Patents Assigned to Kemet Electronics
  • Patent number: 7670981
    Abstract: A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combinations thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0?x?0.08, 0.0001?s?0.043 and x?1.86s; and b) 0?x?0.0533, 0.0001?s?0.08 and x?0.667s.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: March 2, 2010
    Assignee: Kemet Electronics Corporation
    Inventors: Michael S. Randall, Corey Antoniades, Daniel E. Barber, Xilin Xu, James Beeson, Pascal Pinceloup, Abhijit Gurav, Thomas Poole, Azizuddin Tajuddin, Ian Burn
  • Patent number: 7671603
    Abstract: A method for screening electrolytic capacitors places a capacitor in series with a resistor in series with a resistor, applying a test voltage and following the charge curve for the capacitor. A high voltage drop indicates high reliability and a low voltage drop is used to reject the piece. The leakage current is not adversely affected during the test.
    Type: Grant
    Filed: December 18, 2006
    Date of Patent: March 2, 2010
    Assignee: Kemet Electronics Corporation
    Inventor: Yuri Freeman
  • Patent number: 7667954
    Abstract: A capacitor includes a container, a positive electrode, a negative electrode, and a fluid electrolyte. The positive electrode includes a metal substrate and an active material provided in contact with the metal substrate. The active material includes at least one of poly(ethylene 3,4-dioxythiophene) and a titanate.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: February 23, 2010
    Assignees: Medtronic, Inc., Kemet Electronics Corporation
    Inventors: Philip Michael Lessner, Brian Melody, John Tony Kinard, Joachim Hossick Schott
  • Patent number: 7658986
    Abstract: Porous sintered anode bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelpiped shapes are used, cathode coverage at the edges and corners is non-uniform and failures occur at those locations. Rectangular prisms, obround prisms and cylindrical prisms are formed with transition surfaces at edges and corners, such as chamfers and curves, to enhance cathode layer uniformity. The transition surface greatly enhances the application of polymer slurries.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: February 9, 2010
    Assignee: Kemet Electronics Corporation
    Inventors: Jeffrey Poltorak, Yongjian Qiu, Christian Guerrero, Lance Paul Thornton, Randy S. Hahn, James C. Bates, Jr., John Prymak
  • Patent number: 7643269
    Abstract: An electrical component, which contains an electrode with an electrically conductive body having a dielectric surface. An amorphous layer comprising SiO2, having a specific surface area of approximately 50 to 500 m2/g, is arranged on the body. An electrically conductive coating is arranged on the amorphous layer. A solid electrolyte capacitor is an electrical component of this type in which, for example, the electrode is connected as the anode and the electrically conductive coating is connected as the cathode.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: January 5, 2010
    Assignee: Kemet Electronics Corporation
    Inventor: Thomas Kirschbaum
  • Patent number: 7605048
    Abstract: High capacitance value capacitors are formed using bimetal foils of an aluminum layer attached to a copper layer. The copper side of a bimetallic copper/aluminum foil or a monometallic aluminum foil is temporarily protected using aluminum or other materials, to form a sandwich. The exposed aluminum is treated to increase the surface area of the aluminum by at least one order of magnitude, while not attacking any portion of the protected metal. When the sandwich is separated, the treated bimetal foil is formed into a capacitor, where the copper layer is one electrode of the capacitor and the treated aluminum layer is in intimate contact with a dielectric layer of the capacitor.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: October 20, 2009
    Assignees: Kemet Electronics Corporation, Motorola, Inc.
