Abstract: An optical module includes a circuit board, an internal optical fiber, a first light transceiver component, a second light transceiver component, and a protective cover. The internal optical fiber includes a first optical fiber strip and a second optical fiber strip. The protective cover includes a first protective sub-cover and a second protective sub-cover. The first protective sub-cover covers the first light transceiver component and includes a first body, two rods, and two limiting structures. The two limiting structures are disposed on the two rods and configured to limit the first optical fiber strip and the second optical fiber strip. The second protective sub-cover covers the second light transceiver component and is connected to the first protective sub-cover. The second protective sub-cover is located between the two rods.

Abstract: An optical module including: a first circuit board; a second circuit board; a light emitting component, arranged above the first circuit board and electrically connected to a first and a second flexible circuit board and a second flexible circuit board; a light receiving component arranged below the light emitting component and being electrically connected to a third flexible circuit board; the first flexible circuit, with two ends thereof being electrically connected to the light emitting component and a non-high-speed signal pad provided on the second circuit board, respectively; the second flexible circuit board, with two ends thereof being electrically connected to the light emitting component and a first high-speed signal pad provided on the first circuit board, respectively; the third flexible circuit board, with two ends thereof being electrically connected to the light receiving component and a second high-speed signal pad provided on the first circuit board, respectively.

Abstract: An optical module includes an upper shell, a lower shell, an optical engine, an optical port bracket, and an optical fiber adapter. The lower shell is covered with the upper shell and forms an accommodating cavity with the upper shell. The optical engine is disposed in the accommodating cavity. The optical port bracket is disposed on a bottom surface of the lower shell. The optical fiber adapter is connected to the optical engine and the optical port bracket. The upper shell includes first limiting members. The lower shell includes a first limiting boss. The optical port bracket includes a plurality of side walls and second limiting bosses, and two opposite side walls among the plurality of side walls are fixedly connected to the first limiting members. The second limiting bosses are disposed on two opposite side walls of the plurality of side walls.

Abstract: An optical module includes a light emitting assembly. The light emitting assembly includes a plurality of lasers, a plurality of wavelength division multiplexers and a lens group. The plurality of lasers emit a plurality of optical signals. The plurality of wavelength division multiplexers multiplex the plurality of optical signals into a plurality of composite optical signals. The lens group includes a first lens, a second lens, and a third lens. The second lens is configured to transmit a first part of the plurality of composite optical signals exited from the first lens, reflect a second part of the plurality of composite optical signals exited from the third lens to the first lens, and transmit the second part of the plurality of composite optical signals reflected by the first lens, so as to multiplex the plurality of composite optical signals into the merge composite optical signal.

Abstract: An optical module includes a housing, a circuit board, a package, and at least one of a light-emitting assembly or a light receiving assembly. The package includes a package body and a soldering member. The package body includes a cavity. An end of the circuit board is inserted into the cavity, and the soldering member is located in a gap between the circuit board and the package body. The light-emitting assembly or the light receiving assembly is located in the cavity and electrically connected to the circuit board. The light-emitting assembly is configured to convert an electrical signal from the circuit board into an optical signal and emit the optical signal to an outside of the optical module, and the light receiving assembly is configured to convert the optical signal from the outside of the light module into an electric signal and transmit the electric signal to the circuit board.

Abstract: An optical module includes a light receiving assembly and a first fiber optic adapter. The light receiving assembly includes a first lens group, a plurality of wavelength division demultiplexers and at least one light receiving component. The first lens group is configured to split optical signals transmitted to the first cavity body for a first time according to a wavelength to obtain a first optical signal beam and a second optical signal beam. The plurality of wavelength division demultiplexers include a first wavelength division demultiplexer and a second wavelength division demultiplexer. The first wavelength division demultiplexer is configured to split the first optical signal beam for a second time according to a wavelength. The second wavelength division demultiplexer is configured to split the second optical signal beam for a second time according to a wavelength. The light receiving component includes a plurality of light receiving chips.

