Abstract: An inspection apparatus is provided, which includes probes for front side electrodes, probes for back side electrodes, and a chuck stage. The probes for front side electrodes and the probes for back side electrodes are formed on the upper surface of the chuck stage, and the probe contact area electrically continues to the wafer holding area, and the probes for front side electrodes and the probes for back side electrodes are located leaving a distance in horizontal direction between them so that the probes for back side electrodes move relatively within the probe contact area when the probes for front side electrodes are moved relatively within the wafer under test by the movement of the chuck stage.

Abstract: There is provided an electrode structure for preventing cracks occurring in a metal electrode due to heating in a manufacturing process in the case of stacking an insulating resin and the metal electrode which are different in thermal expansion coefficient. An electrode for a semiconductor circuit, stacked on a substrate made of an insulating resin, has an electrode structure composed of a main electrode including a slit formed by cutting out a part thereof to prevent occurrence of a crack in a manufacturing process caused by a difference in thermal expansion coefficient from the substrate, and an auxiliary electrode that covers the slit in the main electrode. No slit is provided but a bridge is formed at a portion where the slit in the main electrode and the slit in the auxiliary electrode overlap with each other, thereby eliminating a gap portion where the electrode does not exist.

Abstract: A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes.

Abstract: A method for manufacturing a probe card prepares a plurality of probes, each having a metal layer on an attaching portion, and hot-melt material covering the metal layer. Each probe is attached to a probe substrate by inserting its attaching portion into a different through hole of the probe substrate so that at least a part of the metal layer is located in the through hole. The hot-melt material of each attaching portion is melted and thereafter solidified such that the hot-melt material contacts the metal layer and a part of a wall surface of the through hole, to fix each probe to the probe substrate.

Abstract: The object of the present invention is to provide a multi-layer wiring board which is easy to adjust the characteristic impedance and is able to adapt to the narrow-pitch tendency of terminals, and a process for manufacturing the same.

Abstract: Provided is a secondary battery in which a single-layer secondary cell has an all-solid-state secondary cell structure with a storage layer sandwiched between a positive electrode layer and a negative electrode layer and which is superior to a conventional secondary battery with respect to at least one of volume, operation, and positioning. The present invention provides a secondary battery including a folded single-layer secondary cell formed by folding a sheet-shaped single-layer secondary cell, with a storage layer sandwiched between a positive electrode layer and a negative electrode layer, two or more times while alternately reversing the folding direction.

Abstract: An embodiment disperses a force acting on a border portion between an extending portion and a pedestal portion or a reinforcing member to prevent breakage of a probe tip portion of a probe. An electrical test probe includes a probe main body, a recess provided at an end of the main body and having an inner surface, and a probe tip having a part received in the recess. The inner surface has a central area and two lateral areas on both sides of the central area, and the part of the probe tip is located at the central area and at least at either one of the lateral areas.

Abstract: A repair apparatus of a sheet type cell that is capable of appropriately repairing and detoxifying defects of a sheet type cell having semiconductor characteristics is provided. The repair apparatus repairs a sheet type cell in which a storage layer is sandwiched by layers of a positive electrode and a negative electrode and at least the storage layer has semiconductor characteristics. The repair apparatus includes an electrical stimulation source that applies electrical stimulation between the positive electrode and the negative electrode, an electrical characteristic measurement means that measures electrical characteristics of the sheet type cell when the electrical stimulation is applied, and a control means that specifies a value of the electrical stimulation by the electrical stimulation source while considering measured electrical characteristics.

Abstract: An inspection apparatus for inspecting a wiring board having an opposing electrode facing an upper face of the wiring board, a capacitance meter electrically connected to the opposing electrode and the multi-layer wiring, and measuring capacitance between the opposing electrode and the multi-layer wiring, ground, a switch box that is connected to the ground wirings, the opposing electrode, and the ground, and switches to select between a first connection state, in which all the ground wirings are electrically connected to the opposing electrode, and a second connection state, in which one ground wiring is electrically connected to the ground. A control unit extracts a capacitance value by calculating difference between a first capacitance and a second capacitance, wherein capacitance in units of layers of the multi-layer wiring are measured based on the capacitance value extracted by the control unit.

Abstract: A probe card for an electric test of a device under test on a working table incorporating a heat source includes a circuit base plate including conductive paths connected to a tester, a probe base plate including conductive paths corresponding to the conductive paths and provided with probes connected to the conductive paths, and a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from that of the probe base plate to restrain heat expansion of the probe base plate, and constituting a composite body with the probe base plate. In a case where, when the device under test is at two measuring temperatures, the composite body is at corresponding achieving temperatures, expansion changing amounts of the device under test and the composite body under temperature differences between the respective measuring temperatures and the corresponding achieving temperatures are set to be approximately equal.