    Inventors: Gregory J. Dunn, Jovica Savic, Philip M. Lessner, Albert K. Harrington
  • Patent number: 7563290
    Abstract: A method for forming a capacitor including forming an anode from a valve metal; forming an oxide on the anode to form an anodized anode; dipping the anodized anode into a slurry of conductive polymer; drying the intrinsically conductive polymer; and providing external terminations in electrical contact with the anode and the conductive polymer.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: July 21, 2009
    Assignee: Kemet Electronics Corporation
    Inventors: Yongjian Qiu, Randy S. Hahn, Keith R. Brenneman
  • Patent number: 7554793
    Abstract: An improved conductive adhesive and capacitor formed using the improved conductive adhesive. The conductive adhesive has: 60-95 wt % conductor; 5-40 wt % resin; wherein the resin has: 55-98.9 wt % monomer defined by the formula: wherein: R is an aliphatic group of 1 to 10 carbons; R1 is an aliphatic group of 1 to 10 carbons; R2 is an alkyl, alkyl ether, aryl ether, silane or silicone; and wherein R and R1, R and R2 or R1 and R2 may be taken together to form a cyclic alkyl or aryl group; 0.1-15 wt % catalyst; 1-30 wt % accelerant defined by the formula: wherein R3 is an alkyl or substituted alkyl of 1-10 carbons; and R4 is an alkyl or substituted alkyl of 1-10 carbons with the proviso that at least one of R3 and R4 is substituted with a OR5 wherein R5 is selected from hydrogen, alkyl and aryl; and 0-15 wt % filler.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: June 30, 2009
    Assignee: Kemet Electronics Corporation
    Inventor: Antony P. Chacko
  • Patent number: 7545623
    Abstract: A capacitor array with a multiplicity of capacitors with terminations of alternating polarity wherein the terminations are arranged in M columns and N rows. A circuit is provided with terminations in a grid of L columns and K rows wherein the terminations are of alternating polarity with the proviso that a first terminal with L={acute over (?)}M has the same polarity as a second terminal with L={acute over (?)}M+1 wherein {acute over (?)} is an integer.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: June 9, 2009
    Assignee: Kemet Electronics Corporation
    Inventors: Michael S. Randall, Garry Renner
  • Patent number: 7544218
    Abstract: A therapeutic medical device system comprising an electrolytic capacitor including an anode, cathode and an electrolyte. The anode is anodized in an electrolyte comprises an aqueous solution of alkanol amine, phosphoric acid and an organic solvent preferably defined by formula 1: CH3—(OCH2CH2)m—OCH3 ??Formula 1 wherein m is an integer from 3 to 10.
    Type: Grant
    Filed: April 19, 2006
    Date of Patent: June 9, 2009
    Assignees: Kemet Electronics Corporation, Medtronic, Inc.
    Inventors: John D. Norton, Joachim Hossick-Schott, Mark Edward Viste, Brian John Melody, John Tony Kinard
  • Patent number: 7499260
    Abstract: An electrode for an electrolytic capacitor includes a substrate comprising titanium; a carbide layer adjacent the substrate; and a carbonaceous layer adjacent the carbide layer and including means for enhancing the capacitance of the electrode.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: March 3, 2009
    Assignees: Medtronic, Inc., Kemet Electronics Corporation
    Inventors: Joachim Hossick Schott, Brian Melody, John Tony Kinard
  • Patent number: 7495890
    Abstract: A solid electrolytic capacitor body is attached to lead frame by a secondary adhesive and a method for forming the capacitor assembly. The assembly consists of a chip that has conductive adhesive formed on the cathode surface. Secondary adhesive is placed adjacent to the conductive adhesive. Lead frame is attached to these adhesives and the adhesives are cured simultaneously. Secondary adhesive can be thermally or UV cured. The solid electrolytic capacitor formed by this method showed improved adhesion between lead frame and capacitor body.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: February 24, 2009
    Assignee: Kemet Electronics Corporation
    Inventor: Antony Chacko
  • Publication number: 20080244885
    Abstract: High capacitance value capacitors are formed using bimetal foils of an aluminum layer attached to a copper layer. The copper side of a bimetallic copper/aluminum foil or a monometallic aluminum foil is temporarily protected using aluminum or other materials, to form a sandwich. The exposed aluminum is treated to increase the surface area of the aluminum by at least one order of magnitude, while not attacking any portion of the protected metal. When the sandwich is separated, the treated bimetal foil is formed into a capacitor, where the copper layer is one electrode of the capacitor and the treated aluminum layer is in intimate contact with a dielectric layer of the capacitor.
