Abstract: A method and apparatus for measuring the characteristics of microstructures by modulating a sample using a modulated source and utilizing a microscope to magnify a desired sample area and direct a monochromatic probe light source onto the desired microstructure of the sample. The probe light is reflected by the sample and the reflectance spectra is directed by the microscope and thereafter, is detected and transmitted to a computer to record or display the measured characteristic. Further, the computer is also used to control the brightness of the monochromatic probe light and to control the modulation frequency of the modulated source. The wavelength of the monochromatic probe light can also be varied by the computer. The magnification of the microscope can be varied so that the desired microstructure is visible and the probing light spot is precisely placed on it.

Abstract: A dispenser contains a chamber enclosed by an upper wall and a lower wall, both walls are oriented parallel to each other. The upper wall has a vertically bored inlet port and the lower wall has a plurality of vertically bored outlet ports for providing access to the chamber. The outlet ports are geometrically arranged in an array pattern characterized by equidistantly spaced rows and columns of bores. There is a plurality of baffle plates interposed between the upper wall and the lower wall. The baffle plates, which are spatially separated from each other, are oriented parallel to and spatially separated from the upper and lower walls. The baffle plates have a plurality of vertically bored holes for providing access between the inlet port and the outlet ports, whereby the dispenser is effective in providing homogeneous flow of fluid through the outlet ports.

Abstract: A novel process for fabricating an integrated circuit sensor/actuator is described. Silicon islands are created by forming deep trenches in a substrate and lining the trenches with oxide. This forms silicon islands substantially surrounded by electrically isolating oxide. The anchor portion of the sensor/actuator beams is connected to the islands and is released from the substrate and therefore is also electrically isolated from the substrate. The IC sensor/actuator is manufactured by forming deep trenches in a substrate.

Abstract: The invention is directed to a chip-sized package (CSP) and method for making a CSP which is simple to manufacture, less costly and more compact, thus being truly a chip-sized package. The inventive CSP has a chip that has an array of chip ports on an active surface, such as an array of solder or metal bumps or any other conductive material. The chip may be held in a cavity of a frame by a pair of frame tie-bars. An encapsulant encapsulates the chip and portions of the chip ports located near the active surface, leaving portions of the chip ports located away from the active surface exposed. Package ports, such as solder balls may be attached to the portions of the chip ports located away from the active surface and used to attach the CSP to a printed circuit board. Various methods are used to leave portions of the chip ports located away from the active surface exposed from the encapsulant. The encapsulant may be removed by laser or grinding to expose portions of the chip ports.

Abstract: A baseband simulation system is disclosed for testing an RF subsystem of a communication device, such as a cellular telephone, cordless telephone, etc. A preferred embodiment has a computer connected to an interface card which in turn is connected to a baseband simulation subsystem. The baseband simulation subsystem is connected to the RF subsystem under test. The baseband simulation subsystem includes three ports: a timing and control (TAC) port, an IQ port, and general purpose input output (GPIO) port. The TAC port receives a master clock signal from an external source and generates plural clocks therefrom. The IQ and GPIO ports receives at least one of these plural clocks. In a transmit mode, in response to one or more of the clocks generated by the TAC port, the IQ port retrieves from its memory prestored discrete I and Q samples and reconstructs therefrom arbitrary transmit analog i and q signals which are provided to the RF subsystem under test.

Abstract: The invention is directed to a BGA package and method for making a BGA package in which warpage, delamination and package cracking are reduced. The inventive BGA package has a die attached to one surface of a substrate. The substrate may terminate at its opposite surface in an array of connection ports which is an integral part of the substrate. Alternatively, the array of connection ports is attached to the opposite surface of the substrate. The connection ports may be attach pads attached to the opposite surface of the substrate and solder balls or metal bumps attached to the attach pads. A matrix of molding compound fully encapsulates the substrate, die and the array of connection ports. The matrix molding compound is then ground to provide a flat surface and to expose portions of the connection ports. Another array of connection ports, such as an array of solder balls or metal bumps, may be attached to the existing array of connection ports.

Abstract: The invention is directed to a BGA package and method for making a BGA package in which warpage, delamination and package cracking are reduced. The inventive BGA package has a die attached to one surface of a substrate. The substrate may terminate at its opposite surface in an array of connection ports which is an integral part of the substrate. Alternatively, the array of connection ports is attached to the opposite surface of the substrate. The connection ports may be attach pads attached to the opposite surface of the substrate and solder balls or metal bumps attached to the attach pads. A matrix of molding compound fully encapsulates the substrate, die and the array of connection ports. The matrix molding compound is then ground to provide a flat surface and to expose portions of the connection ports. Another array of connection ports, such as an array of solder balls or metal bumps, may be attached to the existing array of connection ports.

