Patents Assigned to HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
  • Patent number: 9843158
    Abstract: The present application provides an optical module comprising: a golden finger, a MAC chip, a switch circuit, a laser driver, and a laser. A first output terminal of the MAC chip is connected to a first input terminal of the laser driver for inputting burst controlling signal thereto; a second output terminal of the MAC chip is connected to a first input terminal of the switch circuit for inputting cut-off controlling signal thereto; a cut-off controlling pin of the golden finger is connected to a second input terminal of the switch circuit for inputting cut-off controlling signal thereto; and an output terminal of the switch circuit is connected to a second input terminal of the laser driver. The switch circuit is used to connect the first or the second input terminal of the switch circuit with the output terminal. The cut-off controlling signal controls the switch-off of the laser.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: December 12, 2017
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD.
    Inventors: Li Wang, Long Zheng, Hua Zhang
  • Patent number: 9829637
    Abstract: Embodiments of the present disclosure provide a multiplexer, and relate to the field of fiber communications technologies. The multiplexer according to the embodiments of the present disclosure includes a first light beam adjusting element, a second light beam adjusting element, a first light filtering and combining element or splitting element, a second light filtering and combining element or splitting element, a polarization changing element, and a light polarizing and combining element. The optical multiplexer according to the embodiments of the present disclosure may not only implement combining at least four light beams into one light beam but also reduce the number of reflection times of light during a light combination process.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: November 28, 2017
    Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventor: Sixiang Chen
  • Publication number: 20170337153
    Abstract: An optical module and a method of transmitting data in the optical module are provided in the present disclosure. According to an example, the optical module may comprise a micro controller unit (MCU) and N number of first driving chips having a same chip address. The MCU may be configured with a serial data (SDA) bus interface and N number of first serial clock (SCL) bus interfaces. Each of the N number of first driving chips may be configured with a SDA bus interface which is configured to be connected with the SDA bus interface on the MCU and a SCL bus interface which is configured to be connected with one of the N number of first SCL bus interfaces on the MCU.
    Type: Application
    Filed: December 27, 2016
    Publication date: November 23, 2017
    Applicants: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies. Ltd.
    Inventors: Fengmei Fan, Fubin LI
  • Publication number: 20170338896
    Abstract: An optical module and an optical line terminal device are disclosed. According to an example, the optical line terminal device comprises a system board and an optical module. The system board comprises an optical module control circuit comprising a main control chip and a drive circuit. The optical module comprises a circuit board provided with an electrical interface, an optical assembly and a memory unit. The memory unit is configured to store an operation parameter of the optical assembly. The electrical interface has a first pin to be connected with a drive end of the optical assembly and a second pin to be connected with a data transmission pin of the memory unit. In this way, main control chip is allowed to read the operation parameter of the optical assembly through the first pin and configure the drive circuit accordingly, while the drive circuit is allowed to drive the optical assembly through the second pin.
    Type: Application
    Filed: December 28, 2016
    Publication date: November 23, 2017
    Applicants: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventors: Qiang Zhang, Qisheng Zhao
  • Patent number: 9817198
    Abstract: The present disclosure provides an optical module. The optical module of the present disclosure may include: a base, the base being provided with a fixing part configured to place a lens; the lens located in the fixing part; and a laser, located on the base, the laser being configured to transmit an optical signal to the lens, where fixing adhesive is filled symmetrically in gaps between two symmetric sides of the lens and the fixing part.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: November 14, 2017
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventors: Shiquan Yang, Xianpeng Du, Hao Wang, Hongwei Mu, Fang Liu
  • Publication number: 20170307838
    Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.
    Type: Application
    Filed: September 9, 2015
    Publication date: October 26, 2017
    Applicants: Hisense Broadband MultiMedia Technologies Co., Ltd, Hisense USA Corp., Hisense International Co., Ltd.
    Inventors: Hao WANG, Hongwei MU, YongLiang HUANG, Shun ZHANG
  • Patent number: 9746625
    Abstract: The embodiments of the present disclosure disclose an optical module, comprising a housing, an adaptor and an optical sub-module being provided inside the housing, the adaptor being fixed with the optical sub-module, wherein an optical port component is also provided inside the housing, the optical port component is located at one side of the adaptor far away from the optical sub-module, and an opening is formed at one end of the optical port component far away from the adaptor; a through hole for the optical port component is formed on an end surface of the optical port component close to the adaptor, the adaptor can pass through the through hole for the optical port component to be fixed with the optical port component, and an optical fiber can be inserted into the adaptor from the opening.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: August 29, 2017
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA, CORP., HISENSE INTERNATIONAL CO., LTD.
