Patents Assigned to Kabushiki Kaisha Nihon Micronics
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Patent number: 9759744Abstract: A contact inspection device including contacts that contact with a test object for inspection, each contact having a base end portion, a needle tip portion having a needle tip that contacts with the test object, and an elastically deformable portion located between the base end portion and the needle tip portion, with the base end portion and the needle tip portion having axes which coincide with each other. The elastically deformable portion is deformable under a compressive force applied in the axial direction of the needle tip portion while the needle tip is pressed against the test object and converts the compressive force into a tilting motion of the needle tip portion about the needle tip through deformation. The needle tip portion is displaceable in a direction in which the needle tip portion is pivotally tilted while the needle tip is pressed against the test object.Type: GrantFiled: July 8, 2013Date of Patent: September 12, 2017Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventor: Kentaro Tanaka
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Patent number: 9748596Abstract: Provided is a secondary battery adopting an all-solid-state secondary cell structure with a storage layer sandwiched between a positive electrode layer and a negative electrode layer and which is superior to a conventional secondary battery with respect to at least one of volume, manufacturing, and positioning. The present invention provides a secondary battery including a single-layer secondary cell having a folded structure that a sheet-shaped single-layer secondary cell with a storage layer sandwiched between a positive electrode layer and a negative electrode layer is folded in two or four.Type: GrantFiled: April 25, 2013Date of Patent: August 29, 2017Assignees: Kabushiki Kaisha Nihon Micronics, Guala Technology Co., Ltd.Inventors: Takuo Kudoh, Kiyoyasu Hiwada, Shozo Izumo, Tomokazu Saito, Akira Nakazawa
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Patent number: 9735594Abstract: A charging/discharging device performs charging and discharging on a plurality of secondary cells concurrently in parallel, without adopting a power source having an extremely high current supply capacity. A plurality of switching units controlled by a switching control unit are interposed respectively between the secondary cells and each of a plurality of charging power lines and discharging power lines. A power unit applies voltages having mutually-different voltage values and the switching control unit controls switching so that the respective secondary cells are connected cyclically in predetermined order to the charging and discharge power lines.Type: GrantFiled: July 23, 2013Date of Patent: August 15, 2017Assignees: KABUSHIKI KAISHA NIHON MICRONICS, GUALA TECHNOLOGY CO., LTD.Inventors: Harutada Dewa, Kiyoyasu Hiwada, Tomokazu Saito, Kazuyuki Tsunokuni, Akira Nakazawa
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Publication number: 20170146593Abstract: An electrical contactor of this invention includes: a first plunger to contact one member, the first plunger including a tip portion formed into a plurality of chevron shapes; a second plunger to contact a counterpart member, the second plunger working in cooperation with the first plunger to form electrical conduction between the one member and the counterpart member; and a spring part to couple the tip portion of the first plunger and a tip portion of the second plunger while the tip portion of the first plunger and the tip portion of the second plunger are pointed in opposite directions. The spring part covers an outer periphery of a part where the first plunger and the second plunger are coupled and supports the first plunger and the second plunger in a manner that allows the first plunger and the second plunger to slide relative to each other.Type: ApplicationFiled: September 29, 2016Publication date: May 25, 2017Applicant: KABUSHIKI KAISHA NIHON MICRONICSInventor: KENICHI SHIBUTANI
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Patent number: 9638746Abstract: A probe card comes in touch with a test object to perform an inspection. The probe card contains: a probe substrate provided with a plurality of probes on the first surface and a plurality of anchor receiving portions on the second surface; and a supporting body disposed to support the periphery of the probe substrate, with at least a plurality of anchor receiving portions located within a probe existence region being arranged regularly and at an equal distance from each other on the second surface of the probe substrate.Type: GrantFiled: November 27, 2013Date of Patent: May 2, 2017Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Yoshiro Nakata, Yoshinori Kikuchi, Hirose Fujita
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Patent number: 9622344Abstract: A multi-layer wiring board includes wiring layers stacked on a substrate with an insulating layer between each layer. A wire formed in the wiring layer consists of a first layer and a second layer to form a double layered structure. The first layer is made of a first conductive material and the second layer is made of a second conductive material having relative magnetic permeability of 10 or more and larger than that of the first conductive material. The characteristic impedance of the wire is adjusted to a value closer to 50 ohms than that of a wire which has the same thickness as of the wire with the double layered structure, and is made only of the first conductive material.Type: GrantFiled: February 28, 2013Date of Patent: April 11, 2017Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Tatsuo Inoue, Takayasu Sugai, Toshiyuki Kudo, Toshinori Omori
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Patent number: 9599844Abstract: An inspection apparatus capable of reducing the effect of noises is provided. An inspection apparatus according to the present invention includes a work table 26 on which an object, a fixed body 28 disposed above the work table 26, a probe assembly that holds a probe stylus 38a, a support base member 40 supported on the fixed body 28, a suspension mechanism 46 that supports the probe assembly 38 above the work table 26, and a signal circuit substrate 54 including therein an IC chip 54a that generates an inspection signal supplied to the probe stylus 38a, the signal circuit substrate 54 being supported by the suspension mechanism 46 below the suspension mechanism 46, in which the probe assembly 38 and the support base member 40 are electrically isolated from each other.Type: GrantFiled: October 23, 2014Date of Patent: March 21, 2017Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventor: Takayoshi Kudo
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Patent number: 9568500Abstract: An electrical test probe according to an embodiment includes a probe main body portion having a connection end to a circuit of a probe base plate and made of a first metal material with resiliency, and a probe tip portion having a probe tip, made of a second metal material with higher hardness than that of the first metal material for the probe main body portion, and communicating with the probe main body portion, wherein the probe main body portion and the probe tip portion are provided with a current path made of an equal metal material extending from the probe tip to the connection end.Type: GrantFiled: May 9, 2013Date of Patent: February 14, 2017Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Hideki Hirakawa, Yuko Kanazawa