Abstract: An optical module includes a circuit board and a light receiving assembly. The light receiving assembly is electrically connected to the circuit board and configured to receive optical signals from outside of the optical module. The light receiving assembly includes a light receiving cavity, an optical amplification assembly and a light receiving chip. The optical amplification assembly is disposed in the light receiving cavity and configured to amplify the optical signals. The optical amplification assembly includes a fourth substrate and a semiconductor optical amplifier (SOA). The fourth substrate is electrically connected to the circuit board, and the SOA is disposed on the fourth substrate and is electrically connected to the fourth substrate, The light receiving chip is disposed in the light receiving cavity and configured to receive the amplified optical signals.

Abstract: The present disclosure describes embodiments of a connector and an optical module, pertaining to the technical field of optoelectronic devices. The connector includes a substrate provided with a through-hole passing through the substrate from a first board surface to a second board surface thereof. The second board surface faces opposite from the first board surface. The first board surface is provided with a first groove and a second groove, and the first groove and the second groove respectively are configured to adapt to different optical fiber splices.

Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. The light emitting assembly includes a plurality of light-emitting chips and an optical multiplexer. The plurality of light-emitting chips are disposed on the first bottom plate. The optical multiplexer is disposed on the first cover and is located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer and a plurality of light-receiving chips. The optical demultiplexer is disposed on the first cover. The plurality of light-receiving chips are disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer.

Abstract: This application provides an optical module, and relates to the field of optical communication. An optical module provided in the embodiments of this application includes a laser box and a silicon photonic chip that are enclosed and packaged by an upper enclosure part and a lower enclosure part. The laser box is disposed on and is in contact with the surface of the silicon photonic chip by the side wall or the base. The laser chip is disposed on the top plane of the laser box. The top plane is in contact with the upper enclosure part for heat dissipation, so as to help heat generated by the laser chip be conducted to the upper enclosure part via the top plane, so that the heat generated by the laser chip is dissipated not via the silicon photonic chip.

Abstract: An optical module includes a circuit board, a substrate, a laser assembly, and a silicon photonic chip. The silicon photonic chip is electrically connected to the circuit board through the substrate so as to ground the silicon photonic chip. The substrate includes a body, a first support step, and a second support step. The first support step is disposed at an end of the body. The second support step is disposed at another end of the body. The circuit board includes a first metal layer and a second metal layer. The first metal layer is disposed on a surface of the circuit board proximate to the first support step and is electrically connected to the first support step. The second metal layer is disposed on a surface of the circuit board proximate to the second support step and is electrically connected to the second support step.

Abstract: An optical module includes: a casing; a printed circuit board (PCB) connected to a first side wall of the casing and configured to provide first electrical signals to an optical transmitter assembly; the optical transmitter assembly arranged in the casing and configured to convert the first electrical signals into first optical signals; an optical receiver adapter and an optical transmitter adapter arranged outside the casing and connected to a second side wall of the casing, wherein the optical transmitter adapter is configured to receive second optical signals; a first displacement prism arranged in the casing and configured to direct the second optical signals toward an optical receiver assembly; and the optical receiver assembly configured to convert the second optical signals into second electrical signals. At least one component of the optical receiver assembly is arranged in the casing.

Abstract: An optical module, including: a first laser and a first laser chip for driving the first laser; a second laser and a second laser chip for driving the second laser; and a multi-layer circuit board, including a surface layer, a reference layer, and an intermediate layer provided between the surface layer and the reference layer, where a first row of edge connector pins and a second row of edge connector pins are disposed in at least one surface layer; the first row of edge connector pins are disposed to be closer than the second row of edge connector pins to a side edge, of the multi-layer circuit board, that is provided with an edge connector; and a region, of the intermediate layer, that corresponds to a data signal line pin in the second row of edge connector pins is a hollow region.

Abstract: An optical module includes a shell, an elastic sleeve and a conductive fiber sheet. The shell has a groove disposed on an outer wall thereof. The elastic sleeve includes a metal frame and a plurality of metal elastic pieces. The metal frame is sleeved in the groove, and the metal frame is fixedly connected to the shell. The plurality of metal elastic pieces are disposed on an edge of the metal frame and extend to an outside of the metal frame. The conductive fiber sheet is disposed between the shell and the elastic sleeve for connecting the shell and the elastic sleeve.

