Abstract: In-memory computing architectures and methods of performing multiply-and-accumulate operations are provided. The method includes sequentially shifting bits of first input bytes into each row in an array of memory cells arranged in rows and columns. Each memory cell is activated based on the bit to produce a bit-line current from each activated memory cell in a column on a shared bit-line proportional to a product of the bit and a weight stored therein. Charges produced by a sum of the bit-line currents in a column are accumulated in first charge-storage banks coupled to a shared bit-line in each of the columns. Concurrently, charges from second input bytes accumulated in second charge-storage banks previously coupled to the columns are sequentially converted into output bytes. The charge-storage banks are exchanged after the first input bytes have been accumulated and the charges from the second input bytes converted. The method then repeats.

Abstract: Systems, methods, and devices include counters configured to implement count operations. Systems include non-volatile memory devices which include a first counter configured to store a first plurality of data values representing a plurality of count operations, and a second counter configured to store a second plurality of data values representing a number of erase operations applied to the first counter. Systems further include control circuitry configured to implement read, write, and erase operations for the first counter and the second counter, determine a partial count value based, at least in part, on a current value of the second counter and at least one physical parameter of the first counter, and generate a count value by adding the partial count value with a current value of the first counter. Such counters and control circuitry are immune data loss due to power loss events.

Abstract: An approach to use silicided bit line contacts that do not short to the underlying substrate in memory devices. The approach provides for silicide formation in the bit line contact area, using a process that benefits from being self-aligned to the oxide-nitride-oxide (ONO) nitride edges. A further benefit of the approach is that the bit line contact implant and rapid temperature anneal process can be eliminated. This approach is applicable to embedded flash, integrating high density devices and advanced logic processes.