Abstract: An integrated circuit includes an array of flash memory and flash translation layer (FTL) logic coupled to the array and to be coupled to a host device. The FTL logic is configured to receive, from the host device, a write command comprising a first logical address, user data, and an access token and translate the first logical address to a first physical address of the array. In an embodiment, the first physical address has already been programmed. The FTL logic is further to verify the access token as being associated with the first logical address, cause the user data to be programmed to a second physical address of the array, and update at least one logical-to-physical (L2P) mapping table with the second physical address as being mapped to the first logical address.

Abstract: A method can include, for each row of a nonvolatile memory (NVM) cell array, generating a multiply-accumulate (MAC) result for the row by applying input values on bit lines. Each MAC result comprising a summation of an analog current or voltage that is a function of each input value modified by a corresponding weight value stored by the NVM cells of the row. By operation of at least one multiplexer, one of the rows can be connected to an analog-to-digital converter (ADC) circuit to convert the analog current or voltage of the row into a digital MAC value. A storage element of each NVM cell can be configured to store a weight value that can vary between no less than three different values. Corresponding devices and systems are also disclosed.

Abstract: Systems, methods, and devices provide management of power domains. Methods include activating a first power domain of a memory controller in response to receiving a memory command associated with a storage location coupled to the memory controller, and performing a first portion of a sequence of operations determined based on the memory command, the first portion being performed using a first plurality of processing elements included in the first power domain. Methods further include activating a second power domain of the memory controller based on a timing determined by the sequence of operations, and performing a second portion of the sequence of operations using a second plurality of processing elements included in the second power domain.

Abstract: A fabrication method of a semiconductor device is described. Generally, the method includes forming a customizable oxide-nitride-oxide (ONO) stack over a substrate in an in-situ atomic layer deposition (ALD) tool or chamber. Radical oxidation or oxide deposition process steps are performed to form tunnel dielectric layer overlying the substrate. Silicon nitride deposition process steps are also performed to form a multi-layer charge trapping (CT) layer in which at least some of the process parameters of silicon nitride deposition process steps are adjusted when forming the first and second CT sub-layers of the multi-layer CT layer. Subsequently, radical oxidation or oxide deposition process steps are performed in the ALD tool to form a blocking dielectric layer overlying the multi-layer CT layer.

Abstract: A method can include receiving, at a serial input/output (IO) of a memory device, at least command values, address values and metadata that includes an encoded length value in synchronism with a serial clock. From at least the command, address and encoded length values, a memory access operation, a memory array location, and one of a plurality of different data length values (LEN) corresponding to the memory access operation can be determined. At least data having a length corresponding to the one of the plurality of different LEN can be transferred at the serial IO in synchronism with the serial clock during execution of the memory access operation. Corresponding devices and systems are also disclosed.

Abstract: In accordance with an embodiment, a method for characterizing a non-volatile memory, includes: applying a first voltage on a word line conductively coupled to a non-volatile memory cell and measuring a current flowing through the non-volatile memory cell in response to applying the first voltage. Measuring the current includes: using a sense amplifier, comparing the current flowing through the non-volatile memory cell with a plurality of different first currents generated by an adjustable current source while applying the same first voltage on the word line, and determining the measured current based on the comparing.

Abstract: A method of operating a memory circuit is disclosed. The memory circuit includes a memory array having a memory portion and a spare portion. The method includes receiving a first write command to a first memory address, where the first memory address has a status of being mapped to a first spare memory address, and where the first memory address corresponds to a first memory location in the memory portion and the first spare memory address corresponds to a first spare memory location in the spare portion. The method also includes performing, in response to the first write command, a first write operation by attempting to write first data to the first memory location, determining if the first write operation is successful, and unmapping, in response to the first write operation of being successful, the first memory address from the first spare memory address.

Abstract: Semiconductor devices and methods of manufacturing the same are provided. The semiconductor devices may have a memory array having two transistor (2T) memory cells, each including a non-volatile memory (NVM) transistor and a high voltage (HV) field-effect transistor (FET) as a select transistor disposed within at least one recess(es). The devices further include a logic area in which HV FETs, input/output (I/) FETs, and low voltage (LV)/core FETs are formed thereon. Other embodiments are also described.

Abstract: Systems, methods, and devices securely boot processors and nonvolatile memories. Methods include implementing, using a controller of a secured nonvolatile memory, a validation operation on a first portion of code stored in a first secured storage region of the secured nonvolatile memory, the validation operation comprising computing a validation value. Methods also include retrieving a second portion of code from a second secured storage region, the second portion of code comprising a pre-computed validation value, the first and second portion of code being associated with booting a processor, and implementing a comparison operation of the validation value and the pre-computed validation value. Methods further include generating, using the controller, a signal based on a result of the comparison operation, the signal being provided to the processor via an interface of the secured nonvolatile memory, and the signal enabling booting of the processor in response to a matching comparison operation.

Abstract: A method can include, for each row of a nonvolatile memory (NVM) cell array, generating a multiply-accumulate (MAC) result for the row by applying input values on bit lines. Each MAC result comprising a summation of an analog current or voltage that is a function of each input value modified by a corresponding weight value stored by the NVM cells of the row. By operation of at least one multiplexer, one of the rows can be connected to an analog-to-digital converter (ADC) circuit to convert the analog current or voltage of the row into a digital MAC value. A storage element of each NVM cell can be configured to store a weight value that can vary between no less than three different values. Corresponding devices and systems are also disclosed.

