Patents Assigned to IMEC
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Patent number: 12267805Abstract: Example embodiments relate to methods for estimating a location of at least one mobile network node and respective network. An example method for estimating a location of at least one mobile network node of a wireless communication network including the at least one mobile network node and at least two static network nodes includes performing initial range measurements between the at least two static network nodes in a pairwise manner. The method also includes determining an initial location estimate. Additionally, the method includes determining an estimate for corresponding noise samples. Further, the method includes estimating corresponding initial parameters of a Gaussian mixture noise model. In addition, the method includes determining a weighted sum of respective refined parameters of the Gaussian mixture noise model and the corresponding initial parameters of the Gaussian mixture noise model.Type: GrantFiled: July 20, 2022Date of Patent: April 1, 2025Assignee: Stichting IMEC NederlandInventors: Alireza Sheikh, Jac Romme
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Patent number: 12261045Abstract: According to an aspect there is provided a patterning method comprising: over a lower pattern memorization layer, forming a pattern of first upper blocks, then an upper pattern memorization layer and then a pattern of second upper blocks; thereafter patterning upper trenches in the upper pattern memorization layer using lithography and etching, and forming spacer lines along sidewalls of the upper trenches to define spacer-provided upper trenches, at least a subset being interrupted by a respective first upper block; patterning first lower trenches in the lower pattern memorization layer by etching the spacer-provided upper trenches into the lower pattern memorization layer, at least a subset of the first lower trenches being interrupted by a lower pattern memorization layer portion preserved at a location defined by a respective one of the first upper blocks; thereafter, forming an auxiliary trench mask stack and patterning auxiliary trenches therein using lithography and etching; and thereafter, patterniType: GrantFiled: January 3, 2022Date of Patent: March 25, 2025Assignee: IMEC VZWInventors: Victor M. Blanco, Frederic Lazzarino
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Patent number: 12259361Abstract: The disclosure includes a system for photoacoustic inspection of an object. The system includes a broadband emission source configured to generate an emission beam, a direction apparatus including at least one spectrum splitter configured to split the emission beam into at least a first and a second component, the direction apparatus being configured to sequentially direct the respective components to N respective locations on the object at N times to generate N respective acoustic waves within the object. The N respective locations and N times are such that the respective N acoustic waves at least semi-constructively interfere to generate a respective propagating acoustic wave within the object. The system also includes a vibration sensing system configured to detect said respective propagating acoustic waves at a respective detection location on the object.Type: GrantFiled: February 15, 2021Date of Patent: March 25, 2025Assignees: IMEC VZW, Universiteit GentInventors: YanLu Li, Roeland Baets
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Patent number: 12255408Abstract: A phased array transceiver element comprises a local oscillator stage for generating beamformed in-phase and quadrature local oscillator signals, the local oscillator stage comprising a phase shifter connectable to a reference frequency source and applying a first phase shift; a primary frequency multiplier input from the phase shifter and applying a primary frequency multiplication factor; a phase-splitting arrangement input from the primary frequency multiplier and having a first output and a second output, the phase-splitting arrangement applying a second phase shift at the first output and a third phase shift at the second output; a first secondary frequency multiplier input from the first output of the phase-splitting arrangement, having an output for the in-phase local oscillator signal, and applying a secondary frequency multiplication factor; and a second secondary frequency multiplier input from the second output of the phase-splitting arrangement, having an output for the quadrature local oscillatorType: GrantFiled: March 16, 2023Date of Patent: March 18, 2025Assignee: Imec VZWInventors: Yang Zhang, Jan Craninckx, Pierre Wambacq, Giuseppe Gramegna
