Patents Assigned to HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
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Patent number: 10912200Abstract: The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive contact sheet group positioned on the surface of the substrate, where a part of the substrate is overlaid with solder resist, and there is a gap between the solder resist and the electro-conductive contact sheet group.Type: GrantFiled: May 17, 2018Date of Patent: February 2, 2021Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corporation, Hisense International Co., Ltd.Inventors: Wei Zhao, Wei Cui, Lin Yu
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Patent number: 10877213Abstract: An optical module includes a circuit board and a receiver disposed on the circuit board. The circuit board includes a groove disposed in a surface of the circuit board. The groove is recessive along a height direction of the circuit board. The receiver includes an arrayed waveguide grating. The arrayed waveguide grating is configured to receive optical signal from an optical fiber. The arrayed waveguide grating is arranged above the groove and opposite to the groove.Type: GrantFiled: September 6, 2019Date of Patent: December 29, 2020Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Yifan Xie, Qinhao Fu, Weiwei Liu, Mengbo Fu
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Patent number: 10819084Abstract: The present disclosure provides a TO-CAN packaged laser and an optical module. According to an example, the TO-CAN packaged laser includes a base; a substrate located on the base, where the substrate is provided with a first conductive sheet and a second conductive sheet; a laser chip provided on the substrate, where an anode of the laser chip is electrically coupled with the first conductive sheet and a cathode of the laser chip is electrically coupled with the second conductive sheet; and a first pin and a second pin that protrude from the base, where the first pin is coupled with the first conductive sheet by conductive welding flux or conductive paste and the second pin is coupled with the second conductive sheet by conductive welding flux or conductive paste.Type: GrantFiled: May 31, 2018Date of Patent: October 27, 2020Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventor: Lingyan Zhang
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Patent number: 10795101Abstract: Embodiments of the present disclosure relates to an optical module, including a bracket, and a handle and a plate both of which are connected to the bracket, where the plate is rotationally connected to the bracket, and a first end of the plate is provided with a buckle, and a second end of the plate abuts against a driving portion disposed on the handle, the driving portion is configured to: while the handle is moving along a length direction of the bracket, drive the second end of the plate that abuts against the driving portion to move, resulting in rotation of the buckle provided at the first end of the plate. On this basis, a lateral unlocking of the optical module is achieved along its length direction with a high unlocking reliability.Type: GrantFiled: March 15, 2019Date of Patent: October 6, 2020Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.Inventors: Benzheng Dong, Jinlei Chen, Hongchao Pan
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Patent number: 10788631Abstract: This disclosure relate to power control of an optical module. In one implementation, an optical module is disclosed. The optical module comprises a first edge connector pin, a microcontroller unit (MCU), and a power supply control unit disposed on a circuit board, wherein the first edge connector pin is configured to receive a control signal sent by a main-unit device during power up of the optical module; the MCU is electrically connected to the first edge connector pin and the power supply control unit, and is configured to read the control signal using the first edge connector pin, and when the control signal is a first-type control signal, send a corresponding type indication information to the power supply control unit; and the power supply control unit is configured to receive the type indication information sent by the MCU, and stop, according to the type indication information, supplying power.Type: GrantFiled: December 29, 2017Date of Patent: September 29, 2020Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.Inventor: Long Zheng
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Patent number: 10788636Abstract: An optical module includes a base, an upper housing, an unlocker and a handle. The unlocker is rotatably connected to the base. The unlocker has a lock catch for locking the optical module. The handle is rotatably connected with the base by way of a first rotating portion. The unlocker is configured to be driven by the handle to rotate and cause the optical module to be in a locked state or an unlocked state. When the optical module is in the locked state, a first end of the handheld portion is further from a top surface of the upper housing than a second end of the handheld portion. A distance from the second end to a rotation axis of the first rotating portion is less than or equal to a distance from the first end to the rotation axis of the first rotating portion.Type: GrantFiled: September 10, 2019Date of Patent: September 29, 2020Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventor: Hongchao Pan
