Patents Assigned to Kemet Electronics
  • Patent number: 10134530
    Abstract: An improved solid electrolytic capacitor, and method of making the solid electrolytic capacitor, is described. The solid electrolytic capacitor comprises a pressed powder anode and a braided lead wire extending from the anode. A dielectric is on the anode and a cathode is on the dielectric.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: November 20, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: James L. Piller, Christian Guerrero
  • Patent number: 10128054
    Abstract: Provided herein is an improved capacitor and a method for forming an improved capacitor. The method includes providing an anode and forming a dielectric on the anode. A linear-hyperbranched polymer is formed and a conductive polymer dispersion is prepared comprising at least one conducting polymer, one polyanion and the linear-hyperbranched polymer. A layer of the conductive polymer dispersion if formed wherein said dielectric is between the anode and the layer.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: November 13, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, Gopakumar Sivasankarapillai, Yaru Shi, Philip M. Lessner
  • Patent number: 10109428
    Abstract: A method for forming a capacitor, a capacitor formed thereby and an improved composition for a conductive coating are described. The method includes providing an anode, forming a dielectric on the anode and forming a cathode layer over the dielectric by applying a monoamine, a weak acid and a conductive polymer.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: October 23, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Yaru Shi, Antony P. Chacko, Hong Zhang, Qingping Chen, Lei Xu, Yang Jin, Zhen Wu
  • Patent number: 10109421
    Abstract: A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: October 23, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P Chacko, Yaru Shi, John Ols
  • Patent number: 10079113
    Abstract: An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. An encapsulant at least partially encases the capacitive element wherein the encapsulant comprises at least one membrane between the capacitive element and an external surface of the encapsulant.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: September 18, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Jeffrey Poltorak, Robert Andrew Ramsbottom
  • Patent number: 10074490
    Abstract: An improved hybrid capacitor is described. The hybrid capacitor comprises an anode with a dielectric thereon and a cathode. An electrolyte is in electrical contact with the cathode and between the cathode and the dielectric. The electrolyte comprises a solid electrolyte coated on the cathode and an impregnating electrolyte wherein the solid electrolyte and the impregnating electrolyte have an intermolecular bond there between.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: September 11, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, Liancai Ning, Yaru Shi, Qingping Chen
  • Patent number: 10068707
    Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: September 4, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude, Allen Hill
  • Patent number: 10068708
    Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: September 4, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Maurice Perea, R Allen Hill, Reggie Phillips
  • Patent number: 10068713
    Abstract: An improved capacitor is described herein. The capacitor comprises a working element wherein the working element comprises an anode comprising a dielectric thereon and an anode conductive polymer layer on the dielectric. The capacitor also includes a cathode comprising a cathode conductive polymer layer and a conductive separator between the anode and said cathode. An anode lead is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: September 4, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Victor Andoralov, Ralf Deisenhofer
  • Patent number: 10062519
    Abstract: An improved capacitor and a method for forming an improved capacitor is detailed. The method comprises forming a tantalum anode from a tantalum powder with a powder charge of no more than 40,000 ?C/g; forming a dielectric on the anode by anodization at a formation voltage of no more than 100 V; and forming a conductive polymeric cathode on the dielectric wherein the capacitor has a breakdown voltage higher than the formation voltage.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: August 28, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Yuri Freeman, Steven C. Hussey, Jimmy Dale Cisson, Philip M. Lessner
  • Patent number: 10056320
    Abstract: An electronic component is provided with improved thermal stability. The electronic component comprises at least one capacitive element wherein the capacitive element comprises internal electrodes of alternating polarity separated by a dielectric. External terminations with a first external termination of the external terminations are in electrical contact with internal electrodes of a first polarity and a second external termination of the external terminations are in electrical contact with internal electrodes of a second polarity. A first external lead frame is in electrical contact with the first external termination with a conductive bond there between wherein the first external lead frame comprises at least one feature selected from the group consisting of a perforation, a protrusion and an edge indentation.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: August 21, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Jeffrey S. Murrell, Lonnie G. Jones, Jeffrey W. Bell
  • Patent number: 10014116
