Patents Assigned to Kemet Electronics
  • Patent number: 12249463
    Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: March 11, 2025
    Assignee: KEMET Electronics Corporation
    Inventors: Mark R. Laps, John Bultitude, Philip M. Lessner, Lonnie G. Jones, Allen Templeton, Nathan A. Reed
  • Patent number: 12230454
    Abstract: The present invention is related to a polymer dispersion comprising first conductive polymer particles having a positive Z-potential and second conductive polymer particles having a negative Z-potential, a method of forming the polymer dispersion, a method of making a capacitor comprising the polymer dispersion and a capacitor comprising the polymer dispersion.
    Type: Grant
    Filed: February 20, 2024
    Date of Patent: February 18, 2025
    Assignee: KEMET Electronics Corporation
    Inventors: Victor Andoralov, Vania Pais, Débora Sá, Rui A. Monteiro
  • Patent number: 12205775
    Abstract: Provided herein is a method for forming a capacitor and an improved capacitor formed by the method. The method comprises providing an anode with an anode lead extending therefrom. A dielectric is formed on the anode thereby forming an anodized anode. A cathode layer is formed over the dielectric wherein the cathode layer is formed by applying a conductive polymer solution or dispersion and applying a primer solution or dispersion comprising a monophosphonium or monosulfonium cation.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: January 21, 2025
    Assignee: KEMET Electronics Corporation
    Inventors: Yaru Shi, Antony P. Chacko, Ajaykumar Bunha
  • Patent number: 12040135
    Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: July 16, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, Nathan A. Reed, Allen Templeton, James R. Magee, James Davis, Abhijit Gurav, Hunter Hayes, Hanzheng Guo
  • Patent number: 11943869
    Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: March 26, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Peter A. Blais, Robert Andrew Ramsbottom, Jeffrey Poltorak, Courtney Elliott
  • Patent number: 11935705
    Abstract: The present invention is related to a polymer dispersion comprising first conductive polymer particles having a positive Z-potential and second conductive polymer particles having a negative Z-potential, a method of forming the polymer dispersion, a method of making a capacitor comprising the polymer dispersion and a capacitor comprising the polymer dispersion.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: March 19, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Victor Andoralov, Vania Pais, Débora Sá, Rui A. Monteiro
  • Patent number: 11935708
    Abstract: The present invention if related to an improved electrolytic capacitor and a method of making the improved electrolytic capacitor. The electrolytic capacitor comprises an anode comprising a dielectric layer on the anode. A first mordant layer is on the dielectric wherein the first mordant layer comprises a mordant compound of Formula A: wherein: R1 and R2 is independently selected from H; cation, linear alkyl, cyclic alkyl or substituted alkyl of 1 to 10 carbons; R3 is selected from —CR4R5R6 wherein R4 represents a hydrogen, an alkyl of 1-20 carbons or an aryl of 6-20 carbons; R4 and R5 can be taken together to represent a cyclic alkyl or substituted cyclic alkyl or (—CR6OP(O)OR1OR2)n; R5 represents an alkyl of 1-20 carbons or an aryl of 6-20 carbons; R4 and R5 can be taken together to represent a cyclic alkyl or substituted cyclic alkyl or (—CR6OP(O)OR1OR2)n; R6 represents a hydrogen, an alkyl of 1-20 carbons or an aryl of 6-20 carbons; and n is an integer from 1 to 20; and a crosslinker.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: March 19, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Ajaykumar Bunha, Antony P. Chacko
  • Patent number: 11935698
    Abstract: This invention relates to a multilayer ceramic capacitor produced by alternatively stacking the ceramic dielectric layers and internal electrodes mainly comprise base metals. The present dielectric ceramic composition having a main component with a perovskite structure ABO3 formula of: (KxNayLizA1-x-y-z)m(NbuTav)O3 wherein: A, B, x, y, z, u, v, w, m, u, v and w are defined further. The dielectric ceramic composition further contains: a first accessory ingredient composes at least one selected from the rare-earth compounds; a second accessory ingredient composes at least one selected from transition metal compounds; and a third accessory ingredient.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: March 19, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Hanzheng Guo, Abhijit Gurav
  • Patent number: 11935699
    Abstract: Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: March 19, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Evangelista Boni, Federico Fantini, Gabriele Piccinini, Walter Bruno
  • Patent number: 11929215
    Abstract: An improved capacitor is provided wherein the capacitor has an improved bond between the anode and anode wire. The anode comprises a pressed anode powder comprising a first density region and a second density region wherein the second density region has a higher density than the first density region. An anode wire extends into the second density region wherein the anode wire in the second density region is distorted by compression. This allows for better utilization of the metal powder surface area by allowing a lower bulk press density and lower sinter temperature while still achieving the necessary wire pull strength. In addition, this invention when utilized with deoxidation steps, results in sufficient wire pull strengths not possible otherwise.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: March 12, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Christian L. Guerrero, Jeffrey Poltorak, Yuri Freeman, Steve C. Hussey, Chris Stolarski
