Abstract: An inspection unit in which a probe card is united with a connection body via a vacuum chamber. It prevents flatness of tips of probes provided on the probe card from worsening when the probe card is united with a connection body by suction force (negative pressure) of the vacuum chamber. The inspection unit includes a probe card with probes on a first surface and a connection body united with a second surface of the probe card via a first vacuum chamber. The first chamber is formed with a plurality of chambers.

Abstract: A method for manufacturing a probe, includes forming a recess on a sacrificial layer with a resist matching a plane pattern of the probe and a fixing tab connected to the probe, the recess exposing the sacrificial layer, which is on a baseboard, forming the probe and the fixing tab connected to the probe by depositing a probe material in the recess, and removing the resist, removing a portion of the sacrificial layer in an etching process. The portion of the sacrificial layer under the probe is fully removed, while the portion of the sacrificial layer under the fixing tab is left to provide support portions of the sacrificial layer under the fixing tab. Then the probe is removed from the baseboard.

Abstract: An inspection apparatus and an inspection method is provided having a wafer chuck stage equipped with one or more wafer chucks; a position measurement unit for measuring the positions of the light emitting devices on each of the expanded wafers loaded respectively on the wafer chucks; a photodetector and at least one probe provided corresponding to each of the expanded wafers; and a control unit provided with means for moving the wafer chuck stage in the X axis and/or Y-axis directions such that the light emitting devices on each of the expanded wafers are sequentially brought under the corresponding probes, means for moving each of the probes to a place corresponding to the electrodes in the light emitting devices, and means for bringing the probes into contact with the corresponding electrodes.

Abstract: An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.

Abstract: A method for manufacturing a probed for an electrical test includes producing by a deposition technique a deposit including a probe main body portion made of a nickel-boron alloy and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from the probe main body portion. The method further includes annealing the deposit. The average grain diameter of the nickel-boron alloy is between 97 ? and 170 ?. The contained amount of boron is from 0.02 wt % to 0.20 wt %.

Abstract: A method for manufacturing an electric film body is made by forming a film body to have a shape in accordance with a desired electric characteristic and includes a film forming process for forming an electric film body on a board layer, an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process, an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process, and an electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process.

Abstract: A contact probe electrically connects the tester side and an electrode pad of a circuit to be tested. This contact probe has a mounting portion on a base end portion mounted on a probe card, a contact portion on a distal end portion brought into contact with the electrode pad, and an arm portion between them elastically supporting the contact portion. The contact portion is provided on a lower end portion of a base portion integrally mounted on a distal end portion of the arm portion. The arm portion has a one-side arm piece supporting the base portion and allowing vertical movement of the base portion and the other-side arm piece supporting the base portion and adjusting an inclination angle of the base portion to reduce a scrub amount of the contact portion. The probe card uses the above-described contact probe.

Abstract: An embodiment of an electrical connecting apparatus enables reliable identification of a mark and enables accurate and easy determination of a coordinate position of the mark. The electrical connecting apparatus comprises a supporting body having a lower surface, a plurality of contacts arranged on the lower surface of the supporting body, a mark that is provided on a lower side of the supporting body and whose light passing feature differs from that of an area adjacent to the mark, and a light source provided to the supporting body to irradiate light to the mark from an upper side of the mark.

Abstract: A contact inspection device including contacts that contact with a test object for inspection, each contact having a base end portion, a needle tip portion having a needle tip that contacts with the test object, and an elastically deformable portion located between the base end portion and the needle tip portion, with the base end portion and the needle tip portion having axes which coincide with each other. The elastically deformable portion is deformable under a compressive force applied in the axial direction of the needle tip portion while the needle tip is pressed against the test object and converts the compressive force into a tilting motion of the needle tip portion about the needle tip through deformation. The needle tip portion is displaceable in a direction in which the needle tip portion is pivotally tilted while the needle tip is pressed against the test object.

Abstract: An electrode and wiring can be provided on an FPC board without restriction by a through hole. A probe card in which an FPC board of a probe assembly is fixed to the main board side by a clamp mechanism is provided. The clamp mechanism is provided with a fixing ring fixed to the main board side and on which the FPC board is mounted and a rotating ring screwed into the fixing ring and pressing a peripheral edge portion of the FPC board. In the fixing ring, a pressing ring pressed by screwing of the rotating ring for pressing the peripheral edge portion of the FPC board to the main board side is provided.