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Patent number: 12251206Abstract: A method for automatic multi-object localization and/or vital sign monitoring is provided. The method comprises the steps of receiving a radar signal in order to form a corresponding observation matrix, reducing noise by applying singular value decomposition to the observation matrix, processing the result of the singular value decomposition by an independent component analysis in order to estimate the corresponding sources, and estimating propagation channels of the estimated sources by minimizing the corresponding residual error based on the observation matrix and the estimated sources.Type: GrantFiled: March 8, 2021Date of Patent: March 18, 2025Assignee: Stichting IMEC NederlandInventors: Yiting Lu, Marco Mercuri
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Patent number: 12249970Abstract: A filter includes cascaded building blocks, for filtering an incoming signal. Each building block has first and second delay elements. A first scaling device is between an input node of the first delay element and an output node of the second delay element, and a second scaling device is between an output node of the first delay element and an input node of the second delay element. The building block has a cross scaling device between the output nodes of the first delay element and of the second delay element, and/or between the input nodes of the first delay element and of the second delay element. The building block is configured such that, in operation, incoming signals at the input node and output node of the second delay element are summed together.Type: GrantFiled: September 24, 2019Date of Patent: March 11, 2025Assignees: UNIVERSITEIT GENT, IMEC VZWInventors: Guy Torfs, Michiel Verplaetse
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Patent number: 12243193Abstract: The disclosure relates generally to image processing. For example, the invention relates to a method and a device for de-noising an electron microscope (EM) image. The method includes the act of selecting a patch of the EM image, wherein the patch comprises a plurality of pixels, wherein the following acts are performed on the patch: i) replacing the value of one pixel, for example of a center pixel, of the patch with the value of a different, for example randomly selected, pixel from the same EM image; ii) determining a de-noised value for the one pixel based on the values of the other pixels in the patch; and iii) replacing the value of the one pixel with the determined de-noised value.Type: GrantFiled: July 2, 2021Date of Patent: March 4, 2025Assignee: IMEC VZWInventors: Bappaditya Dey, Sandip Halder, Gouri Sankar Kar, Victor M. Blanco, Senthil Srinivasan Shanmugam Vadakupudhu Palayam
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Patent number: 12241957Abstract: Example embodiments relate to methods for distance determination. One embodiment includes a method for determining a distance between a first radio signal transceiver and a second radio signal transceiver. The method includes receiving a first set and a second set of measurement results. The first set is acquired by the first radio signal transceiver based on signals transmitted from the second radio signal transceiver and the second set is acquired by the second radio signal transceiver based on signals transmitted from the first radio signal transceiver. The first set is representable as including, for each of a plurality of frequencies, a measurement pair. The method also includes calculating, for each frequency of the plurality of frequencies, a preliminary estimate of a value proportional to a one-way frequency domain channel response. Additionally, the method includes determining a final estimate of the value proportional to the one-way frequency domain channel response.Type: GrantFiled: December 17, 2020Date of Patent: March 4, 2025Assignee: Stichting IMEC NederlandInventors: Jacobus Petrus Adrianus Romme, Pepijn Boer, Lichen Yao
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Patent number: 12237207Abstract: A method for forming a buried metal line in a semiconductor substrate comprises forming, at a position between a pair of semiconductor structures, a metal line trench in the semiconductor substrate at a level below a base of each semiconductor structure of the pair, and forming the metal line in the metal line trench by means of area selective deposition of a metal line material, followed by embedding the pair of semiconductor structures in an insulating layer.Type: GrantFiled: September 18, 2023Date of Patent: February 25, 2025Assignee: Imec vzwInventors: Boon Teik Chan, Zheng Tao, Efrain Altamirano Sanchez, Anshul Gupta, Basoene Briggs
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Patent number: 12237371Abstract: A method for forming a semiconductor device is provided. The method comprises forming a device layer stack comprising an alternating sequence of lower sacrificial layers and channel layers, and a top sacrificial layer over the topmost channel layer, wherein the top sacrificial layer is thicker than each lower sacrificial layer; etching the top sacrificial layer to form a top sacrificial layer portion underneath the sacrificial gate structure; forming a first spacer on end surfaces of the top sacrificial layer portion; etching the channel and lower sacrificial layers while using the first spacer as an etch mask to form channel layer portions and lower sacrificial layer portions; etching the lower sacrificial layer portions to form recesses in the device layer stack, while the first spacer masks the end surfaces of the top sacrificial layer portion; and forming a second spacer in the recesses.Type: GrantFiled: September 16, 2021Date of Patent: February 25, 2025Assignee: IMEC VZWInventors: Boon Teik Chan, Hans Mertens, Eugenio Dentoni Litta