    Inventors: Wei Zhao, Wei Cui, Hongchao Pan, Yinlong Liu, Lin Yu
  • Publication number: 20170219775
    Abstract: Embodiments of the present disclosure provide a multiplexer, and relate to the field of fiber communications technologies. The multiplexer according to the embodiments of the present disclosure includes a first light beam adjusting element, a second light beam adjusting element, a first light filtering and combining element or splitting element, a second light filtering and combining element or splitting element, a polarization changing element, and a light polarizing and combining element. The optical multiplexer according to the embodiments of the present disclosure may not only implement combining at least four light beams into one light beam but also reduce the number of reflection times of light during a light combination process.
    Type: Application
    Filed: March 30, 2017
    Publication date: August 3, 2017
    Applicant: Hisense Broadband MultiMedia Technologies Co., Ltd .
    Inventor: Sixiang Chen
  • Publication number: 20170192178
    Abstract: A coupler and a waveguide chip including the coupler are provided. The coupler connects a first optical waveguide to a second optical waveguide and includes an entity region and a first waveguide grating. A first end of the entity region is coupled to the first optical waveguide. A second end of the entity region is coupled to a second end of the first waveguide grating. A first end of the first waveguide grating is coupled to the second optical waveguide. Size of the first end of the entity region matches size of an end plane of the first optical waveguide, size of an end plane of the second end of the entity region matches size of an end plane of the second end of the first waveguide grating, and size of the first end of the first waveguide grating matches size of an end plane of the second waveguide.
    Type: Application
    Filed: March 23, 2017
    Publication date: July 6, 2017
    Applicants: Hisense Broadband MultiMedia Technologies Co., Ltd ., Hisense USA Corp., Hisense International Co., Ltd.
    Inventor: Hua ZHANG
  • Patent number: 9684140
    Abstract: An optical device and an optic transceiver device are provided. The optical device includes a light splitting surface. The optical device further includes a first surface and a second surface disposed opposite to each other and parallel to each other. The light splitting surface separately intersects the first surface and the second surface. An angle between the light splitting surface and the first surface is not equal to 90 degrees. A medium between the light splitting surface and the first surface and a medium between the light splitting surface and the second surface are the same. The medium is formed by a light transmissive material.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: June 20, 2017
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corp., Hisense International Co., Ltd.
    Inventor: Haixiang Zhang
  • Patent number: 9645320
    Abstract: A coupler and a waveguide chip including the coupler are provided. The coupler connects a first optical waveguide to a second optical waveguide and includes an entity region and a first waveguide grating. A first end of the entity region is coupled to the first optical waveguide. A second end of the entity region is coupled to a second end of the first waveguide grating. A first end of the first waveguide grating is coupled to the second optical waveguide. Size of the first end of the entity region matches size of an end plane of the first optical waveguide, size of an end plane of the second end of the entity region matches size of an end plane of the second end of the first waveguide grating, and size of the first end of the first waveguide grating matches size of an end plane of the second waveguide.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 9, 2017
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORP., HISENSE INTERNATIONAL CO., LTD.
    Inventor: Hua Zhang
  • Patent number: 9645315
    Abstract: Embodiments of the present disclosure provide a multiplexer, and relate to the field of fiber communications technologies. The multiplexer according to the embodiments of the present disclosure includes a first light beam adjusting element, a second light beam adjusting element, a first light filtering and combining element, a second light filtering and combining element, a polarization changing element, and a light polarizing and combining element. The optical multiplexer according to the embodiments of the present disclosure may not only implement combining at least four light beams into one light beam but also reduce the number of reflection times of light during a light combination process.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: May 9, 2017
    Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventor: Sixiang Chen
  • Patent number: 9644818
    Abstract: The invention discloses an optical device and an optical module, the optical device includes a collimation lens arranged on an outer surface for converting incident light from a light source to parallel light, further includes a transmission light total reflection surface for totally reflecting a part of the parallel light at a first angle so that the part of the parallel light is finally coupled to an external optical fiber, a detection light total reflection surface for totally reflecting a part of the parallel light at a second angle so that the part of the parallel light is finally coupled to an external optical detector, and at least one attenuation light reflection surface for totally reflecting parallel light to be attenuated at a third angle before the parallel light leaves the optical device. The invention achieves the light intensity attenuation while realizing the direction-changing transmission of light signals.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: May 9, 2017
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION
    Inventors: Yungliang Huang, Yicheng Liu, Wenkai Tu
  • Patent number: 9615130
    Abstract: The disclosure discloses a method and device for processing a multimedia frame and a storage medium. The method includes: judging whether there is a multimedia frame in a buffer queue with a sudden change to a time difference thereof; and playing asynchronously M multimedia frames to be processed in a current processing cycle if there is a multimedia frame in the buffer queue with a sudden change to the time difference thereof, and playing synchronously the M multimedia frames to be processed in the current processing cycle if there is no multimedia frame in the buffer queue with a sudden change to the time difference thereof and the time differences of the M multimedia frames to be processed are below a preset threshold.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: April 4, 2017
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventor: Xiongcai Wang
  • Patent number: 9608402
    Abstract: The present disclosure provides a packaging structure and a method of packaging an tunable laser device, and an tunable laser device. The packaging structure of the tunable laser device may include a TO tube base and a TO tube cap, wherein a first thermal sink is disposed on the TO tube base, a semiconductor laser chip is disposed on a vertical side of the first thermal sink, an aspheric lens is disposed on the TO tube cap, and the semiconductor laser chip is disposed on a central axis of the aspheric lens; and wherein the vertical side of the first thermal sink is a side of the first thermal sink perpendicular to the TO tube base. The tunable laser device according to the present disclosure may be applicable to communication over an optical fiber.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: March 28, 2017
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventor: Zhenqiu Gao
  • Publication number: 20170068059
    Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.