Abstract: An electrical test probe according to an embodiment includes a probe main body portion having a connection end to a circuit of a probe base plate and made of a first metal material with resiliency, and a probe tip portion having a probe tip, made of a second metal material with higher hardness than that of the first metal material for the probe main body portion, and communicating with the probe main body portion, wherein the probe main body portion and the probe tip portion are provided with a current path made of an equal metal material extending from the probe tip to the connection end.

Abstract: In a method for manufacturing a circuit board, as a photomask adapted to form an etching mask for selective removal of a seed layer covering a conductive portion exposed on an insulating film, a photomask whose opening area has an outline having two sides along two straight lines approaching to each other as the two straight lines extend from a center portion of the opening area in an extending direction of a wiring path is used.

Abstract: An embodiment of an electrical connecting apparatus includes a chip unit having a plurality of electronic components arranged on the upper side of a chip supporting body, a probe unit having a plurality of contacts arranged on the lower side of a probe supporting body, and a connecting unit arranged between the chip unit and the probe unit and having a connecting member supporting body and a plurality of connecting members electrically connecting the chip unit to the probe unit. The chip unit, the probe unit and the connecting unit are vacuum-coupled.

Abstract: An electrical connecting apparatus includes a wiring base plate having a first surface coupled with a reinforcing plate and provided on an opposite surface with first electrical connection portions, a probe base plate provided on a first surface with second electrical connection portions corresponding to the first electrical connection portions and provided on a second surface with probes electrically connected to the second electrical connection portions, anchor portions formed on the first surface of the probe base plate and provided with screw holes, cylindrical spacers having first ends removably coupled with the anchor portions, having screw grooves, and passing through the wiring base plate and the reinforcing plate, reference plates having reference planes to receive the spacers and removably coupled with the reinforcing plate, shims inserted between the respective reference plates and the reinforcing plate, and bolt screwed in the screw groove of the spacer.

Abstract: An embodiment of an electrical connecting apparatus comprises a probe base plate and a plurality of contacts provided with tips to be pressed against electrodes of a device under test and arranged on the underside of the probe base plate. The distance dimensions from an imaginary plane parallel to the probe base plate to the tips of the contacts are made the greater toward the center of the probe base plate.

Abstract: An inspection apparatus includes a probe card having a plurality of probes arranged to correspond to each chip of a semiconductor wafer under inspection and contacting a plurality of electrodes of each chip and a test head electrically connected to the respective probes of the probe card and applying test signals from a tester, and a plurality of tester lands of a probe substrate electrically connected respectively to the plurality of probes. A plurality of electrical connecting portions on the tester side of the test head, corresponding to the respective tester lands, are arranged to constitute a plurality of arrangement areas sectioned to correspond to the respective chips under inspection, and the plurality of probes of the probe substrate are connected to the corresponding tester lands provided in the arrangement areas in units of chips under inspection.

Abstract: A semiconductor chip module having high degree of freedom in assignment of a circuit to each semiconductor chip and in position of a connection terminal of each semiconductor chip is provided. The present invention relates to a semiconductor chip module in which a plurality of semiconductor chips, each provided on the side face thereof with a part of a connection terminal coupled with a circuit pattern formed on the front face, have been stacked and bonded. Connection terminal portions on the side faces of the respective semiconductor chips are interconnected by a wiring pattern. The connection terminal on the semiconductor chip is led from the front face to the side face and formed by applying spraying of a conductive material in a mist state.

Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.

Abstract: A wafer prober is provided with a tray which supports a wafer at a set position, transports it to a processing position of the wafer and is placed at the processing position; one or more alignment units which position the wafer at the set position with respect to the tray; contact units arranged in number larger than that of the alignment units and performing inspection processing in contact with the wafer at the processing position; and a tray transport portion for transporting the tray supporting the wafer between the alignment unit and the contact unit. The tray is provided with three or more pin holes for allowing movement of the chuck pin in the XYZ? directions, an alignment mark for positioning the wafer, and an alignment portion for positioning the tray itself.