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Patent number: 10784968Abstract: The present disclosure describes an optical device, a system including an optical receiver, and a system including an optical module. The optical device includes an Avalanche Photodiode (APD), a circuit board, a boost circuit disposed on the circuit board, a processor disposed on the circuit board and configured to control an output voltage of the boost circuit, and a probe point disposed on the circuit board. The boost circuit includes a control terminal electrically connecting to the processor. The boost circuit also includes an output terminal electrically connecting to the APD and the probe point respectively.Type: GrantFiled: September 27, 2019Date of Patent: September 22, 2020Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Shixuan Qin, Rui Huang, Dengshan Xue, Ming Li
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Publication number: 20200295528Abstract: This application provides an optical module, and relates to the field of optical communication. An optical module provided in the embodiments of this application includes a laser box and a silicon photonic chip that are enclosed and packaged by an upper enclosure part and a lower enclosure part. The laser box is disposed on and is in contact with the surface of the silicon photonic chip by the side wall or the base. The laser chip is disposed on the top plane of the laser box. The top plane is in contact with the upper enclosure part for heat dissipation, so as to help heat generated by the laser chip be conducted to the upper enclosure part via the top plane, so that the heat generated by the laser chip is dissipated not via the silicon photonic chip.Type: ApplicationFiled: June 3, 2020Publication date: September 17, 2020Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Guangchao DU, Yongzheng TANG, Tao WU, Jianwei MU, Shaoshuai SUI, Jihong HAN, Sitao CHEN, Qian SHAO
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Publication number: 20200285004Abstract: The present application provides an optical module, including a laser, a laser driving chip, and a lens component disposed above the laser and the laser driving chip, where an inner cavity wall of the lens component that faces towards the laser and the laser driving chip is provided with a transmitting lens; a surface of the transmitting lens and the inner cavity wall around the transmitting lens are coated with a reflective film; and there is no reflective film coated on a part or entire of a region, of the inner cavity wall of the lens unit, which is irradiated by a secondarily reflected laser light.Type: ApplicationFiled: August 19, 2019Publication date: September 10, 2020Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Xuxia LIU, Shijian BEN
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Publication number: 20200278505Abstract: The present disclosure describes embodiments of a connector and an optical module, pertaining to the technical field of optoelectronic devices. The connector includes a substrate provided with a through-hole passing through the substrate from a first board surface to a second board surface thereof. The second board surface faces opposite from the first board surface. The first board surface is provided with a first groove and a second groove, and the first groove and the second groove respectively are configured to adapt to different optical fiber splices.Type: ApplicationFiled: May 21, 2020Publication date: September 3, 2020Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Jinlei CHEN, Yinlong LIU, Baofeng SI
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Patent number: 10761278Abstract: An optical subassembly and an optical module are provided. The optical subassembly includes an optical transmitter, an optical receiver, an optical splitter, and an optical fiber stub. The optical transmitter is configured to transmit light from the optical transmitter to the optical fiber stub through the optical splitter. The optical splitter is configured to reflect light from the optical fiber stub to the optical receiver. An optical axis of the optical receiver and an optical axis of the optical fiber stub form an acute angle. An optical axis of the optical transmitter and the optical axis of the optical fiber stub also form an acute angle.Type: GrantFiled: April 24, 2019Date of Patent: September 1, 2020Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Tao Jiang, Qifei Zheng, Haixiang Zhang
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Patent number: 10711979Abstract: An optical module comprising an upper portion of the housing with a bottom and two sides, a lower portion of the housing with a bottom and two sides, an electric component and an electroconductive sheet is provided. The two sides of the upper portion may be inserted between the two sides of the lower portion to form a relatively closed cavity for accommodating the electric component. A first convex block provided on the sides of the upper portion may be inserted into a gap which is formed between a second convex block and a third convex block provided on the sides of the lower portion. Thus, the first convex block, the second convex block and the third convex block may clamp the electroconductive sheet, thereby dividing the gap at the junction of the upper portion and the lower portion into a plurality of tiny gaps.Type: GrantFiled: March 5, 2018Date of Patent: July 14, 2020Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD.Inventors: Jinlei Chen, Yinlong Liu, Baofeng Si
