Patents Assigned to IMEC
  • Patent number: 11886014
    Abstract: A silicon-based photonic chip is provided that includes an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly. The interface includes: a single-mode waveguide configured to guide light and to provide a first light beam; a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, thereby providing an expanded light beam; and a second optical element configured to deflect and to further expand the expanded light beam in a second direction, thereby providing an output light beam from the photonic chip. Also provided are methods for fabricating such a photonic chip.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: January 30, 2024
    Assignee: Imec VZW
    Inventors: Junwen He, Joris Van Campenhout, Geert Van Steenberge, Jeroen Missinne, Yigit Yilmaz, Do Won Kim, Douglas Charles La Tulipe
  • Patent number: 11888683
    Abstract: The disclosure relates to a computer-implemented method and control system for controlling provisioning of a service in a network. A network function specification data structure of a network function of the service is obtained, wherein the network function specification data structure is associated with at least a first network function implementation, e.g. a physical network function implementation, and a second network function implementation, e.g. a virtual network function implementation, for performing the network function of the service. Network service provisioning is controlled comprising selecting the first network function implementation or the second network function implementation of the network function in the network function specification data structure.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: January 30, 2024
    Assignees: Koninklijke KPN N.V., Imec VZW, Universiteit Gent
    Inventors: Hendrik Moens, Jeroen Famaey
  • Patent number: 11864876
    Abstract: A light-to-digital converter (2) comprises a light-to-current converter (10); a current integrator (4) with an integrator output (30) resettable to a baseline level; and a counter (18) with a digital output (26), wherein the light-to-current converter (10) is switchably connectable as a positive integration input to the current integrator (4), for, during a light-collecting phase (404-406), integrating a current from the light-to-current converter (10), the integrator output (30) starting from the baseline value and ending at a value to be digitized; a reference current source (14) is switchably connectable as a negative integration input to the current integrator (4), for, during a counting phase (406-408) subsequent to the light-collecting phase (404-406), integrating a reference current from the reference current source (14), the integrator output (30) starting from the value to be digitized and ending at the baseline value, the time spent integrating the reference current corresponding to the value to be
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: January 9, 2024
    Assignees: IMEC VZW, KATHOLIEKE UNIVERSITEIT LEUVEN KU LEUVEN, STICHTING IMEC NEDERLAND
    Inventors: Qiuyang Lin, Jiawei Xu, Shuang Song, Nick Van Helleputte, Filip Tavernier
  • Patent number: 11862452
    Abstract: In a first aspect, the present disclosure relates to a method for forming a contact isolation for a semiconductor device, comprising: providing a semiconductor structure comprising a trench exposing a contact thereunder, filling a bottom of the trench with a sacrificial material, infiltrating the sacrificial material with a ceramic material, and removing the sacrificial material.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: January 2, 2024
    Assignee: IMEC VZW
    Inventors: Boon Teik Chan, Waikin Li, Zheng Tao
  • Patent number: 11860265
    Abstract: A method for extracting spatial resolution and/or velocity resolution of a single-input single-output radar acquiring raw radar data with a frequency scanning antenna is provided. The method includes steering a radar beam with the aid of the frequency scanning antenna with respect to an area to be illuminated by the radar, and dividing the area into at least two angular sectors. In this context, the at least two angular sectors are configured in a manner that the at least two angular sectors overlap with respect to each other.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: January 2, 2024
    Assignee: Stichting IMEC Nederland
    Inventors: Rainer Oliver Hornung, Peng Zhang, Marco Mercuri, Paul Mateman, Lichen Yao
  • Patent number: 11857308
    Abstract: A system for respiratory monitoring of a subject comprises: a bioimpedance measurement sensor, which is configured for arrangement in relation to the subject for acquiring a bioimpedance signal; a processing unit, which is configured to receive the acquired bioimpedance signal and receive a reference signal, the reference signal representing a respiratory effort of the subject or a respiratory airflow at a time of bioimpedance signal acquirement, the processing unit being further configured to divide the bioimpedance signal into an effort component representing a respiratory effort of the subject and a flow component representing a respiratory airflow of the subject based on the received bioimpedance signal and the received reference signal.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: January 2, 2024
    Assignee: STICHTING IMEC NEDERLAND
    Inventors: Willemijn Groenendaal, Ruben De Francisco Martin
  • Patent number: 11854803
    Abstract: A method for protecting a gate spacer when forming a FinFET structure, the method comprising: providing a fin with at least one dummy gate crossing the fin wherein a gate hardmask is present on top of the dummy gate; providing a gate spacer such that it is covering the dummy gate and the gate hardmask; recessing the gate spacer such that at least a part of the gate hardmask is exposed; selectively growing, by means of area selective deposition, extra capping material over the exposed part of the gate hardmask.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: December 26, 2023
