Patents Assigned to Henkel Corporation
  • CYANOACRYLATE COMPOSITIONS IN NON-FLOWABLE FORMS
    Publication number: 20110170939
    Abstract: The present invention relates to cyanoacrylate compositions in non-flowable and gel forms. More particularly, the present invention relates to non-flowable cyanoacrylate compositions which can be packaged in a convenient pocket-sized applicator dispenser for use in spreading the cyanoacrylate compositions onto substrates.
    Type: Application
    Filed: March 18, 2011
    Publication date: July 14, 2011
    Applicant: Henkel Corporation
    Inventor: Shabbir Attarwala
  • Method of preparing benzoxazines
    Patent number: 7973158
    Abstract: This invention relates to a novel synthesis for the preparation of benzoxazine components from phenolic components, aldehyde components, and amine components in a solvent other than toluene.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: July 5, 2011
    Assignees: Henkel Corporation, Henkel AG & Co. KGaA
    Inventors: Andreas J. Taden, Puwei Liu, Alex C. Wong, Eric A. Parker
  • Method Of Preparing A Mold Sealer, Mold Sealer Assembly And Compositions Thereof
    Publication number: 20110139959
    Abstract: Mold sealer compositions are provided that are effective for molding thermoplastic parts from metal mold surfaces, which when applied as a coating cures to a finish having a high durability permitting multiple releases.
    Type: Application
    Filed: February 21, 2011
    Publication date: June 16, 2011
    Applicant: Henkel Corporation
    Inventors: Zheng Lu, Joseph Schulz
  • Dual cure compositions employing free radical and RTV cure
    Patent number: 7960445
    Abstract: The present invention relates to dual curing compositions, which cure with moisture and photo radiation, such as UV light, and methods for preparing and using same. In particular, the compositions of the present invention contain a polyether or polyester backbone, photocurable portion(s) and moisture curable portion(s). The photo curable portion is a urethane or carbamate linkage terminated with a (meth)acryloxyalkyl group. The moisture curable portion is either: (1) a portion terminated with a polyalkoxysilyl group; or (2) a portion having a urea linkage terminated with an alkylpolyalkoxysilyl group.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: June 14, 2011
    Assignee: Henkel Corporation
    Inventors: Anthony F. Jacobine, John G. Woods, Steven T. Nakos, Thomas Fay-Oy Lim
  • CURABLE RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS FOR USE WITH LOW-K DIELECTRIC-CONTAINING SEMICONDUCTOR DEVICES
    Publication number: 20110133344
    Abstract: This invention relates to thermosetting resin compositions useful for flip chip (“FC”) underfill sealant materials, where a semiconductor chip is mounted directly onto a circuit through solder electrical interconnections. Similarly, the compositions are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate.
    Type: Application
    Filed: December 7, 2009
    Publication date: June 9, 2011
    Applicant: Henkel Corporation
    Inventors: My Nhu Nguyen, Puwei Liu
  • INJECTION MOLDING PROCESS, APPARATUS AND MATERIAL FOR FORMING CURED-IN-PLACE GASKETS
    Publication number: 20110133366
    Abstract: The present disclosure relates to liquid injection molding of gaskets. More particularly, the present disclosure relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding and to equipment useful with this process.
    Type: Application
    Filed: August 5, 2010
    Publication date: June 9, 2011
    Applicant: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, Robert P. Cross, Hsie-Kun Chu, Debora E. Duch, Mathias E. Liistro, JR., Alfred A. DeCato, Anthony R. Horelik, James E. Lionberger, Gregory A. Krueger
  • LOW TEMPERATURE CURING COMPOSITIONS
    Publication number: 20110133330
    Abstract: The present invention relates to thermosetting resin compositions that include maleimide-, nadimide- or itaconimide-containing compounds and a metal/carboxylate complex and a peroxide, which is curable at a low temperature at relative short period of time, such as less than about 100° C., for instance 55-70° C., over a period of time of about 30 to 90 minutes. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Application
    Filed: February 15, 2011
    Publication date: June 9, 2011
    Applicant: Henkel Corporation
    Inventors: Jie Bai, Shashi K. Gupta
  • Toughened two-part adhesive compositions demonstrating improved impact and/or peel strengths when cured
    Patent number: 7956143
    Abstract: Compositions for bonding substrate surfaces, particularly steel, aluminum, and urethane-primed galvanized steel, are disclosed. Desirably, the compositions include a stable emulsion including: (a) at least one curable (meth)acrylate component; (b) at least three different elastomeric polymers that are soluble and/or partially soluble in the (meth)acrylate component; and (c) optionally at least one elastomeric polymer that is not soluble in the (meth)acrylate component. Methods for preparing and methods for using these compositions also are disclosed.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: June 7, 2011
    Assignee: Henkel Corporation
    Inventors: Bo Xia, James Murray, Charles Schuft
  • UV and UV/moisture dual curable compositions with improved cure through volume
    Patent number: 7951867
    Abstract: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation, and optionally through exposure to moisture as well. The cured products demonstrate high resistance to flammability and combustibility.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: May 31, 2011
    Assignee: Henkel Corporation
    Inventor: Bahram Issari
  • MOISTURE CURABLE POLYAMIDES AND METHODS FOR USING THE SAME
    Publication number: 20110123817
    Abstract: The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.
    Type: Application
    Filed: November 20, 2009
    Publication date: May 26, 2011
    Applicant: HENKEL CORPORATION
    Inventors: Dwight Heinrich, Tina Nataniel
  • MOLD ASSEMBLY AND ATTENUATED LIGHT PROCESS FOR FABRICATING MOLDED PARTS
    Publication number: 20110115132
    Abstract: The present invention relates to a mold-in-place gasket forming assembly that includes a flange, a mold and an electromagnetic radiation filter for improved cycling. The present invention further relates to a mold-in-place gasketing process.