    Abstract: A capacitor with improved electronic properties is described. The capacitor has an anode, a dielectric on said anode and a cathode on the dielectric. The cathode has a conductive polymer defined as —(CR1R2CR3R4—)x— wherein at least one of R1, R2, R3 or R4 comprises a group selected from thiophene, pyrrole or aniline with the proviso that none of R1, R2, R3 or R4 contain —SOOH or COOH; a organofunctional silane; and an organic compound with at least two functional groups selected from the group consisting of carboxylic acid and epoxy.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: July 3, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Yaru Shi, Antony P. Chacko, Edgar White
  • Patent number: 10002713
    Abstract: An electronic component with a self-damping MLCC is provided. The electronic component comprising a pulse signal generator and a substrate comprising first traces and second traces. An MLCC is provided comprising a first capacitive couple between two first external terminations and a second capacitive couple between two second external terminations wherein each first external termination is in electrical contact with a different first trace and each second external termination is in electrical contact with a different second trace. The pulse signal generator provides a first pulse to the first traces and a second pulse to the second traces wherein the first pulse and second pulse are not in phase.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: June 19, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Randal J. Vaughan, Abhijit Gurav, Gregory L. Crosby, Buli Xu
  • Patent number: 9959979
    Abstract: An improved capacitor is provided wherein the improved capacitor has improved ESR. The capacitor has a fluted anode and an anode wire extending from the fluted anode. A dielectric is on the fluted anode. A conformal cathode is on the dielectric and a plated metal layer is on the carbon layer.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: May 1, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Randolph S. Hahn, Jeffrey Poltorak, Brandon Summey, Antony P. Chacko, John T. Kinard, Philip M. Lessner
  • Patent number: 9941056
    Abstract: An improved capacitor is provided with at least one anode having a dielectric on the anode and an anode lead extending from the anode. A conductive cathode layer is on the dielectric. An anode leadframe is electrically connected to the anode and a cathode leadframe is electrically connected to the cathode. An encapsulant encases the anode, a portion of the anode leadframe and a portion of the cathode leadframe such that the anode leadframe extends from the encapsulant to form an external anode leadframe and the cathode leadframe extends from the encapsulant to form an external cathode leadframe. At least one secondary electrical connection is provided wherein the secondary electrical connection is in electrical contact with the cathode and extends through the encapsulant to the external cathode leadframe or the secondary electrical contact is in electrical contact with the anode and extends through the encapsulant to the external anode leadframe.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: April 10, 2018
    Assignee: KEMET ELECTRONICS CORPORATION
    Inventors: Brandon Summey, Jeffrey Poltorak
  • Patent number: 9941055
    Abstract: A method for preparing a solid electrolytic capacitor and an improved solid electrolytic capacitor is provided. The method includes providing an anode, forming a dielectric on the anode, forming a cathode on the dielectric and forming subsequent layers on the cathode wherein the cathode and subsequent layers preferably comprise interlayers. At least one interlayer comprises a monomer, oligomer or polymer with multifunctional or multiple reactive groups and an adjacent layer comprises a molecule with crosslinkable functionality. The oligomer or polymer with multifunctional or multiple reactive groups on one layer react with the crosslinkable functionality in the adjacent layer.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: April 10, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P Chacko, Danny Yiu Kai Hui
  • Patent number: 9928964
    Abstract: An improved process for forming a conjugated thiophene precursor is described as in the formation of an improved polymer prepared from the conjugated thiophene and an improved capacitor formed from the improved polymer. The improved process includes forming a thiophene mixture comprising thiophene monomer, unconjugated thiophene oligomer, optionally a solvent and heating the thiophene mixture at a temperature of at least 100° C. to no more than the lower of 250° C. or the boiling point of a component of said thiophene mixture with the lowest boiling point temperature.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: March 27, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Yang Jin, Qingping Chen
  • Patent number: 9881744
    Abstract: An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: January 30, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude
  • Patent number: 9847179
    Abstract: Provided is a method for forming a capacitor. The method includes: providing an anode with a dielectric thereon and a conductive node in electrical contact with the anode; applying a conductive seed layer on the dielectric; forming a conductive bridge between the conductive seed layer and the conductive node; applying voltage to the anode; electrochemically polymerizing a monomer thereby forming an electrically conducting polymer of monomer on the conductive seed layer; and disrupting the conductive bridge between the conductive seed layer and the conductive node.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: December 19, 2017
    Assignee: KEMET Electronics Corporation
    Inventors: Jeffrey Poltorak, Brandon K. Summey, Yongjian Qiu
  • Patent number: 9847175
    Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: December 19, 2017
    Assignee: KEMET Electronics Corporation
    Inventors: Maurice Perea, R Allen Hill, Reggie Phillips