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Publication number: 20200203922Abstract: The present disclosure provides a TO-CAN packaged laser and an optical module. According to an example, the TO-CAN packaged laser includes a base; a substrate located on the base, where the substrate is provided with a first conductive sheet and a second conductive sheet; a laser chip provided on the substrate, where an anode of the laser chip is electrically coupled with the first conductive sheet and a cathode of the laser chip is electrically coupled with the second conductive sheet; and a first pin and a second pin that protrude from the base, where the first pin is coupled with the first conductive sheet by conductive welding flux or conductive paste and the second pin is coupled with the second conductive sheet by conductive welding flux or conductive paste.Type: ApplicationFiled: May 31, 2018Publication date: June 25, 2020Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.Inventor: Lingyan ZHANG
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Publication number: 20200183108Abstract: The present disclosure provides an optical module comprising: a photoelectric conversion unit, a first demodulation circuit, and a second demodulation circuit; the first demodulation circuit and the second demodulation circuit are respectively connected to the photoelectric conversion unit; the photoelectric conversion unit is configured to convert the received optical signal into an electrical signal; the first demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a high-frequency electrical signal; the second demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a low-frequency electrical signal.Type: ApplicationFiled: February 18, 2020Publication date: June 11, 2020Applicants: Hisense Broadband Multimedia Technologies, Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.Inventors: Qiang ZHANG, Qisheng ZHAO
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Publication number: 20200183107Abstract: An optical module includes a housing, a circuit board, a connecting finger and a reflector. The circuit board is provided inside the housing. The connecting finger is provided on the circuit board. The reflector is provided between the circuit board and the housing, and is located between the connecting finger and an optical port of the optical module. The reflector is configured to reflect electromagnetic waves radiated onto a surface of the reflector.Type: ApplicationFiled: January 17, 2020Publication date: June 11, 2020Applicants: Hisense Broadband Multimedia Technologies Co., Ltd., HISENSE USA CORP., Hisense International Co., Ltd.Inventors: Wei Zhao, Xuxia Liu, Lin Yu
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Patent number: 10678003Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.Type: GrantFiled: August 31, 2018Date of Patent: June 9, 2020Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.Inventors: Xuxia Liu, Yongliang Huang, Qian Shao
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Patent number: 10680399Abstract: The disclosure provides an optical module, including a laser, the laser including a light emitting region and a modulation region, and light emitted by the light emitting region emitting toward the modulation region; a first driver circuit, the first driver circuit being connected to the light emitting region, so that the light emitting region emits light with adjusted optical power; and a second driver circuit, the second driver circuit being connected to the modulation region, so that the modulation region changes the optical power of the light emitted from the light emitting region.Type: GrantFiled: December 20, 2017Date of Patent: June 9, 2020Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Qiang Zhang, Qisheng Zhao, Shihai Yang
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Publication number: 20200145113Abstract: The present disclosure describes an optical device, a system including an optical receiver, and a system including an optical module. The optical device includes an Avalanche Photodiode (APD), a circuit board, a boost circuit disposed on the circuit board, a processor disposed on the circuit board and configured to control an output voltage of the boost circuit, and a probe point disposed on the circuit board. The boost circuit includes a control terminal electrically connecting to the processor. The boost circuit also includes an output terminal electrically connecting to the APD and the probe point respectively.Type: ApplicationFiled: September 27, 2019Publication date: May 7, 2020Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.Inventors: Shixuan QIN, Rui HUANG, Dengshan XUE, Ming LI
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Patent number: 10637577Abstract: An optical module includes a gold finger, a comparing unit and a voltage dividing unit. The gold finger includes a plurality of pins. A first pin of the plurality of pins is capable of being multiplexed. The comparing unit includes a first input, a second input and a first output. The first input is connected with the first pin. The second input is configured to receive a reference voltage. The first output is configured to output an output voltage. The voltage dividing unit includes a third input and a second output. The third input is configured to receive a voltage input. The second output is connected with the first pin and configured to regulate a voltage on the first pin, so that the first input of the comparing unit receives a regulated voltage. Voltages of different levels are output by the comparing unit based on a comparison result between an input voltage of the first input of the comparing unit and the reference voltage of the second input.Type: GrantFiled: July 3, 2019Date of Patent: April 28, 2020Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventor: Long Zheng
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Patent number: 10624203Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.Type: GrantFiled: July 6, 2018Date of Patent: April 14, 2020Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corporation, Hisense International Co., Ltd.Inventors: Sigeng Yang, Shijian Ben, Jingsheng Xia, Yongliang Huang