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Patent number: 9535108Abstract: An inspection apparatus for inspecting an inspection object. The inspection object includes a base body and wiring passing through the base body. The inspection apparatus includes an insulating substrate, a first electrode in the substrate with a portion of the first electrode exposed from a surface of the substrate to form a connection portion which may be electrically connected with the wiring, and a second electrode in the substrate. The first electrode and the second electrode are spaced apart, have mutually parallel portions, and are electrically insulated from each other.Type: GrantFiled: October 3, 2014Date of Patent: January 3, 2017Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventor: Yoshiyuki Fukami
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Patent number: 9535090Abstract: An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.Type: GrantFiled: June 11, 2014Date of Patent: January 3, 2017Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Tatsuo Inoue, Hidehiro Kiyofuji, Osamu Arai
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Patent number: 9476934Abstract: An inspection apparatus for inspecting a wiring board having an opposing electrode facing an upper face of the wiring board, a capacitance meter electrically connected to the opposing electrode and the multi-layer wiring, and measuring capacitance between the opposing electrode and the multi-layer wiring, ground, a switch box that is connected to the ground wirings, the opposing electrode, and the ground, and switches to select between a first connection state, in which all the ground wirings are electrically connected to the opposing electrode, and a second connection state, in which one ground wiring is electrically connected to the ground. A control unit extracts a capacitance value by calculating difference between a first capacitance and a second capacitance, wherein capacitance in units of layers of the multi-layer wiring are measured based on the capacitance value extracted by the control unit.Type: GrantFiled: April 25, 2014Date of Patent: October 25, 2016Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventor: Yoshiyuki Fukami
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Patent number: 9442160Abstract: A probe assembly includes a wiring base plate arranged on a lower surface side of a reinforcing plate and a probe base plate arranged on a lower surface side of the wiring base plate. The probe base plate includes a plurality of probes on a lower surface thereof and a plurality of anchor portions on an upper surface thereof, respectively. The anchor portions are set so that a height of the anchor portion arranged at a center portion of the probe base plate may be greater than a height of the anchor portion located at a peripheral portion of the probe base plate. Between the respective anchor portions and the reinforcing plate are arranged a plurality of brace portions corresponding to the plurality of anchor portions and determining a space between the probe base plate and the wiring base plate together with the anchor portions.Type: GrantFiled: March 10, 2014Date of Patent: September 13, 2016Assignee: Kabushiki Kaisha Nihon MicronicsInventor: Yoshiro Nakata
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Patent number: 9435854Abstract: An electrical contactor has a contact portion that is pressed onto a terminal of an electronic device and is electrically connected. When the dimension of the contact portion is S1, the contact dimension of the contact portion and the terminal of the electronic device is V, the amount of sliding of the contact portion is W, and the additional element including at least positional accuracy of the contact portion is X, the dimension of the contact portion S1 satisfies S1>V+W+X. In a contact method for the electrical contactor, when the sum of a clearance on the front end side in the sliding direction in starting contact and a clearance on the back end side in the sliding direction in ending contact is X3, the crushed area S2 of the terminal is set to satisfy a relationship of S2<S1?X3.Type: GrantFiled: June 11, 2013Date of Patent: September 6, 2016Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Mika Nasu, Akihiro Karouji, Takayuki Hayashizaki
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Patent number: 9400309Abstract: An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads.Type: GrantFiled: June 11, 2014Date of Patent: July 26, 2016Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Hidehiro Kiyofuji, Tatsuo Inoue, Osamu Arai, Kenji Sasaki
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Publication number: 20160146884Abstract: A contact inspection device includes: plural probes each having a first end to be brought into contact with a test object; a probe substrate including contact portions in contact with respective second ends of the probes; a probe head through which the probes extend and which is detachably attached to the probe substrate; and plural positioning members which are provided on a surface of the probe head facing the probe substrate and through which the probes extend. Each probe has a rotation restricted portion provided on the side of the second end. Each positioning member has rotation restricting portions adapted to engage the rotation restricted portions. When the positioning members are moved relative to each other, the rotation restricting portions align the probes and switch the probes from a rotation unrestricted state to a rotation restricted state.Type: ApplicationFiled: November 6, 2015Publication date: May 26, 2016Applicant: Kabushiki Kaisha Nihon MicronicsInventor: Mika NASU
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Patent number: D765602Type: GrantFiled: March 27, 2015Date of Patent: September 6, 2016Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Mika Nasu, Takashi Kawano, Tetsuya Yoshioka
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Patent number: D766187Type: GrantFiled: March 27, 2015Date of Patent: September 13, 2016Assignee: KABUSHIKI KAISHA NIHON MICRONICInventors: Mika Nasu, Takashi Kawano, Tetsuya Yoshioka
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Patent number: D766188Type: GrantFiled: March 27, 2015Date of Patent: September 13, 2016Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Mika Nasu, Takashi Kawano, Tetsuya Yoshioka
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Patent number: D770985Type: GrantFiled: March 27, 2015Date of Patent: November 8, 2016Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Mika Nasu, Takashi Kawano, Tetsuya Yoshioka
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Patent number: D770986Type: GrantFiled: October 22, 2015Date of Patent: November 8, 2016Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Mika Nasu, Takashi Kawano, Tetsuya Yoshioka