    Type: Application
    Filed: April 6, 2007
    Publication date: October 9, 2008
    Applicants: MOTOROLA, INC., KEMET ELECTRONICS CORPORATION
    Inventors: Gregory J. Dunn, Jovica Savic, Philip M. Lessner, Albert K. Harrington
  • Patent number: 7348194
    Abstract: An improved capacitor with an anode with an anode wire and an oxide layer on the surface of the anode. A cathode layer is exterior to the oxide layer. A carbon conductive layer is exterior to the cathode layer wherein the cathode layer comprises 5-75 wt % resin and 25-95 wt % conductor. The conductor has carbon nanotubes. An anode lead is in electrical contact with the anode wire and a cathode lead is in electrical contact with the carbon conductive layer.
    Type: Grant
    Filed: May 14, 2007
    Date of Patent: March 25, 2008
    Assignee: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, Qingping Chen, Randy S. Hahn, John T. Kinard, Philip M. Lessner, Anita Melody, legal representative, Brian J. Melody
  • Patent number: 7342773
    Abstract: A capacitor comprising an aluminum anode and a dielectric layer comprising phosphate doped aluminum oxide and process for making the capacitor. Furthermore, the capacitor is formed by the process of: forming an aluminum plate; pre-hydrating the aluminum; contacting the plate with an anodizing solution comprising glycerine, 0.1 to 1.0%, by weight, water and 0.01 to 0.5%, by weight, orthophosphate; applying a voltage to the aluminum plate and determining an initial current; maintaining the first voltage until a first measured current is no more than 50% of the initial current; increasing the voltage and redetermining the initial current; maintaining the increased voltage until a second measured current is no more than 50% of the redetermined initial current, and continuing the increasing of the voltage and maintaining the increased voltage until a final voltage is achieved.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: March 11, 2008
    Assignee: Kemet Electronics Corporation
    Inventors: Albert Kennedy Harrington, John Tony Kinard, Brian John Melody, David Alexander Wheeler, Duane Earl Stenzinger
  • Patent number: 7342775
    Abstract: An anode with an anode body with a first side and a second side opposite to said first side, multiple anode wires and a conductive polymer cathode.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: March 11, 2008
    Assignee: Kemet Electronics Corporation
    Inventors: Randy S. Hahn, Yongjian Qiu
  • Patent number: 7330347
    Abstract: A capacitor includes an anode body and a housing having a base surface. The housing encloses the anode body at least partially. The capacitor also includes an anode connector and an anode contact that extends outward from an interior of the anode body. The anode contact has a flat side. The anode connector includes a surface containing a soft-solderable material, and a segment running along the base surface of the housing that forms a soldering surface.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: February 12, 2008
    Assignee: Kemet Electronics Corporation
    Inventors: Helge Clasen, Ralf Deisenhofer
  • Patent number: 7292429
    Abstract: A low inductance multi-layer capacitor. The capacitor includes interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate includes two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: November 6, 2007
    Assignee: Kemet Electronics Corporation
    Inventors: Michael S. Randall, John Prymak, Azizuddin Tajuddin
  • Patent number: D586767
    Type: Grant
    Filed: February 26, 2007
    Date of Patent: February 17, 2009
    Assignee: Kemet Electronics Corporation
    Inventors: Christian Guerrero, Jeff Poltorak, Lance Paul Thornton, Yongjian Qiu
  • Patent number: D599309
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: September 1, 2009
    Assignee: Kemet Electronics Corporation
    Inventors: Christian Guerrero, Jeff Poltorak, Lance Paul Thornton, Yongjian Qiu