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Patent number: 12220727Abstract: The present invention provides a flexible ultrasound transducer (1) for an ultrasound monitoring system for examining a curved object.Type: GrantFiled: March 12, 2020Date of Patent: February 11, 2025Assignees: IMEC VZW, KATHOLIEKE UNIVERSITEIT LEUVENInventors: David Cheyns, Yongbin Jeong, Xavier Rottenberg
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Patent number: 12214580Abstract: The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.Type: GrantFiled: June 7, 2022Date of Patent: February 4, 2025Assignees: IMEC VZW, Katholieke Universiteit Leuven, KU LEUVEN R&DInventors: Boshen Liang, Dominika Wysocka, David Cheyns
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Patent number: 12216057Abstract: A method and apparatus are provided for a spectroscopic measurement for determining a lateral recess depth in the sidewall of a microstructure. The structure is formed on a larger substrate with the sidewall in an upright position relative to the substrate, and the recess extends essentially parallel to the substrate. The recess may be an etch depth obtained by etching a first layer relative to two adjacent layers, the layers oriented parallel to the substrate, the etch process progressing inward from the sidewall. An incident energy beam falling on the structure generates a spectroscopic response captured and processed respectively by a detector and a processing unit. The response comprises one or more peaks related to the material or materials of the substrate and the structure. According to the method, a parameter is derived from said one or more peaks, that is representative of the lateral recess depth.Type: GrantFiled: July 9, 2021Date of Patent: February 4, 2025Assignee: IMEC VZWInventors: Thomas Nuytten, Janusz Bogdanowicz
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Patent number: 12205973Abstract: An image sensor comprises at least two vertically stacked photo-sensitive devices wherein each respective photo-sensitive device comprises a stack of a top electrode, a first charge transport layer and an active layer. Each respective stack generates electrical charges in response to a corresponding predefined range of wavelengths of light incident on the image sensor. Each photo-sensitive device further comprises a second charge transport layer having a first portion, vertically aligned underneath the active layer, and a second portion, transfer region, protruding laterally to extend beyond the active layer. A dielectric layer separates the first portion from a bottom electrode providing a voltage for depleting the first portion, and the transfer region from a transfer gate providing a voltage for transferring the generated electrical charge to a floating electrical connection, shared by all stacked photo-sensitive devices. The floating electrical connection couples to a read-out-circuitry.Type: GrantFiled: January 11, 2022Date of Patent: January 21, 2025Assignee: IMEC VZWInventors: Jiwon Lee, Kris Myny, Florian De Roose, Pierre Boulenc
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Patent number: 12206413Abstract: Josephson junction based logic devices and methods for their use are described. An example Josephson junction based logic device includes a two-input OR/AND (OA2) gate. The OA2 gate includes a first input node inductively coupled to a first input source and a second input node inductively coupled to a second input source. The first and second input sources are configured to provide single-flux-quantum (SFQ) pulses. The OA2 gate also includes first plurality of inductors coupled between the first input node and one of: a first output node or a second output node. The OA2 gate additionally includes a second plurality of inductors coupled between the second input node and one of: the first or the second output nodes. The OA2 gate also includes Josephson junctions coupled between a common node and one of: the first or the second input node, or the first or the second output node.Type: GrantFiled: July 27, 2022Date of Patent: January 21, 2025Assignee: IMEC VZWInventors: Quentin Paul Herr, Anna Yurievna Herr
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Patent number: 12204996Abstract: An integrated system for quantum computation is provided, In one aspect, the system includes at least one semiconductor spin quantum bit (qubit); a feedline configured to act as an electron spin resonance (ESR) antenna for control of the at least one qubit; at least one resonator; and a ground plane common to both the feedline and the at least one resonator. The at least one resonator is capacitively coupled to the feedline, and configured for readout of the at least one qubit via the feedline. The feedline and the at least one resonator are arranged in adjacent layers separated by at least a dielectric. A corresponding method of performing quantum computation using such an integrated system is also provided.Type: GrantFiled: December 20, 2021Date of Patent: January 21, 2025Assignee: IMEC VZWInventors: Fahd Ayyalil Mohiyaddin, Ruoyu Li, Bogdan Govoreanu, Steven Brebels
