number: 7649060
    Abstract: The present invention relates to curable compositions of benzoxazines, a combination of adducts one of which is prepared from hydroxy-containing compounds, isocyanate-containing compounds and phenolic compounds and the second of which is prepared from the first adduct and epoxy-containing compounds and phenolic compounds, epoxy resins and optionally tougheners.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: January 19, 2010
    Assignee: Henkel Corporation
    Inventors: Wei Helen Li, Stanley L. Lehmann, Raymond S. Wong
  • ANAEROBICALLY CURABLE COMPOSITIONS
    Publication number: 20100006208
    Abstract: Dry-to-the-touch compositions containing a curable polymeric matrix and a curable anaerobic composition present within the polymeric matrix are disclosed. In a particularly desirable form, the compositions are moisture curable. The compositions are non-flowable at high temperatures and have an improved solvent resistance once cured.
    Type: Application
    Filed: September 18, 2009
    Publication date: January 14, 2010
    Applicant: Henkel Corporation
    Inventors: Shabbir Attarwala, Ifeanyi C. Broderick, Qinyan Zhu
  • LOW RATIO RTV COMPOSITIONS AND METHODS FOR MAKING SAME
    Publication number: 20100006224
    Abstract: A two-part moisture-curing composition having as a first part water and an hydroxy-terminated diorganosiloxane; and a second part which includes a reactive silicone, at least one end-capping silane which includes one or more enoxy groups, at least one end-capping catalyst and at least one moisture cure catalyst. Enhanced and controlled cure speed is obtained by these compositions.
    Type: Application
    Filed: September 18, 2009
    Publication date: January 14, 2010
    Applicant: Henkel Corporation
    Inventors: Michael P. Levandoski, Jennifer Lynn Smith McCarthy
  • Methods for assembling thin semiconductor die
    Patent number: 7645637
    Abstract: The invention is based on the discovery that certain self-filleting die attach adhesives are useful in semiconductor die assemblies containing thin die. As used herein, the term “self-filleting” refers to any adhesive that when dispensed and then subjected to suitable cure conditions, will flow and fill up the area between two die or between a die and a substrate while not forming a bulky fillet that can overflow onto the top of the die. In addition, the invention is useful for tight tolerance semiconductor die assemblies, since the fillet from the die-attach adhesives employed in the methods of the invention does not cover bond fingers, thereby causing wire bond yield loss.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: January 12, 2010
    Assignee: Henkel Corporation
    Inventor: Deborah Forray
  • Vinyl compounds
    Patent number: 7645899
    Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: January 12, 2010
    Assignee: Henkel Corporation
    Inventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
  • NEXT GENERATION, HIGHLY TOUGHENED TWO PART STRUCTURAL EPOXY ADHESIVE COMPOSITIONS
    Publication number: 20090308534
    Abstract: This invention relates to two part, epoxy-based adhesive compositions with improved toughness suitable for structural applications.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 17, 2009
    Applicant: Henkel Corporation
    Inventor: Rick Malone
  • CYANOACRYLATE COMPOSITIONS CONTAINING DISPERSIONS OF CORE SHELL RUBBERS IN (METH)ACRYLATES
    Publication number: 20090298969
    Abstract: The present invention provides a cyanoacrylate composition comprising a cyanoacrylate component; and a core shell rubber component having a particle size in the range of 3 nm to 1,000 nm dispersed in a curable (meth)acrylate matrix.
    Type: Application
    Filed: June 18, 2009
    Publication date: December 3, 2009
    Applicant: Henkel Corporation
    Inventors: Shabbir Attarwala, Ling Li, John J. Cocco
  • (METH)ACRYLATES COMPOSITIONS CONTAINING DISPERSIONS OF CORE SHELL RUBBERS IN (METH)ACRYLATES
    Publication number: 20090298970
    Abstract: The present invention provides a (meth)acrylate composition comprising a (meth)acrylate component; and a core shell rubber component having a particle size in the range of 3 nm to 1,000 nm dispersed in a curable (meth)acrylate matrix.
    Type: Application
    Filed: June 18, 2009
    Publication date: December 3, 2009
    Applicant: Henkel Corporation
    Inventors: Shabbir Attarwala, Qinyan Zhu, John J. Cocco, Ifeanyi C. Broderick
  • Moisture curable silicone urea hot melt reinforced by organic polymers
    Patent number: 7625978
    Abstract: The present invention provides curable hot melt compositions including reactive polymers, which are reinforced by organic polymers to impart higher tensile strength and elongation to the compositions upon cure. In particular, the present invention provides curable hot melt compositions including a silicone urea based polymer and a reinforcement polymer. In some embodiments, the compositions cure upon exposure to moisture and/or radiation. The compositions may be used, for example, as sealants or adhesives.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: December 1, 2009
    Assignee: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, David P. Dworak, Mathias E. Liistro, Jr., Hsien-Kun Chu
  • Composition of epoxy and anhydride components, antioxidant and phosphor material
    Patent number: 7622516
    Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: November 24, 2009
    Assignee: Henkel Corporation
    Inventor: Dale Starkey
  • ACRYLIC-BASED ADHESIVES FOR POLYVINYLIDENE SURFACES
    Publication number: 20090286089
    Abstract: A process for improving adhesion to a surface that is at least partially coated with a fluorocarbon-containing coating, as well as a method for bonding surfaces that are at least partially coated with a fluorocarbon-containing coating, are disclosed. Moreover, compositions that may be used in the aforementioned process and method are disclosed. Additionally, articles and assemblies that include surfaces that are coated with a fluorocarbon-containing coating are disclosed.
    Type: Application
    Filed: June 4, 2007
    Publication date: November 19, 2009
    Applicant: Henkel Corporation
    Inventors: Alex Toback, Paul Chaplinsky, Charles Schuft, Ifeanyi Chris Broderick, James Murray, Douglas E. Frost