Abstract: Embodiments can provide a system, a wheel localizer, a wheel localization device, a method or a computer program for locating a position of wheel. The system for locating the position of the wheel on the vehicle includes a detector for obtaining information related to a steering angle of the vehicle and a locator for determining the position of the wheel based on the information related to the steering angle of the vehicle. Embodiments further provide a device, a method and a computer program configured to determine information related to one or more expected rotational frequencies of one or more wheels of a vehicle. The device includes a path detector configured to determine expected path lengths of the one or more wheels of the vehicle based on information related to a path of the vehicle.

Abstract: Embodiments relate to systems and methods including a step of switching between two or more erase operations and/or two or more write operations for erasing of and/or writing to least one memory cell of a nonvolatile memory enabling to select a most suitable erase and/or write operation for a particular erase and/or write operation within the memory.

Abstract: A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element, and a mold material at least partially covering the chip and the adhesive.

Abstract: A module including a carrier and a semiconductor chip applied to the carrier. An external contact element is provided having a first portion and a second portion extending perpendicular to the first portion, wherein a thickness of the second portion is smaller than a thickness of the carrier.

Abstract: A contactless device having an energy antenna configured to transmit/receive an energy signal; and a data antenna configured to transmit a data signal. Also, a method for transmitting a contactless signal including transmitting/receiving an energy signal from an energy antenna of a contactless device; and transmitting a data signal from a data antenna of the contactless device.

Abstract: A system and method can be used for scaling an output of a modulator of a sigma-delta analog to digital converter and systems and a method can be used for compensating temperature-dependent variations of a reference voltage in a sigma-delta analog to digital converter. In accordance with one embodiment, a system can be used for scaling an output of a modulator of a sigma-delta analog digital converter (ADC). A decimation filter has a decimation length that is adjustable by a decimation length value received as an input to the decimation filter. The decimation filter is configured to receive the output of the modulator of the sigma-delta ADC and to decimate the received output of the modulator of the sigma-delta ADC using the received decimation length value.

Abstract: A monocrystalline layer having a first lattice constant on a monocrystalline substrate having a second lattice constant at least in a near-surface region, wherein the second lattice constant is different from the first lattice constant. Lattice matching atoms are implanted into the near-surface region. The near-surface region is momentarily melted. A layer is epitaxially deposited on the near-surface region that has solidified in monocrystalline fashion.

Abstract: In one embodiment, A system for communication has a receiver for receiving data from a passive transmitter capacitively coupled to the receiver. The receiver has a sensing element having a plurality of terminals configured to be capacitively coupled to the passive transmitter and DC isolated from the passive transmitter.

Abstract: A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate, which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

Abstract: A random source for generating a random number r with a bit length k, r=r0, . . . , rk-1, a memory for storing a threshold value state variable s, which is represented by a number with a bit length n?k, s=s0, . . . , sn-1, and a comparator to compare two numbers with a bit length k, i.e. from r with a subset of the bits from s are provided. Two calculation rules R1 and R2, which are able to change the content of the memory for the threshold value state variable s (i.e. functions from s to s), are defined for a method of generating random wait states.

Abstract: A semiconductor device comprises a semiconductor substrate, an anorganic isolation layer on the semiconductor substrate and a metallization layer on the anorganic isolation layer. The metallization layer comprises a fuse structure. At least in an area of the fuse structure the metallization layer and the anorganic isolation layer have a common interface.

Abstract: An embodiment method for power switch temperature control comprises monitoring a power transistor for a delta-temperature fault, and monitoring the power transistor for an over-temperature fault. If a delta-temperature fault is detected, then the power transistor is commanded to turn off. If an over-temperature fault is detected, then the power transistor is commanded to turn off, and delta-temperature hysteresis cycling is disabled.

Abstract: A semiconductor device and method are disclosed. The semiconductor device includes a substrate having a first region and a second region and an insulating layer arranged on the substrate. A first conductive layer is arranged in or on insulating layer in the first region and a second conductive layer is arranged in or on the insulating layer in the second region. The first conductive layer comprises a first conductive material and the second conductive layer comprises a second conductive material wherein the first conductive material is different than the second conductive material. A metal layer is arranged on the first conductive layer.

Abstract: A method of making contact pad sidewall spacer and pad sidewall spacers are disclosed. An embodiment includes forming a plurality of contact pads on a substrate, each contact pad having sidewalls, forming a first photoresist over the substrate, and removing the first photoresist from the substrate thereby forming sidewall spacers along the sidewalls of the plurality of the contact pads.

Abstract: A description is given of a method for the pulsed control of a transistor which has a control terminal and a load path. The load path of the transistor is connected in series with a load. A control circuit is provided for a transistor. In the method, the transistor is controlled with a control pulse of a first type, which has a first control level at least for a first time duration, before a control pulse of a second type, which has a second control level, which is higher in comparison with the first control level. A voltage across the load path of the transistor is evaluated and the pulsed control is terminated if the voltage across the load path exceeds a predefined threshold value.

Abstract: The invention relates to an electronic memory system, and more specifically, to a system for emulating an electrically erasable programmable read only memory in a non-volatile memory device, and a method of emulating an electrically erasable programmable read only memory in a non-volatile memory device. According to an embodiment, a system for emulating an electrically erasable programmable read only memory is provided, the system including a Flash memory, wherein the Flash memory is configurable into a first region and a second region, wherein the first region is adapted to store a first class of data and the second region is adapted to store a second, different class of data.

Abstract: An etchant is supplied to a workpiece. Furthermore, the workpiece is irradiated with spatially modulated light to adjust a temperature profile of said workpiece while etchant is supplied.

Abstract: A chip contact pad and a method of making a chip contact pad are disclosed. An embodiment of the present invention includes forming a plurality of contact pads over a workpiece, each contact pad having lower sidewalls and upper sidewalls and reducing a lower width of each contact pad so that an upper width of each contact pad is larger than the lower width. The method further includes forming a photoresist over the plurality of contact pads and removing portions of the photoresist thereby forming sidewall spacers along the lower sidewalls.

Abstract: One embodiment of a semiconductor device includes a semiconductor body with a first side and a second side opposite to the first side. The semiconductor device further includes a first contact trench extending into the semiconductor body at the first side. The first contact trench includes a first conductive material electrically coupled to the semiconductor body adjoining the first contact trench. The semiconductor further includes a second contact trench extending into the semiconductor body at the second side. The second contact trench includes a second conductive material electrically coupled to the semiconductor body adjoining the second contact trench.

Abstract: A semiconductor component arrangement and method for producing thereof is disclosed. One embodiment provides at least one power semiconductor component integrated in a semiconductor body and at least one logic component integrated in the semiconductor body. The logic component includes a trench extending into the semiconductor body proceeding from a first side, at least one gate electrode arranged in the trench and insulated from the semiconductor body by a gate dielectric, and at least one source zone and at least one drain zone of a first conduction type, which are formed in the semiconductor body in a manner adjacent to the gate dielectric and in a manner spaced apart from one another in a peripheral direction of the trench and between which at least one body zone of a second conduction type is arranged.