Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Abstract: An optical module includes a housing, a circuit board, a connecting finger and a reflector. The circuit board is provided inside the housing. The connecting finger is provided on the circuit board. The reflector is provided between the circuit board and the housing, and is located between the connecting finger and an optical port of the optical module. The reflector is configured to reflect electromagnetic waves radiated onto a surface of the reflector.

Abstract: The present disclosure provides an optical module comprising: a photoelectric conversion unit, a first demodulation circuit, and a second demodulation circuit; the first demodulation circuit and the second demodulation circuit are respectively connected to the photoelectric conversion unit; the photoelectric conversion unit is configured to convert the received optical signal into an electrical signal; the first demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a high-frequency electrical signal; the second demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a low-frequency electrical signal.

Abstract: The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.

Abstract: The present disclosure describes an optical module. The optical module includes a housing comprising a first portion, a second portion, and protrusions, and the protrusions are configured to enclose the first portion to isolate the first portion from the second portion. The optical module includes a circuit board disposed inside the housing, the circuit board comprising a first area, a second area, and a metal strip attaching to the protrusions. The optical module further includes an indicator light configured to emit light and a laser driving chip. The first area of the circuit board is electrically connected to the indicator light to supply power to the indicator light. The second area of the circuit board is electrically connected to the laser driving chip. The metal strip encloses the first area to isolate the first area from the second area.

Abstract: An optical module includes a circuit board and a receiver disposed on the circuit board. The circuit board includes a groove disposed in a surface of the circuit board. The groove is recessive along a height direction of the circuit board. The receiver includes an arrayed waveguide grating. The arrayed waveguide grating is configured to receive optical signal from an optical fiber. The arrayed waveguide grating is arranged above the groove and opposite to the groove.

Abstract: Some embodiments of the present application provide an optical module, including: a master control chip and a laser receiver; the laser receiver being connected to the master control chip; where the laser receiver includes: a PIN photodiode, a trans-impedance amplifier, a lens, and a shell; the PIN photodiode being electrically connected to the trans-impedance amplifier; and the lens being coated with an antireflection film; where the optical module further includes a bracket and a claw, where the laser receiver is fixed between a housing of the optical module and the bracket by the claw.

Abstract: Embodiments of the present disclosure relates to an optical module, including a bracket, and a handle and a plate both of which are connected to the bracket, where the plate is rotationally connected to the bracket, and a first end of the plate is provided with a buckle, and a second end of the plate abuts against a driving portion disposed on the handle, the driving portion is configured to: while the handle is moving along a length direction of the bracket, drive the second end of the plate that abuts against the driving portion to move, resulting in rotation of the buckle provided at the first end of the plate. On this basis, a lateral unlocking of the optical module is achieved along its length direction with a high unlocking reliability.

Abstract: An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.

Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.

Abstract: The present disclosure discloses an optical module, and relates to the field of optical fiber communication technologies. A first sealing piece is configured to block the gap between the optical fiber ribbon and the blocking piece. For the optical module and an optical communication terminal provided in the present application, an electromagnetic wave generated by the optical module is directly radiated or is reflected several times until the electromagnetic wave enters a wave-absorbing pad. The wave-absorbing pad absorbs to the greatest extent an electromagnetic wave generated by a chip, and can reduce to the greatest extent electromagnetic interference (EMI) generated by the optical module. By means of the present disclosure, the sealing performance of a housing of the optical module can be improved, so that an EMI shielding effect is improved, thereby effectively reducing EMI.

Abstract: The application discloses a method and apparatus for starting an optical module. The method includes: adjusting temperature of a laser device of the optical module to a first temperature higher than a normal operating temperature of the laser device of the optical module; powering up the laser device of the optical module using a first current lower than a normal operating current of the laser device; and adjusting the temperature of the laser device of the optical module from the first temperature to the normal operating temperature according to a second temperature corresponding to each adjustment, and adjusting the current of the laser device of the optical module from the first current to the normal operating current according to a second current corresponding to each adjustment, for a preset times of adjustment.

Abstract: Some embodiments of the present disclosure disclose a pluggable optical module, comprising a housing and an electromagnetic interference shielding clip clamped on the housing; a conductive member is provided between the housing and the electromagnetic interference shielding clip; and when the pluggable optical module is inserted into an optical module cage, the conductive member can block a gap between the housing and the electromagnetic interference shielding clip.

Abstract: This application discloses an optical module, including a circuit board, a lens assembly, a laser driver, and a limiting amplifier. Heat dissipation layers are disposed on the upper and lower surfaces of the circuit board. The laser driver and the limiting amplifier are mounted on the surface of the heat dissipation layer on the upper surface. Via holes are provided in projection regions of the laser driver and the limiting amplifier on the circuit board. Via holes penetrate the circuit board and are connected to the heat dissipation layers. Via holes are filled with a heat conductor, and the heat conductor is connected to the heat dissipation layers on the upper surface and the lower surface of the circuit board. The optical module disclosed in this application effectively dissipates heat generated by the laser driver and the limiting amplifier, thereby reducing the temperature in the optical module.

Abstract: The present disclosure provides an optical module comprising: a photoelectric conversion unit, a first demodulation circuit, and a second demodulation circuit; the first demodulation circuit and the second demodulation circuit are respectively connected to the photoelectric conversion unit; the photoelectric conversion unit is configured to convert the received optical signal into an electrical signal; the first demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a high-frequency electrical signal; the second demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a low-frequency electrical signal.

Abstract: The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.

Abstract: A light emitting device, an optical module and a manufacturing method thereof are disclosed. According to an example of the disclosure, the light emitting device may comprise an optical waveguide chip, a light emitting chip and a grating between the light emitting chip and the optical waveguide chip. The light emitting chip may emit laser light. The grating may couple the laser light emitted from the active layer into the optical waveguide chip in a way that the laser light is output along a length direction of the optical waveguide chip.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: The present disclosure provides an optical module, including: an optical sub-module and a first housing; where a first sub-surface of the optical sub-module is provided with a first boss, and the first housing is provided with a first opening corresponding to the first boss. The improved structure of the optical module can greatly increase heat conduction efficiency of the optical module.

Abstract: The present disclosure provides an optical module, including a circuit board, an optical chip and an optical chip driver. Where the circuit board includes a first layer provided with a first ground plane, a second layer provided with a second ground plane and a high-speed signal line between the first ground plane and the second ground plane. At least a part of the high-speed signal line is enclosed in a shielding cage which is formed by the first ground plane, the second ground plane and a plurality of metal vias connecting the first ground plane and the second ground plane in a way that the at least a part of the high-speed signal line is electromagnetic shielded by the shielding cage.