    Type: Application
    Filed: September 9, 2015
    Publication date: March 9, 2017
    Applicants: Hisense Broadband MultiMedia Technologies Co., Ltd, Hisense USA Corp., Hisense International Co., Ltd.
    Inventors: Hao WANG, Hongwei MU, YongLiang HUANG, Shun ZHANG
  • Patent number: 9515738
    Abstract: The embodiments of this disclosure provide an optical module, which expands the network bandwidth, eases a problem on dynamic bandwidth allocation. The optical module comprises an optical transceiver assembly and a control circuit, wherein the optical transceiver assembly comprises a first optical emitter and a second optical emitter; the control circuit is configured to control the first optical emitter to generate an optical signal of a first waveband, and the first optical emitter is configured to emit the optical signal of the first waveband to a transmission optical fiber; or, the control circuit is configured to control the second optical emitter to generate an optical signal of a second waveband, and the second optical emitter is configured to emit the optical signal of the second waveband to the transmission optical fiber. This disclosure is applied to an optical module of a wavelength division multiplex passive optical network.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: December 6, 2016
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION
    Inventors: Sigeng Yang, Qisheng Zhao, Ming Li, Lei Lu, Dengshan Xue, Shijian Ben, Hongping Yan
  • Publication number: 20160291254
    Abstract: A coupler and a waveguide chip including the coupler are provided. The coupler connects a first optical waveguide to a second optical waveguide and includes an entity region and a first waveguide grating. A first end of the entity region is coupled to the first optical waveguide. A second end of the entity region is coupled to a second end of the first waveguide grating. A first end of the first waveguide grating is coupled to the second optical waveguide. Size of the first end of the entity region matches size of an end plane of the first optical waveguide, size of an end plane of the second end of the entity region matches size of an end plane of the second end of the first waveguide grating, and size of the first end of the first waveguide grating matches size of an end plane of the second waveguide.
    Type: Application
    Filed: December 28, 2015
    Publication date: October 6, 2016
    Applicants: Hisense Broadband MultiMedia Technologies Co., Ltd., Hisense USA Corp., Hisense International Co., Ltd.
    Inventor: Hua ZHANG
  • Publication number: 20160294156
    Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.
    Type: Application
    Filed: November 18, 2015
    Publication date: October 6, 2016
    Applicants: Hisense Broadband MultiMedia Technologies Co., Ltd., Hisense USA Corp., Hisense International Co., Ltd.
    Inventors: Hao WANG, Hongwei MU, YungLiang HUANG, Shun ZHANG
  • Publication number: 20160285224
    Abstract: An optical module includes: a first thermoelectric cooler (TEC) disposed at least partially inside a laser, a second TEC is disposed on a housing of the laser, and a micro control unit (MCU). The first TEC is configured to perform heating or cooling according to an enabling signal input by aMCU. The second TEC is configured to perform heating or cooling according to an enabling signal input by the MCU. The MCU is configured to determine whether to input an enabling signal or a disabling signal to the first TEC and the second TEC according to a size of operating current input by a drive circuit of a laser chip to the laser chip.
    Type: Application
    Filed: October 19, 2015
    Publication date: September 29, 2016
    Applicants: Hisense Broadband MultiMedia Technologies Co., Ltd., Hisense USA Corp., Hisense International Co., Ltd.
    Inventors: Qiang ZHANG, Qisheng ZHAO, Chenghao JIN