Abstract: Disclosed herein is a semiconductor device comprising a first dielectric disposed over a channel region of a transistor formed in a substrate and a gate disposed over the first dielectric. The semiconductor device further includes a second dielectric disposed vertically, substantially perpendicular to the substrate, at an edge of the gate, and a spacer disposed proximate to the second dielectric. The spacer includes a cross-section with a perimeter that includes a top curved portion and a vertical portion substantially perpendicular to the substrate. The perimeter further includes a discontinuity at an interface of the top curved portion with the vertical portion. Further, disclosed herein are methods associated with the fabrication of the aforementioned semiconductor device.

Abstract: In accordance with an embodiment, a circuit includes a plurality of comparators disposed on an integrated circuit, the plurality of comparators having inputs coupled to a monitored power supply line; and a voting circuit having inputs coupled to outputs of the plurality of comparators. An output of the voting circuit is configured to provide a signal indicative of a brown out condition of a power source coupled to the monitored power supply line.

Abstract: A fabrication method of a semiconductor device is described. Generally, the method includes forming a customizable oxide-nitride-oxide (ONO) stack over a substrate in an in-situ atomic layer deposition (ALD) tool or chamber. Radical oxidation or oxide deposition process steps are performed to form tunnel dielectric layer overlying the substrate. Silicon nitride deposition process steps are also performed to form a multi-layer charge trapping (CT) layer in which at least some of the process parameters of silicon nitride deposition process steps are adjusted when forming the first and second CT sub-layers of the multi-layer CT layer. Subsequently, radical oxidation or oxide deposition process steps are performed in the ALD tool to form a blocking dielectric layer overlying the multi-layer CT layer.

Abstract: Memory devices and methods for operating the same are provided. Generally, the device includes an array of multibit-memory-cells, each operable to store multiple bits in separate locations of a charge-trapping layer, and control-circuitry coupled to the array. The control-circuitry is operable read 1st and 2nd bit values of each cell individually based on generated first and second sensed currents, where the first and second sensed currents correspond to charges trapped in first and second bit locations. The control-circuitry executes an algorithm based on the first and second sensed currents and determines a logic state of the cell. In one embodiment, the control-circuitry averages the sensed currents, and compares this to a reference current to determine the logic state. In another, the 2nd bit value is a complement of the 1st, and the control-circuitry compares the currents to determine the logic state without use of a reference current.

Abstract: A method of operating a semiconductor inference device that includes the steps of writing one of multiple analog weight values to memory cells of a non-volatile memory (NVM) array, receiving inputs through a bus system, performing multiply accumulate (MAC) operations based on the inputs and the stored analog weight values, converting results of the MAC operations to outputs, and transmitting the outputs through the bus system.

Abstract: In an embodiment, a memory circuit includes: a memory, N latch circuits coupled in parallel, a data multiplexer, a logic circuit, and a data path data path. The memory array is configured to provide read data to a first data bus, and each latch circuit is configured to store read data from the first data bus. The data multiplexer has N data inputs respectively coupled to data outputs of the N latch circuits and is configured to select a data input of the N data inputs of the data multiplexer to connect to the data output of the data multiplexer based on a selection input of the data multiplexer. The data path is configured to cause a propagation of data from a data output of the data multiplexer to a data input of the logic circuit.

Abstract: A resistor network with reduced area and/or improved voltage resolution and methods of designing and operating the same are provided. Generally, the resistor network includes a resistor ladder with a first number (n) of integrated resistors coupled in series between a top and a bottom contact, with one or more contacts coupled between adjacent resistors. A second number of integrated resistors is coupled in parallel between the top and bottom contacts, and a third number of integrated resistors is coupled in series between the second integrated resistors and either the top or the bottom contact. Each of the integrated resistors has a resistance of R, and a voltage developed across each resistor in the resistor ladder is equal to a voltage applied between the top and bottom contacts divided by n. Where the second number is n?1, and the third number is 1, the total number of resistors is 2n.

Abstract: Systems, methods, and devices implement counters with fault tolerance and power loss protection. Systems include a non-volatile memory device that includes a first counter configured to store a first plurality of data values representing a plurality of count operations, and a second counter configured to store a second plurality of data values representing an initiation and a completion of each erase operation performed on the first counter. Systems also include control circuitry configured to generate a count value based on a current counter value of the first counter, a current counter value of the second counter, and at least one physical parameter of the first counter.

Abstract: Systems, methods, and devices dynamically determine sensing levels for memory devices. Devices include nonvolatile memory cells included in a plurality of memory sectors, a plurality of static reference cells configured to represent a first reference value for distinguishing between memory states, and a plurality of dynamic reference cells configured to represent the first reference value after a designated amount of memory sector activity. Devices also include a comparator configured to be coupled to at least one memory cell of the plurality of memory cells and to at least two of the plurality of static reference cells and the plurality of dynamic reference cells, and further configured to determine a memory state of the at least one memory cell based, at least in part, on a second reference value determined by a combination of at least two of the plurality of static reference cells and the plurality of dynamic reference cells.

Abstract: A method can include: receiving a plurality of consecutive commands on a unidirectional command-address (CA) bus input of a discrete nonvolatile memory (NVM) device, the commands being synchronous with a timing clock; for each received command, determining if the command is an express read (NVR) command, if a command is determined to be an NVR command, determining if a next consecutive command is an NVR command, wherein consecutive NVR commands form an NVR command sequence; in response to the no more than the NVR command sequence, accessing read data stored in NVM cells of the NVM device; and driving the read data on parallel data input/outputs (I/Os) of the NVM device in a burst of data values, the data values of the burst being output in synchronism with rising and falling edges of the timing clock; wherein the CA bus input includes a plurality of parallel CA signal inputs. Related memory devices and systems are also disclosed.