Abstract: The present invention is related to an analogue-to-digital (A/D) converter comprising at least two voltage comparator devices. Each of the voltage comparator devices is arranged for being fed with a same input signal and for generating an own internal voltage reference. The two internal voltage references are different. Each voltage comparator is arranged for generating an output signal indicative of a bit position of a digital approximation of said input signal.

Abstract: The present invention relates to a large time constant steering circuit for slowly changing a voltage on a node between at least two discrete voltage levels. The present invention further relates to a slow steering current DAC comprising said large time constant steering circuit. The present invention further relates to an instrumentation amplifier device comprising a current balancing instrumentation amplifier for amplifying an input signal to an amplified output signal and a DC servo-loop for removing a DC-component from the input signal. The present invention further relates to an EEG acquisition ASIC comprising said instrumentation amplifier device.

Abstract: One embodiment of the invention comprises a first semiconductor structure in electrical contact with a first contact region, a second semiconductor structure in electrical contact with a second contact region, the first semiconductor structure and the second semiconductor structure being in electrical contact with each-other along an interface, a modulating section configured to modulate the conductivity in at least one of the semiconductor structures, so that the conductivity varies along the interface, in such a way that if current flows across the interface, the current can flow only at a predetermined position along the interface, and substantially no current can flow at either side of the predetermined position.

Abstract: A method and apparatus for transforming a description of an encoded bit stream is described. The encoded bit stream comprises data packets and the description is written in a markup language such as BSDL. A group of one or more data packets is described in the description by an element, the element having at least one attribute containing a transformation tag. The description is scanned to check for a transformation tag in accordance with a predetermined condition and an adapted description is generated. The transformation of multimedia files is described to provide for content scalability. The adaptation approach works as follows: instead of directly adapting the bit stream, the description of the bit stream is modified, by use of so-called style sheets. Therefore, from the modified description a binary form file can be generated.

Abstract: The present invention recites a new method for manufacturing Group III-N field-effect devices, such as HEMT, MOSHFET, MISHFET devices or MESFET devices, grown by Metal-Organic Vapor Phase Expitaxy, with higher performance (power), by covering the surface with a thin SiN layer on the top AlGaN layer, in the reactor where the growth takes place at high temperature, prior cooling down the structure and loading the sample out of the reactor, as well as a method to produce some HEMT transistors on those heterostructures, by depositing the contact on the surface without any removal of the SiN layer by MOCVD. The present invention recites also a device.

Abstract: The present invention is related to a method for singulating chips from a stack of layers, such as the layers on a wafer or substrate. The stack of layers includes a front end of line (FEOL) layer upon the substrate layer, with the substrate layer having a first surface and a second surface. The FEOL is positioned on top of the first surface, and a back end of line (BEOL) layer is positioned on top of the FEOL. The method includes etching singulating trenches through the BEOL, through the FEOL and at least partially through the substrate layer, depositing a passivation layer on the stack provided with singulating trenches, whereby the sidewalls of the etched singulating trenches are at least partially passivated. Dicing, such as blade dicing, laser dicing or trench etch dicing is performed, releasing the chip from the stack of layers.

Abstract: A platform supporting reconfigurable computing, enabling the introduction of reconfigurable hardware into portable devices is described. Dynamic hardware/software multitasking methods for a reconfigurable computing platform including reconfigurable hardware devices such as gate arrays, especially FPGA's, and software, such as dedicated hardware/software operating systems and middleware, adapted for supporting the methods, especially multitasking, are described. A computing platform, which is a heterogeneous multi-processor platform, containing one or more instruction set processors (ISP) and a reconfigurable matrix (for instance a gate array, especially an FPGA), adapted for (dynamic) hardware/software multitasking is described.

Abstract: A dual work function semiconductor device and method for fabricating the same are disclosed. In one aspect, a device includes a first and second transistor on a first and second substrate region. The first and second transistors include a first gate stack having a first work function and a second gate stack having a second work function respectively. The first and second gate stack each include a host dielectric, a gate electrode comprising a metal layer, and a second dielectric capping layer therebetween. The second gate stack further has a first dielectric capping layer between the host dielectric and metal layer. The metal layer is selected to determine the first work function. The first dielectric capping layer is selected to determine the second work function.

Abstract: A technique is described for the preparation of polymers according to a process in which the starting compound of formula (I) is polymerized in the presence of a base in an organic solvent. No end chain controlling agents are required during the polymerisation to obtain soluble precursor polymers. The precursor polymer such obtained comprises structural units of the formula (II). In a next step, the precursor polymer (II) is subjected to a conversion reaction towards a soluble or insoluble conjugated polymer by thermal treatment. The arylene or heteroarylene polymer comprises structural units of the formula III. In this process the dithiocarbamate group acts as a leaving group and permits the formation of a precursor polymer of structural formula (II), which has an average molecular weight from 5000 to 1000000 Dalton and is soluble in common organic solvents. The precursor polymer with structural units of formula (II) is thermally converted to the conjugated polymer with structural formula (III).

Abstract: A method for fabricating a semiconductor device and the device made thereof are disclosed. In one aspect, the method includes providing a substrate comprising a semiconductor material. The method further includes patterning at least one fin in the substrate, the fin comprising a top surface, at least one sidewall surface, and at least one corner. A supersaturation of point defects is created in the at least one fin. The at least one fin is annealed and then cooled down such that semiconductor atoms of the semiconductor material migrate via the point defects.

