Abstract: Some embodiments of the present disclosure disclose an optical module. The optical module comprises a housing; a circuit board is provided inside the housing, and a connecting finger pluggable in an optical module cage is provided on the circuit board. At least one reflector, which is located between the connecting finger and an optical port of the optical module and can reflect electromagnetic waves radiated onto a surface of the reflector, is provided between the circuit board and the housing.

Abstract: The present disclosure provides an optical module, including a circuit board, an optical chip and an optical chip driver. Where the circuit board may include a first layer provided with a first ground plane, a second layer provided with a second ground plane and a high-speed signal line between the first ground plane and the second ground plane. at least a part of the high-speed signal line is enclosed in a shielding cage which is formed by the first ground plane, the second ground plane and a plurality of metal vias connecting the first ground plane and the second ground plane in a way that the at least a part of the high-speed signal line is electromagnetic shielded by the shielding cage.

Abstract: The disclosure provides an optical module. In the optical module, emitters of a first PNP type triode and a second PNP type triode connected with a power source are high-level always, when a bias pin of a laser transmitter driver chip is high-level, bases of the two PNP type triodes are both high-level and in an OFF state, no current flows to the bias pin and a laser transmitter, and the laser transmitter does not emit light; when the bias pin of the laser transmitter driver chip is low-level, the bases of the two PNP type triodes are both low-level and in an ON state, the current flows to the bias pin and flows from a positive terminal of the laser transmitter, and the laser transmitter emits light.

Abstract: The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive wirings and electro-conductive contact sheet group both laid on the surface of the substrate, where the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group.

Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.

Abstract: The disclosure provides an optical module, including a laser, the laser including a light emitting region and a modulation region, and light emitted by the light emitting region emitting toward the modulation region; a first driver circuit, the first driver circuit being connected to the light emitting region, so that the light emitting region emits light with adjusted optical power; and a second driver circuit, the second driver circuit being connected to the modulation region, so that the modulation region changes the optical power of the light emitted from the light emitting region.

Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Abstract: A coupler and a waveguide chip including the coupler are provided. The coupler connects a first optical waveguide to a second optical waveguide and includes an entity region and a first waveguide grating. A first end of the entity region is coupled to the first optical waveguide. A second end of the entity region is coupled to a second end of the first waveguide grating. A first end of the first waveguide grating is coupled to the second optical waveguide. Size of the first end of the entity region matches size of an end plane of the first optical waveguide, size of an end plane of the second end of the entity region matches size of an end plane of the second end of the first waveguide grating, and size of the first end of the first waveguide grating matches size of an end plane of the second waveguide.

Abstract: An optical module includes: a first thermoelectric cooler (TEC) disposed at least partially inside a laser, a second TEC is disposed on a housing of the laser, and a micro control unit (MCU). The first TEC is configured to perform heating or cooling according to an enabling signal input by aMCU. The second TEC is configured to perform heating or cooling according to an enabling signal input by the MCU. The MCU is configured to determine whether to input an enabling signal or a disabling signal to the first TEC and the second TEC according to a size of operating current input by a drive circuit of a laser chip to the laser chip.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: The present disclosure relates to the field of optical communication, particularly to an optical module. An optical module according to embodiments of the disclosure includes: a laser device including an emission region, and a modulation region to which light emitted by the emission region is transmitted; a bias circuit connected with the emission region, configured to drive the emission region to emit light at stable optical power; a modulation circuit connected with the modulation region, configured to drive the modulation region, so that the modulation region varies the optical power of the light emitted from the emission region; and a semiconductor optical amplifier configured to receive the light from the modulation region, and to vary the optical power of the light.

Abstract: A light emitting device, an optical module and a manufacturing method thereof are disclosed. According to an example of the disclosure, the light emitting device may comprise an optical waveguide chip, a light emitting chip and a grating between the light emitting chip and the optical waveguide chip. The light emitting chip may emit laser light. The grating may couple the laser light emitted from the active layer into the optical waveguide chip in a way that the laser light is output along a length direction of the optical waveguide chip.

Abstract: An Optical Line Termination (OLT) module and an OLT are disclosed. According to an embodiment of the OLT optical module, an optical signal receiver connects with a trans-impedance amplifier of which differential outputs connect with a limiting amplifier. An SD output of the limiting amplifier connects with a clock input of a D trigger and an input of a micro control unit. The D trigger connects with a control signal input of a first switch tube and may cause the first switch tube to be in conducting state when outputting high level. When the optical signal receiver detects an uplink burst signal, the limiting amplifier may generate the SD signal, the D trigger may output high level according to the SD signal and the first switch tube will be in conducting state, so that the micro control unit may detect the received optical power of the uplink burst signal.

Abstract: Disclosed is a method for controlling an embedded system and a device with an embedded system, the method including: transmitting, by a scheduling process of the embedded system, a standby instruction to a master process of the embedded system; releasing, by the master process, occupied hardware resource and exiting upon reception of the standby instruction; starting, by the scheduling process, a standby process of the embedded system after the master process exits; and controlling, by the standby process, the embedded system to enter a standby state.

Abstract: The disclosure provides an optical module, including a laser, the laser including a light emitting region and a modulation region, and light emitted by the light emitting region emitting toward the modulation region; a first driver circuit, the first driver circuit being connected to the light emitting region, so that the light emitting region emits light with adjusted optical power; and a second driver circuit, the second driver circuit being connected to the modulation region, so that the modulation region changes the optical power of the light emitted from the light emitting region.

Abstract: An optical module includes: a first thermoelectric cooler (TEC) disposed at least partially inside a laser, a second TEC is disposed on a housing of the laser, and a micro control unit (MCU). The first TEC is configured to perform heating or cooling according to an enabling signal input by a MCU. The second TEC is configured to perform heating or cooling according to an enabling signal input by the MCU. The MCU is configured to determine whether to input an enabling signal or a disabling signal to the first TEC and the second TEC according to a size of operating current input by a drive circuit of a laser chip to the laser chip.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: An optical module is disclosed. According to one implementation, the optical module comprises an optical receiver, a diode, a first resistor, a first capacitor, a comparator, and a control chip. The diode anode connects electrically with a triggering signal output end of the optical receiving module, the cathode of the diode connects with one end of the first capacitor and one input end of the comparator. Another end of the first capacitor connects with the ground; the first resistor is connected in parallel with both ends of the first capacitor. A pre-set reference voltage is connected with another input end of the comparator. The optical receiver generates a first triggering signal in response to a burst mode optical signal. After inputting the first triggering signal into the diode anode, the comparator outputs a second triggering signal from the output end, triggering the control chip to generate a reset signal input into the optical receiver.

Abstract: An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.

Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.