    Assignee: IMEC VZW
    Inventors: Boon Teik Chan, Pierre Morin, Antony Premkumar Peter
  • Patent number: 11855675
    Abstract: A system for providing distributed communication with respect to a user equipment is provided. The system includes multiple communication units for distributing the communication with respect to the user equipment, a communication management unit connected to at least a pan of the multiple communication units in a connection line for managing the distributed communication, a connection unit including loss-inserting properties for connecting the multiple communication units to the connection line, an amplifying unit for being arranged with respect to the connection units, and a scheduling unit. The scheduling unit is configured to determine power loss with respect to the units on the basis of the corresponding loss-inserting properties and/or to schedule at least one of the multiple communication units and/or the at least one amplifying unit m order to compensate for power loss with respect to the at least one connection unit.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: December 26, 2023
    Assignee: Imec vzw
    Inventors: Mamoun Guenach, Andre Bourdoux
  • Patent number: 11856692
    Abstract: An interconnect for connecting a first electronic circuit to a second, external stretchable electronic circuit device comprises: conductive lines of the first electronic circuit arranged in a plane; connectors configured to define an overlap in the plane between each end of the conductive lines with a corresponding end of stretchable conductive lines providing an electrical connection between the conductive lines and the stretchable conductive lines over the entire overlap; and at least one anchoring structure for providing an anchoring of the first electronic circuit with the second, external stretchable electronic circuit device, wherein the at least one anchoring structure provides anchoring transverse to the plane in anchoring positions on opposite sides of the overlap.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: December 26, 2023
    Assignees: IMEC VZW, UNIVERSITEIT HASSELT
    Inventors: Steven Nagels, Thijs Vandenryt, Wim Deferme
  • Patent number: 11847944
    Abstract: A system and for distributing data for 3D light field projection and a method thereof. The system comprises input terminals and output terminals that are connectable to pixel elements of a display. Data paths are established between input terminals and output terminals, and are controlled by data switches. The system also comprises a control plane adapted for applying control variables to the data switches. Control switches of the control plane select the control variables which are applied to the data switches. Sequences of control variables and enable variables propagate along at least one first delay line and along at least one second delay line, respectively. Delay units of the at least one first delay line and of the at least one second delay line have a synchronous relationship. During system run-time patterns contained in the stream of input data are detected for determining the sequences of control variables.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: December 19, 2023
    Assignee: IMEC VZW
    Inventors: Francky Catthoor, Jan Genoe, Xavier Rottenberg
  • Patent number: 11841298
    Abstract: The inventive concept relates to a collector for collecting particles in air and a device for detecting particles in air comprising said collector. Said collector comprises a substrate, which is adapted to enable imaging of the particles, an adhesive layer arranged on a collector side of the substrate, said adhesive layer being formed by an adhesive material. The collector further comprises a protection element, which is configured to protect the adhesive layer before collection of particles. The collector is configured to allow release of protection of the adhesive layer by the protection element to expose an adhesive surface of the adhesive layer to ambient air for collecting particles on the adhesive surface. The collector is further configured for presenting a particle sample carrier having a smooth top surface and a smooth bottom surface for preventing light from being diffusely scattered by the particle sample carrier.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: December 12, 2023
    Assignee: IMEC VZW
    Inventors: Ziduo Lin, Abdulkadir Yurt, Richard Stahl, Geert Vanmeerbeeck, Andy Lambrechts
  • Patent number: 11841563
    Abstract: The present disclosure relates to electro-optic modulators that include caps for optical confinement. One example embodiment includes an electro-optic modulator. The electro-optic modulator includes a first cladding layer. The electro-optic modulator also includes a second cladding layer. In addition, the electro-optic modulator includes a first waveguide. The first waveguide is at least partially encapsulated between the first cladding layer and the second cladding layer. Further, the electro-optic modulator includes a thin-film lithium niobate layer adjacent to the second cladding layer. The thin-film lithium niobate layer is on an opposite side of the second cladding layer from the first waveguide. Additionally, the electro-optic modulator includes a first cap positioned on an opposite side of the thin-film lithium niobate layer from the second cladding layer. The first cap enhances optical confinement within the thin-film lithium niobate layer.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: December 12, 2023
    Assignee: IMEC USA NANOELECTRONICS DESIGN CENTER, Inc.