Abstract: The present disclosure discloses an optical module including a circuit board and a light-emitting assembly. In the light-emitting assembly, a wavelength tuning mechanism is formed of a semiconductor optical amplification chip, a silicon optical chip and a semiconductor refrigerator. The semiconductor optical amplification chip may provide a plurality of wavelengths, and a wavelength selection is carried out by an optical filter in the silicon optical chip; a temperature adjustment for the optical filter is achieved by the semiconductor refrigerator, so as to further adjust a performance of the filter for wavelength selection. The above device is provided in a housing to facilitate packaging of the devices.

Abstract: An optical module includes a shell, a circuit board, a display light and a light guide pipe. The circuit board is disposed in the shell. The display light is disposed on the circuit board, and is configured to emit light of different colors. The light guide pipe is disposed between the shell and the circuit board. An input end of the light guide pipe is arranged to correspond to the display light, an output end of the light guide pipe is configured to transmit light emitted by the display light to an outside of the optical module. The shell includes a groove. The output end of the light guide pipe is fixed in the groove, so that the shell is fixed with the light guide pipe.

Abstract: A light emission assembly including: a substrate; at least two channels including: a driving assembly including a driving chip; an EML laser assembly including an EML laser chip; a first magnetic bead; a second magnetic bead; a DC blocking capacitor; a driving multiplexing pad for electrically connecting a first end of the first magnetic bead with a signal pad of the driving chip and a first end of the DC blocking capacitor, a second end of the first magnetic bead being connected to a first supply voltage; an EML multiplexing pad for electrically connecting a first end of the second magnetic bead with the EML laser chip assembly and a second end of the DC blocking capacitor, a second end of the second magnetic bead being connected to a supply voltage of the EML laser chip. The present disclosure also provides an optical module including the light emission assembly.

Abstract: The present disclosure discloses an optical module including: a circuit board; a housing assembly divided by a separation board into a first portion and a second portion that are stacked one above the other, wherein a light-emitting cavity is formed in the second portion, and a partition wall is provided in the first portion to separate the first portion into a light-receiving cavity and a slot, and is provided with a plurality of light-passing holes via which the light-receiving cavity is in communication with the slot; an optical fiber adapter disposed in the housing assembly and in communication with the light-receiving cavity; a light-emitting assembly arranged in the light emitting cavity and electrically connected to the circuit board, wherein heat generated by the light-emitting assembly is conducted to a surface of the housing assembly via the partition wall; and a light-receiving assembly.

Abstract: An optical module includes a circuit board and a light emitting assembly. The circuit board includes a first circuit board ground line, a second circuit board ground line and a circuit board signal line. The light emitting assembly is connected to the circuit board, and the light emitting assembly includes a spacer and a laser chip. The spacer includes a first spacer ground line, a second spacer ground line and a spacer signal line. The first spacer ground line is connected to the second spacer ground line through a fourth connection line; or the first spacer ground line is connected to the second circuit board ground line through a fifth connection line; or the second spacer ground line is connected to the first circuit board ground line through a sixth connection line; or the first circuit board ground line is connected to the second circuit board ground line through a seventh connection line.

Abstract: This application discloses an optical module. A circuit board is provided with a first heat dissipation member. One end of the first heat dissipation member is attached with an optical chip, with a lens assembly covering the optical chip. The other end extends outwardly from a coverage region of the lens assembly, so that heat generated by the optical chip is diffused to outside of the lens assembly. One end of the first heat dissipation member away from the lens assembly is provided with a second heat dissipation member whose upper surface being provided with a thermally conductive member. An upper surface of the thermally conductive member is thermally coupled with an upper enclosure. The second heat dissipation member conducts the heat diffused by the first heat dissipation member to the upper enclosure via the thermally conductive member. Thus, heat dissipation is achieved via the upper enclosure.