Abstract: A baseband simulation system is disclosed for testing an RF subsystem of a communication device, such as a cellular telephone, cordless telephone, etc. A preferred embodiment has a computer connected to an interface card which in turn is connected to a baseband simulation subsystem. The baseband simulation subsystem is connected to the RF subsystem under test. The baseband simulation subsystem includes three ports: a timing and control (TAC) port, an IQ port, and general purpose input output (GPIO) port. The TAC port receives a master clock signal from an external source and generates plural clocks therefrom. The IQ and GPIO ports receives at least one of these plural clocks. In a transmit mode, in response to one or more of the clocks generated by the TAC port, the IQ port retrieves from its memory prestored discrete I and Q samples and reconstructs therefrom arbitrary transmit analog i and q signals which are provided to the RF subsystem under test.

Abstract: A low-voltage multipath-miller-zero-compensated operational amplifier is disclosed which includes a class AB front stage and a class AB back stage. The front stage has an inverted input, a non-inverted input, an inverted output, and a non-inverted output. The back stage has an output and input, which input is connected to the non-inverted output of the front stage. The output of the back stage is connected to the inverted output of the front stage. A capacitor is coupled in a feedback loop between the output and inverted input of the back stage. An operational amplifier in accordance with the present invention is particularly well-suited for use in switched-capacitor filters, continuous-time filters, microwave medical applications and general purpose amplification applications.

Abstract: A dispenser contains a chamber enclosed by an upper wall and a lower wall, both walls are oriented parallel to each other. The upper wall has a vertically bored inlet port and the lower wall has a plurality of vertically bored outlet ports for providing access to the chamber. The outlet ports are geometrically arranged in an array pattern characterized by equidistantly spaced rows and columns of bores. There is a plurality of baffle plates interposed between the upper wall and the lower wall. The baffle plates, which are spatially separated from each other, are oriented parallel to and spatially separated from the upper and lower walls. The baffle plates have a plurality of vertically bored holes for providing access between the inlet port and the outlet ports, whereby the dispenser is effective in providing homogeneous flow of fluid through the outlet ports.

Abstract: The present invention relates to a lead frame design for IC packaging to reduce chip stress and deformation and to improve mold filling. The die-pad is split into several sections which are jointed together by flexible expansion joints. The split die-pad allows relative motion between the pad and the chip during die attach cure. It also breaks down the total die pad area (and length) that is rigidly attached to the chip into smaller sections. These two factors reduce the magnitude of coefficient-of-thermal expansion (CTE) mismatch and out of plane deformation of the assembly, resulting in lower chip stress and deformation and improved package moldability.

Abstract: A baseband simulation system is disclosed for testing an RF subsystem of a communication device, such as a cellular telephone, cordless telephone, etc. A preferred embodiment has a computer connected to an interface card which in turn is connected to a baseband simulation subsystem. The baseband simulation subsystem is connected to the RF subsystem under test. The baseband simulation subsystem includes three ports: a timing and control (TAC) port, an IQ port, and general purpose input output (GPIO) port. The TAC port receives a master clock signal from an external source and generates plural clocks therefrom. The IQ and GPIO ports receives at least one of these plural clocks. In a transmit mode, in response to one or more of the clocks generated by the TAC port, the IQ port retrieves from its memory prestored discrete I and Q samples and reconstructs therefrom arbitrary transmit analog i and q signals which are provided to the RF subsystem under test.

Abstract: The present invention describes a circuit for performing high speed forward Scaled Discrete Cosine Transform (SDCT) and inverse Scaled Discrete Cosine Transform (ISDCT) in pipeline architecture which is ideally, but not exclusively, used for compressing and decompressing large volume image data in real time. A high throughput of image data transform and inverse transform is achieved with a relatively slow internal clock. The four stage pipeline architecture of the present invention requires no more than five multipliers in rendering either the forward SDCT or inverse SDCT coefficients. The lower-order SDCT's for either the forward or the inverse direction are imbedded in the higher-order forward SDCT or inverse SDCT respectively. By taking advantage of the recursive properties of the SDCT's, a larger size SDCT can be always implemented by using a combination of variants of smaller size SDCT.

Abstract: A small and easy to fabricate programmable current source correction circuit. The correction circuit consists of a first current division circuit for establishing a reference current; a programmable correction current circuit for establishing the amount of correction current required; a second current division circuit for further reducing the reference current into smaller step or resolution; and a source-sink controlling circuit for determining whether the present invention is to operate as a current sink or current source. The present invention consists of substantially less number of circuit modules and can be fully integrated into a single chip which requires substantially smaller chip area and can operates at a substantially higher frequency compared to prior art.