Abstract: The purpose of this invention is to provide a repeatedly chargeable and dischargeable quantum battery that is available for a long period of time without an aging change. The quantum battery is charged by causing an n-type metal oxide semiconductor to have a photo-exited structural change, thereby the electrode of quantum battery is prevented from being oxide and a price reduction and stable operation are possible. The repeatedly usable quantum battery is constituted by laminating; a first metal electrode having an oxidation preventing function, charging layer in which an energy level is formed in the band gap by causing an n-type metal oxide semiconductor covered with an insulating material to have a photo-exited structure change and electrons are trapped at the energy level; p-type metal oxide semiconductor layer; and a second metal electrode having the oxidation preventing function, the electrodes are passive metal layers formed of metals having passive characteristics.

Abstract: A sheet type cell in which a storage layer is sandwiched by layers of a positive electrode and a negative electrode is evaluated. The present invention is characterized in that an electrode probe is brought into contact with a measurement part on an outer surface of at least one of the positive electrode and the negative electrode, and quantity of electricity is measured at the measurement part, so as to evaluate the sheet type cell. For example, a charge source and a voltage meter are connected to the electrode probe, and a charge characteristic that changes the sheet type cell from a non-charged state to a fully charged state is detected from a change in a measurement voltage of the voltage meter, so as to make an evaluation.

Abstract: This invention provide a testing device and method for a quantum battery by a semiconductor probe, whereby the electrical characteristics of the charging layer can be evaluated during the quantum battery manufacturing process. The testing device equipped with a semiconductor probe constituted by a conductive electrode and a metal oxide semiconductor layer including a metal oxide semiconductor which are laminated on a support, a source voltage for applying voltage across an electrode equipped to the semiconductor probe and a basic electrode laminated on a secondary battery charging layer, and an ammeter for measuring the current flowing between the electrode equipped on the semiconductor probe and the basic electrode of the secondary battery on which charging layer is laminated, and measures the current-voltage characteristics of the charging layer.

Abstract: A probe assembly includes a wiring base plate arranged on a lower surface side of a reinforcing plate and a probe base plate arranged on a lower surface side of the wiring base plate. The probe base plate includes a plurality of probes on a lower surface thereof and a plurality of anchor portions on an upper surface thereof, respectively. The anchor portions are set so that a height of the anchor portion arranged at a center portion of the probe base plate may be greater than a height of the anchor portion located at a peripheral portion of the probe base plate. Between the respective anchor portions and the reinforcing plate are arranged a plurality of brace portions corresponding to the plurality of anchor portions and determining a space between the probe base plate and the wiring base plate together with the anchor portions.

Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.

Abstract: A probe card comes in touch with a test object to perform an inspection. The probe card contains: a probe substrate provided with a plurality of probes on the first surface and a plurality of anchor receiving portions on the second surface; and a supporting body disposed to support the periphery of the probe substrate, with at least a plurality of anchor receiving portions located within a probe existence region being arranged regularly and at an equal distance from each other on the second surface of the probe substrate.

Abstract: An automatic switching mechanism is controlled by a probe card independent from a tester without limitation of the number of control signals from the tester. A probe card and an inspection apparatus include probes to be brought into contact with electrodes of inspection targets and a power supply channel electrically connecting the probes to a tester. The automatic switching mechanism divides each of the power supply channels into a plurality of power supply wiring portions, which are respectively connected to the probes; and shuts off the power supply wiring responsive to electrical fluctuation such as overcurrent. An electrical fluctuation detection mechanism detects an electrical fluctuation due to a defective product among the inspection targets. A control mechanism, responsive to detection of an electrical fluctuation, shuts off the power supply wiring portion if the electrical fluctuation is caused by the automatic switching mechanism.

Abstract: Provided is a method for manufacturing a multi-layer wiring board and the multi-layer wiring board that are capable of suppressing variation in resistance values. The method according to the present invention is the method for manufacturing a multi-layer wiring board. The method includes forming a resistor thin film, measuring resistance distribution of the resistor thin film, calculating resistor width adjustment rates of the plurality of resistors according to the resistance distribution, forming a pattern of a protective film on the resistor thin film, in which the pattern of the protective pattern has pattern width according to the resistor width adjustment rate, forming a pattern of a plating film on the resistor thin film at a position exposed from the protective film, and etching the resistor thin film at a position exposed from the plating film and the protective film so as to pattern the resistor thin film.

Abstract: Respective plungers are slidably supported in a stable manner without fluctuation, and reliable electrical contact is achieved. In a contact of the present invention, a first plunger and a second plunger include tip end portions provided on tip end sides, slidably supported, and contacting two respective members and sliding portions provided on proximal end sides, formed in halved shapes of the respective plungers, slidably overlapped with each other, and inserted in a compression coil spring. Each of the sliding portions is set to have a length to be slidably supported together with the tip end portion of the other plunger.