    Inventors: Swapnajit Chakravarty, Reza Safian
  • Patent number: 11842758
    Abstract: According to an aspect there is provided a memory cell. The memory cell comprises: a first and a second electrode; a spin-orbit-torque, SOT, layer comprising a first and a second electrode contact portion arranged in contact with the first and the second electrode, respectively, and an intermediate portion between the first and second electrode contact portions; a first magnetic tunnel junction, MTJ, layer stack arranged in contact with the intermediate portion; and a second MTJ layer stack arranged in contact with the second electrode contact portion and directly above the second electrode. A memory device comprising such a memory cell and a method for writing to such a memory cell are also provided.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: December 12, 2023
    Assignees: IMEC VZW, KATHOLIEKE UNIVERSITEIT LEUVEN
    Inventors: Mohit Gupta, Kevin Garello, Manu Komalan Perumkunnil
  • Patent number: 11832525
    Abstract: The material layer stack includes first and second magnetic tunnel junctions and a first top electrode formed on a top face of the stack. A shoulder is formed on a lateral face of the stack and divides the stack into a lower portion and an upper portion. A tunnel barrier of the first magnetic tunnel junction is comprised by the lower stack portion and a tunnel barrier of the second magnetic tunnel junction by the upper stack portion. A second top electrode is formed on the shoulder. Each magnetic tunnel junction is adapted to store a bit as a reconfigurable magnetoresistance of its magnetic electrodes. Preferably, a bottom face of the stack is connected to a conductor supporting current induced magnetic polarization switching for the first magnetic tunnel junction by spin-orbit torque. Magnetic polarization switching for the second magnetic tunnel junction is preferably achieved by spin-transfer torque.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: November 28, 2023
    Assignees: IMEC vzw, Katholieke Universiteit Leuven
    Inventors: Mohit Gupta, Trong Huynh Bao
  • Patent number: 11827992
    Abstract: At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: November 28, 2023
    Assignees: Imec vzw, Katholieke Universiteit Leuven
    Inventors: Stanislaw Piotr Zankowski, Philippe M. Vereecken
  • Patent number: 11819864
    Abstract: A method for applying thin film material onto a substrate comprises: forming microdroplets of a solvent and a solute material forming the thin film material; depositing the microdroplets on an upper surface of a micro-structured mesh, wherein the microdroplets are deposited to allow coalescing into droplets extending into the micro-structured mesh; and arranging a surface of the substrate in close relation to a bottom surface of the micro-structured mesh such that a capillary force draws liquid of the droplets onto the surface of the substrate, whereby forced dynamic wetting of the surface of the substrate is provided to form a liquid film on the surface of the substrate.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: November 21, 2023
    Assignees: IMEC VZW, UNIVERSITEIT HASSELT
    Inventors: Rachith Shanivarasanthe Nithyananda Kumar, Wim Deferme
  • Patent number: 11822118
    Abstract: An integrated photonic device for wavelength division multiplexing comprises: a wavelength-splitting/combining component configured to be re-used for both splitting a single signal to be split, wherein the signal to be split comprises plural wavelengths, to plural split signals, wherein each of the plural split signals is related to a unique wavelength band, and combining plural signals to be combined, wherein each of the plural signals to be combined is related to a unique wavelength band, to a single combined signal, wherein the wavelength-splitting/combining component comprises at least one output channel for providing an output signal and at least one response channel for receiving a response input signal from a light interaction induced by the output signal, wherein the output channel and the response channel are connected to different ports of the wavelength-splitting/combining component.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: November 21, 2023
    Assignees: IMEC VZW, UNIVERSITEIT GENT
    Inventors: Wim Bogaerts, Wouter Jan Westerveld, Roelof Jansen
  • Patent number: 11822475
    Abstract: Example embodiments relate to integrated circuits with 3D partitioning. One embodiment includes an integrated circuit. The integrated circuit includes a first integrated circuit layer that includes processing cores. The integrated circuit also includes a second integrated circuit layer that includes memory arrays associated with processing cores. Additionally, the integrated circuit includes an intermediate integrated circuit layer interconnected with the first and second integrated circuit layers and including memory control logic and interface circuitries for managing data exchange between the processing cores and the memory arrays.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: November 21, 2023
    Assignee: Imec vzw
    Inventors: Manu Komalan Perumkunnil, Geert Van der Plas
  • Patent number: 11821978
    Abstract: A method of secure wireless ranging between a verifier node and a prover node comprises performing a measurement procedure resulting in a two-way phase measurement and a round-trip time measurement between the verifier node and the prover node. The measurement procedure comprises the verifier node transmitting on the frequency a verifier packet, the prover node receiving the verifier packet and performing a phase measurement of a verifier carrier signal and a time-of-arrival measurement of a verifier frame delimiter, the prover node transmitting a prover packet, and the verifier node receiving the prover packet and performing a phase measurement of the prover carrier signal and a time-of-arrival measurement of the prover frame delimiter. The method further comprises calculating a distance between the verifier node and the prover node based on the two-way phase measurements and the round-trip time measurements for the plurality of frequencies.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: November 21, 2023
    Assignees: Katholieke Universiteit Leuven, Stichting IMEC Nederland
    Inventors: Mohieddine El Soussi, Jacobus Romme, Pepijn Boer, Roel Peeters
  • Patent number: 11824122
    Abstract: A method for partially filling a space between two superimposed structures in a semiconductor device under construction is provided. The method includes the steps of: (a) providing the two superimposed structures having said space therebetween; (b) entirely filling said space with a thermoplastic material; (c) removing a first portion of the thermoplastic material present in the space, the first portion comprising at least part of a top surface of the thermoplastic material, thereby leaving in said space a remaining thermoplastic material having a height; and (d) heating up the remaining photosensitive thermoplastic material so as to reduce its height. A replacement metal gate process for forming a different gate stack on two superimposed transistor channels in a semiconductor device under construction as well as a semiconductor device under construction is also provided.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: November 21, 2023
    Assignee: Imec vzw
    Inventors: Boon Teik Chan, Waikin Li, Zheng Tao