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Patent number: 12201976Abstract: A microfluidic device (100) comprises: a reaction chamber (102); at least a first and a second supply channel (110a, 110b) for allowing transport of a first fluid and a second fluid, respectively, from a fluid supply source (112a, 112b) into the reaction chamber (102), wherein each of the first and the second supply channels (110a, 110b) comprises a side drain (114a, 114b) connected to the supply channel (110a, 110b) between the fluid supply source (112a, 112b) and the reaction chamber (102), wherein the side drain (114a, 114b) is configured to prevent undesired diffusion of the fluid in the supply channel (110a, 110b) into the reaction chamber (102); at least a first and a second outlet (120a, 120b) connected to the reaction chamber (102) for allowing transport of fluid from the reaction chamber (102), wherein the first and second outlets (120a, 120b) have different dimensions to provide different hydraulic resistance.Type: GrantFiled: December 18, 2020Date of Patent: January 21, 2025Assignee: IMEC VZWInventors: Ahmed Taher, Benjamin Jones
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Patent number: 12204025Abstract: A method for determining a distance to a target comprises: receiving a bitstream of binary digits corresponding to a time-varying signal based on light transmitted by a light source being reflected by the target, wherein each binary digit in the bitstream is defined based on the time-varying signal at a time instance represented by the binary digit being above or below a threshold; comparing the bitstream to a set of stored reference bitstreams, wherein the set comprises pairs comprising a first reference bitstream and a second reference bitstream representing a common distance to the target, wherein the first reference bitstream is phase-shifted in relation to the second reference bitstream; and determining the distance to the target based on selection of a pair of reference bitstreams based on said comparing.Type: GrantFiled: August 1, 2022Date of Patent: January 21, 2025Assignee: IMEC VZWInventors: Orges Furxhi, Azhar Din, Nikolaos Papadopoulos, Jiwon Lee, Mauricio Velazquez Lopez
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Patent number: 12194497Abstract: The present invention provides a flexible ultrasound transducer for an ultrasound monitoring system for examining a curved object. The ultrasound transducer comprises an integrated circuit structure and a multi-layered structure, said multi-layered structure comprising an array of ultrasound transducing elements arranged in a first layer structure and configured for generating ultrasonic energy propagating along a main transducer axis Z and an array of control circuits arranged in a second layer structure, and wherein the array of control circuits and the integrated circuit structure are configured for operating the array of ultrasound transducing elements in said first layer structure, Further, the multi-layered structure comprises at least one flexible layer arranged so that the bending flexibility of the multi-layered structure permits the ultrasound transducer to form a continuous contact with said curved object during operation.Type: GrantFiled: February 28, 2024Date of Patent: January 14, 2025Assignees: IMEC VZW, Katbolieke Universiteit LeuvenInventors: David Cheyns, Yongbin Jeong, Xavier Rottenberg
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Patent number: 12196942Abstract: According to an aspect of the present inventive concept there is provided a device for imaging of a microscopic object, the device comprising: an array of light sensitive areas sensitive to detect light spanning a wavelength range of at least 400-1200 nm; at least one light source comprising at least a first point of operation in which the at least one light source is configured to generate visible light, and a second point of operation in which the at least one light source is configured to generate infrared light, and being arranged to illuminate the microscopic object such that light is scattered by the microscopic object; wherein the array of light sensitive areas is configured to detect an interference pattern formed between the scattered light and non-scattered light; the device being configured to be set in a selected point of operation from the at least first and second points of operation, for detecting the interference pattern for imaging the microscopic object at a wavelength defined by the seleType: GrantFiled: December 20, 2021Date of Patent: January 14, 2025Assignee: IMEC VZWInventors: Ziduo Lin, Murali Jayapala, Geert Vanmeerbeeck, Abdulkadir Yurt