    Type: Application
    Filed: January 24, 2011
    Publication date: May 19, 2011
    Applicant: Henkel Corporation
    Inventors: Matthew Peter Burdzy, Robert P. Cross
  • Acoustic baffle assembly
    Patent number: 7913814
    Abstract: An acoustic baffle assembly for sealing or baffling a hollow body having a mass of heat activated expandable material that is capable of activating at a predetermined temperature. A substrate supports the mass. The substrate has a central portion and spaced apart projections extending outwardly from the central portion. The projections are configured to control expansion of the mass.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: March 29, 2011
    Assignee: Henkel Corporation
    Inventors: Gary R. Duffin, Benjamin Howard, Dan Jordan, Tanya Estrin, Michael Lupini
  • Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions
    Patent number: 7915319
    Abstract: The present invention provides visible light curing systems, methods for reducing health risks to individuals exposed to radiation curing systems, methods for bonding substrates and visible light curing compositions.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: March 29, 2011
    Assignee: Henkel Corporation
    Inventors: Mark M. Konarski, Edwin R. Perez, Eerik Maandi, Vic Kadziela, Steven J. Hemsen, Ronald E. Belek
  • COMPOSITIONS WITH IMPROVED SEALING CHARACTERISTICS FOR MOLD-IN-PLACE GASKETS
    Publication number: 20110068512
    Abstract: The present invention relates to compositions with improved sealing characteristics for mold-in-place gaskets, and a process for forming a mold-in-place gasket by liquid injection molding. More particularly, the present invention relates to a mold-in-place gasket composition incorporating (meth)acrylate-functionalized silica, plasticizers, or both, with improved modulus and sealing properties, and a process for forming such mold-in-place gasket.
    Type: Application
    Filed: November 24, 2010
    Publication date: March 24, 2011
    Applicant: Henkel Corporation
    Inventors: Alfred A. DeCato, James E. Lionberger
  • APPARATUS AND METHODS FOR CONTROLLED RADICAL POLYMERIZATION
    Publication number: 20110060157
    Abstract: A method of conducting controlled radical polymerization, including: (a) providing a mixture of at least one monomer; at least one monomer solvent; at least one compound metal coordinating capable; and at least one initiator; (b) directing the mixture at a rate over a solid catalyst surface contained in an external chamber to the vessel, the catalyst including a metal or metal compound capable of at least two oxidation states; (c) monitoring the reaction vessel temperature; (d) adjusting the flow rate when the temperature is outside a selected temperature range; and (e) allowing the polymerization to proceed to desired conversion level.
    Type: Application
    Filed: November 16, 2010
    Publication date: March 10, 2011
    Applicant: Henkel Corporation
    Inventors: David M. Glaser, Roderick Coffey, John G. Woods, Anthony F. Jacobine
  • HIGH PERFORMANCE ADHESIVES AND METHODS FOR THEIR USE
    Publication number: 20110056779
    Abstract: The present invention is directed to benzoxazine-containing adhesives having high adhesive strength at high temperature. These materials are especially useful in automotive applications, in particular, as adhesives for brake components. Methods of their use are also described.
    Type: Application
    Filed: November 12, 2010
    Publication date: March 10, 2011
    Applicants: Henkel Corporation, Henkel AG & Co. KGaA
    Inventors: John D. McGee, Stefan Kreiling, Stanley Leroy Lehmann, Andreas Taden
  • Fast curing mold release compositions and methods of preparing same
    Patent number: 7897701
    Abstract: A mold release composition comprising at least one siloxane polymer having functional terminal groups; at least one siloxane polymer having at least one functional pendent group; and a crosslinking agent. The mold release agent is ready to mold composite parts in less than 30 minutes under room temperature curing conditions.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: March 1, 2011
    Assignee: Henkel Corporation
    Inventors: Zheng Lu, Joseph Schulz
  • Curable coating compositions
    Patent number: 7887881
    Abstract: The present invention relates to curable coating compositions which when cured are substantially transparent and exhibit resistance to markings such as graffiti and scuffing and particulate buildup. In particular, the compositions of the present invention when cured provide protective coatings to surfaces to prevent absorption and/or wetting of ink compositions. The invention composition may also be used as mold release agents.
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: February 15, 2011
    Assignee: Henkel Corporation
    Inventor: Zheng Lu
  • LIQUID POLYURETHANE PREPOLYMERS USEFUL IN SOLVENT-FREE ADHESIVES
    Publication number: 20110014479
    Abstract: Substrates, particularly low surface energy substrates, can be bonded using certain solvent-free liquid polyurethane adhesives. The adhesive cures through reaction with moisture and/or an active hydrogen-containing curing agent to form a tough, strong, thermoset polymer having excellent chemical and heat resistance. The adhesive is based on a polyurethane prepolymer obtained by reacting a stoichiometric excess of at least one polyfunctional isocyanate having a functionality of less than 2.2 with at least one polyether polyol and at least one polyester polyol containing isophthalic acid moieties but relatively few if any phthalic acid or terephthalic acid moieties.
    Type: Application
    Filed: July 22, 2010
    Publication date: January 20, 2011
    Applicant: Henkel Corporation
    Inventors: Zhengzhe Song, Yingjie Li
  • ULTRAFAST HEAT/ROOM TEMPERATURE ADHESIVE COMPOSITION FOR BONDING APPLICATIONS
    Publication number: 20100331462
    Abstract: The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 30, 2010
    Applicant: Henkel Corporation
    Inventors: Susan L. Levandoski, Alan E. Litke, Teresa A. Love