Abstract: A method for trimming an effective refractive index of optical waveguiding structures made for example in a high refractive index contrast material system. By compaction of cladding material in a compaction area next to patterns or ridges that are formed in the core material for realizing an optical waveguiding structure, the effective index of refraction of the optical waveguiding structure can be trimmed. Thus, the operating wavelength of an optical component comprising such an optical waveguiding structure can be trimmed. An optical waveguide structure thus obtained is also disclosed.

Abstract: A method for producing narrow trenches in semiconductor devices. The narrow trenches are formed by chemically changing the properties of a first dielectric layer locally, such that the side walls of a patterned hole in the first dielectric layer is converted locally and becomes etchable by a first etching substance. Subsequently a second dielectric material is deposited in the patterned structure and the damaged part of the first dielectric material is removed such that small trenches are obtained.

Abstract: A digital receiver is disclosed. In one aspect, the receiver includes a receiving module for receiving packetized data. The receive may further include a first processing module for packet detection having a first programmable processor. The receiver may further include a second processing module for demodulation and packet decoding having a second programmable processor. The receiver may further include a first digital receive controller having a third processor arranged for being notified of detection of data by the first processing module and for activating the second processing module.

Abstract: The present invention provides a method for producing a layer of organic material. The method comprises providing onto a substrate, under deposition conditions, a layer of a solution comprising said organic material dissolved in a solvent; optionally partially drying said layer of solution; thereafter annealing said layer of solution, said annealing being applied before said layer of solution has been dried out completely and the duration of said annealing being limited such that said layer of solution is not dried out completely during the annealing, said annealing inducing reflow of said layer of solution; and thereafter drying out said layer of solution, said drying out being controlled such that it is performed slower than it would be under deposition conditions. The resulting layer of organic material shows an improvement of both the micro quality and the macro quality, leading to obtaining a fully continuous film with minor surface roughness and an accurate line resolution and edge definition.

Abstract: The present invention provides a method for in-situ cleaning of walls of a reaction chamber, e.g. reactive ion etching chamber, to remove contamination, e.g. copper comprising contamination from the walls. The method comprises converting the contamination, e.g. copper comprising contamination into a halide compound, e.g. copper halide compound and exposing the halide compound, e.g. copper halide compound to a photon comprising ambient, thereby initiating formation of volatile halide products, e.g. volatile copper halide products. The method furthermore comprises removing the volatile halide products, e.g. volatile copper halide products from the reaction chamber to avoid saturation of the volatile halide products, e.g. volatile copper halide products in the reaction chamber in order to avoid re-deposition of the volatile halide products, e.g. volatile copper halide products to the walls of the reaction chamber.

Abstract: A method for manufacturing a dual work function semiconductor device is disclosed. In one aspect, the method relates to providing a substrate with a first and a second region. A gate dielectric is formed overlying the first and the second region. A metal gate layer is formed overlying the gate dielectric on the first and the second region. The metal gate layer has a first (as-deposited) work function that can be modified upon inducing strain thereon. The method further relates to selecting a first strain which induces a first pre-determined work function shift (?WF1) in the first (as-deposited) work function of the metal gate layer on the first region and selectively forming a first strained conductive layer overlying the metal gate layer on the first region, the first strained conductive layer exerting the selected first strain on the metal gate layer.

Abstract: A method of depositing a structural SiGe layer is presented. The structural SiGe layer may be located on top of a sacrificial layer above a substrate. The substrate may contain a semiconductor device such as a CMOS electronic circuit. The presented method uses a silicon source and a germanium source in a reaction zone to grow the structural SiGe layer. Hydrogen is introduced into the reaction zone and it may be used to dilute the silicon source and the germanium source. The resultant reaction occurs at temperatures below 450 degrees C., thereby preventing degradation of electronic device and/or other devices/materials located in the substrate.

Abstract: The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (1) comprising a bipolar transistor with in that order a collector region (2), a base region (3), and an emitter region (4), wherein the semiconductor body comprises a projecting mesa (5) comprising at least a portion of the collector region (2) and the base region (3), which mesa is surrounded by an isolation region (6). According to the invention, the semiconductor device (10) also comprises a field effect transistor with a source region, a drain region, an interposed channel region, a superimposed gate dielectric (7), and a gate region (8), which gate region (8) forms a highest part of the field effect transistor, and the height of the mesa (5) is greater than the height of the gate region (8). This device can be manufactured inexpensively and easily by a method according to the invention, and the bipolar transistor can have excellent high-frequency characteristics.

Abstract: A method for manufacturing a non-volatile memory device is described. The method comprises growing a layer in a siliconoxide consuming material, e.g. DyScO, on top of the upper layer of the layer where charge is stored. A non-volatile memory device is also described. In the non-volatile memory device, the interpoly/blocking dielectric comprises a layer in a siliconoxide consuming material, e.g. DyScO, on top of the upper layer of the layer where charge is stored, the siliconoxide consuming material having consumed at least part of the upper layer.

Abstract: A method for estimating transceiver non-idealities is disclosed. In one aspect, the method comprises generating a preamble comprising multiple sets of known training sequences with a synchronization part preceding an estimation part. The training sequences in the estimation part comprises at least two sequences which are (i) complementary Golay sequence pairs and (ii) selected to satisfy a predetermined correlation relationship chosen for estimation of a first non-ideality characteristic. A first estimate of a non-ideality characteristic is determined on the basis of the known training sequences of the synchronization part of the received preamble. The estimation part of the received preamble is compensated by this estimate. Another non-ideality characteristic is determined by the compensated estimation part, exploiting the predetermined correlation relationship.