  • Patent number: 11869727
    Abstract: An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: January 9, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Jeffrey Poltorak, Robert Andrew Ramsbottom, Kevin A. Agosto
  • Patent number: 11802087
    Abstract: The present invention discloses a dielectric ceramic formula enabling one to obtain a multilayer ceramic capacitor by alternatively stacking the ceramic dielectric layers and base metal internal electrodes. The dielectric ceramic composition comprises a primary ingredient: [(Na1-xKx)sA1-s]m[(Nb1-yTay)uB1vB2w)]O3 wherein: A, B1, B2, x, y, s, u, v, w and m are defined.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: October 31, 2023
    Assignee: KEMET Electronics Corporation
    Inventors: Hanzheng Guo, Abhijit Gurav
  • Patent number: 11744018
    Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: August 29, 2023
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, Peter Alexandre Blais, James A. Burk, Galen W. Miller, Hunter Hayes, Allen Templeton, Lonnie G. Jones, Mark R. Laps
  • Patent number: 11714489
    Abstract: Electromechanical polymer (EMP) actuators are used to create haptic effects on a user interface deface, such as a keyboard. The keys of the keyboard may be embossed in a top layer to provide better key definition and to house the EMP actuator. Specifically, an EMP actuator is housed inside an embossed graphic layer that covers a key of the keyboard. Such a keyboard has a significant user interface value. For example, the embossed key provides the tactile effect of the presence of a key with edges, while allowing for the localized control of haptic vibrations. For such applications, an EMP transducer provides high strains, vibrations or both under control of an electric field. Furthermore, the EMP transducer can generate strong vibrations. When the frequency of the vibrations falls within the acoustic range, the EMP transducer can generate audible sound, thereby functioning as an audio speaker.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: August 1, 2023
    Assignee: Kemet Electronics Corporation
    Inventors: Brian C Zellers, Li Jiang, Christophe Ramstein, Stephen Davis
  • Patent number: 11694851
    Abstract: An improved electrolytic capacitor, and method of making the electrolytic capacitor, is provided. The electrolytic capacitor comprises an anode comprising a dielectric layer on the anode. A primary conductive polymer layer is on dielectric and a mordant layer on the primary conductive layer wherein the mordant layer comprises a mordant compound of Formula A; wherein: each of R1-R6 is independently selected from H and —PO(OR7)2 wherein each R7 is independently selected from H, substituted or unsubstituted alkyl of 1-20 carbons, substituted or unsubstituted aryl of 6-20 carbons or an alkylaryl of 7-21 carbons; with the proviso that at least one of R1-R6 is —PO(OH)2. A secondary conductive polymer layer is on the mordant layer.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: July 4, 2023
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, John Joseph Ols, Ajaykumar Bunha, Yaru Shi
  • Patent number: 11676770
    Abstract: Provided is an improved capacitor formed by a process comprising: providing an anode comprising a dielectric thereon wherein the anode comprises a sintered powder wherein the powder has a powder charge of at least 45,000 ?FV/g; and forming a first conductive polymer layer encasing at least a portion of the dielectric by applying a first slurry wherein the first slurry comprises a polyanion and a conductive polymer and wherein the polyanion and conductive polymer are in a weight ratio of greater than 3 wherein the conductive polymer and polyanion forms conductive particles with an average particle size of no more than 20 nm.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: June 13, 2023
    Assignee: KEMET Electronics Corporation
    Inventors: Yaru Shi, Antony P. Chacko, Ajaykumar Bunha, Qingping Chen, Elisabeth Crittendon Key
  • Patent number: 11676769
    Abstract: Provided herein is a capacitor and method of forming a capacitor. The capacitor comprises an anode with an anode wire extending from the anode. A dielectric is on the anode and a conductive polymer is on the dielectric. The anode comprises at least one face comprising a surface area wherein at least 60% of the surface area is a land and no more than 40% of the surface area comprises perturbations.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: June 13, 2023
    Assignee: KEMET Electronics Corporation
    Inventors: Christian L. Guerrero, Siva Jyoth Lingala
  • Patent number: 11646156
    Abstract: A dielectric ceramic composition comprising a main component comprising an oxide represented by: UaXbYcZd((Ca1-x-ySrxMy)m(Zr1-u-vTiuHfv)O3)1-a-b-c-d wherein the elements defined by U, X, Y, Z and M and subscripts a, b, c, d, x, y, m, u and v are defined.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: May 9, 2023
    Assignee: KEMET Electronics Corporation
    Inventors: Hanzheng Guo, Abhijit Gurav
  • Patent number: 11621126
    Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: April 4, 2023
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, Nathan A. Reed, Allen Templeton, James R. Magee, James Davis, Abhijit Gurav, Hunter Hayes, Hanzheng Guo
  • Patent number: 11600450
    Abstract: Provided is a capacitor, and more preferably a hybrid capacitor, and a method of making the capacitor. The capacitor comprises an anode, with a dielectric on the anode, and a cathode with a barrier layer on the cathode. A separator, conductive polymer, liquid electrolyte and stabilizer are between the anode and cathode.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: March 7, 2023
    Assignee: KEMET Electronics Corporation
    Inventors: Victor Andoralov, Vania Pais, Débora Sá, Miguel Evaristo, Rui A. Monteiro