Patents Assigned to Kemet Electronics
  • POLYMERIZATION METHOD FOR PREPARING CONDUCTIVE POLYMER
    Publication number: 20130188295
    Abstract: A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.
    Type: Application
    Filed: January 25, 2013
    Publication date: July 25, 2013
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventor: Kemet Electronics Corporation
  • Substrate with embedded patterned capacitance
    Patent number: 8470680
    Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: June 25, 2013
    Assignees: Kemet Electronics Corporation, Motorola, Inc.
    Inventors: John D. Prymak, Chris Stolarski, Alethia Melody, Antony P. Chacko, Gregory J. Dunn
  • STACK CAPACITOR HAVING HIGH VOLUMETRIC EFFICIENCY
    Publication number: 20130155582
    Abstract: An improved capacitor and method of making an improved capacitor is set forth. The capacitor has planer anodes with each anode comprising a fusion end and a separated end and the anodes are in parallel arrangement with each anode in direct electrical contact with all adjacent anodes at the fusion end. A dielectric is on the said separated end of each anode wherein the dielectric covers at least an active area of the capacitor. Spacers separate adjacent dielectrics and the interstitial space between the adjacent dielectrics and spacers has a conductive material in therein.
    Type: Application
    Filed: December 14, 2011
    Publication date: June 20, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: Liancai Ning, Chris Stolarski, Qun Ya
  • HIGH ASPECT RATIO STACKED MLCC DESIGN
    Publication number: 20130146347
    Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 13, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey Bell
  • Apparatus and Method for the Production of Electric Energy Storage Devices
    Publication number: 20130133184
    Abstract: Production apparatus and method for producing devices for storing electric energy are disclosed, wherein stacks of flat cathodes r and anodes that face one another alternately with the interposition of a separator are produced, and in which the separator is formed by a single continuous strip folded several times in a single folding direction.
    Type: Application
    Filed: May 4, 2011
    Publication date: May 30, 2013
    Applicant: KEMET ELECTRONICS ITALIA S.R.L.
    Inventors: Giancarlo Bacci, Fabrizio Nanni, Mauro Vaccari
  • Apparatus and method for screening electrolytic capacitors
    Patent number: 8441265
    Abstract: A method for screening electrolytic capacitors places a capacitor in series with a resistor, applying a test voltage and following the charge curve for the capacitor. A high voltage drop across the capacitor indicates high reliability and a low voltage drop is used to reject the piece. The leakage current is not adversely affected during the test.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: May 14, 2013
    Assignee: Kemet Electronics Corporation
    Inventors: Jonathan Paulsen, Erik Reed, Yuri Freeman
  • MULTILAYERED CERAMIC CAPACITOR WITH IMPROVED LEAD FRAME ATTACHMENT
    Publication number: 20130107419
    Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
    Type: Application
    Filed: October 28, 2011
    Publication date: May 2, 2013
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventors: R. Allen Hill, Philip M. Lessner, Reggie Phillips, Keith Brown, James B. Byrd
  • Substrate with embedded patterned capacitance
    Patent number: 8410536
    Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: April 2, 2013
    Assignee: Kemet Electronics Corporation
    Inventors: John D. Prymak, Chris Stolarski, Alethia Melody, Antony P. Chacko, Gregory J. Dunn
  • Utilization of moisture in hermetically sealed solid electrolytic capacitor and capacitors made thereof
    Patent number: 8379371
    Abstract: A method for forming a hermetically sealed capacitor including: forming an anode; forming a dielectric on the anode; forming a conductive layer on the dielectric thereby forming a capacitive element; inserting the capacitive element into a casing; electrically connecting the anode to an exterior anode connection; electrically connecting the cathode to an exterior cathode connection; filling the casing with an atmosphere comprising a composition, based on 1 kg of atmosphere, of at least 175 g to no more than 245 g of oxygen, at least 7 g to no more than 11 g of water, at least 734 grams to no more than 818 grams of nitrogen and no more than 10 grams of a minor component; and hermetically sealing the casing with the atmosphere with the capacitive element contained in the casing.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: February 19, 2013
    Assignee: Kemet Electronics Corporation
    Inventors: Qingping Chen, Yuri Freeman, Steven C. Hussey
  • STACKED LEADED ARRAY
    Publication number: 20130016488
    Abstract: A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations.
    Type: Application
    Filed: June 26, 2012
    Publication date: January 17, 2013
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventors: John E. McConnell, John Bultitude, Lonnie Jones, Alan Webster
  • SURFACE MOUNTABLE MULTI-LAYER CERAMIC FILTER
    Publication number: 20130009727
    Abstract: An improved electronic filter is provided with capacitance and integral inductance properties. The filter has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes. A third termination is provided and a conductive trace on a surface of the capacitor is between the third termination and the first termination. A ferromagnetic or ferrimagnetic material is coupled to the conductive trace.
    Type: Application
    Filed: July 5, 2012
    Publication date: January 10, 2013
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventors: John Bultitude, Mark R. Laps, James R. Magee, Lonnie G. Jones
  • SINTERING OF HIGH TEMPERATURE CONDUCTIVE AND RESISTIVE PASTES ONTO TEMPERATURE SENSITIVE AND ATMOSPHERIC SENSITIVE MATERIALS
    Publication number: 20130010400
    Abstract: An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.
    Type: Application
    Filed: July 5, 2012
    Publication date: January 10, 2013
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventors: John E. McConnell, John Bultitude, Abhijit Gurav
  • Method for making anodes for high voltage electrolytic capacitors with high volumetric efficiency and stable D.C. leakage
    Patent number: 8349030
    Abstract: A process for the manufacturing valve metal anodes is provided. The process includes: providing a valve metal powder; pressing the valve metal powder to form a pellet; first deoxidizing the pellet with a first reducing agent to form a first oxide of reducing agent on the pellet; removing the first oxide of reducing agent from the pellet to form a deoxidized pellet; sintering the deoxidized pellet to form a sintered pellet; second deoxidizing the sintered pellet with a second reducing agent to form a second oxide of reducing agent on the sintered pellet; and removing said second oxide of reducing agent.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: January 8, 2013
    Assignee: Kemet Electronics Corporation
    Inventors: Steven C. Hussey, Yuri Freeman, Philip M. Lessner
  • Capacitor reformation method and apparatus
    Patent number: 8346355
    Abstract: A method of reforming a wet-tantalum capacitor includes providing a medical device comprising a wet-tantalum capacitor. The capacitor has a rated voltage and including a hydrated anodic deposit. The method further includes charging the capacitor to a voltage that is less than approximately seventy-five percent of the rated voltage and at least partially discharging the capacitor after the charging step. The charging step is performed at a sufficient voltage to dehydrate the anodic deposit while not significantly decreasing the service life of the capacitor.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: January 1, 2013
    Assignees: Medtronic, Inc., Kemet Electronics Corporation
    Inventors: John D. Norton, Brian J. Melody, John Tony Kinard
  • BUSBAR CONTACT PAD WITH SPECIFIC CURVATURE FOR A BETTER CONNECTION TO METAL SPRAY LAYERS
    Publication number: 20120329328
    Abstract: Current busbar pad designs are based on a flat busbar surface to be connected to the metal spray layer of the film capacitor. Busbar pads with a special concave curvature allow better connections to metal spray layer surfaces in regard to mechanical adherence and an improved solder tin distribution at the interface. Best performance can be achieved in combination with flux.
    Type: Application
    Filed: June 22, 2012
    Publication date: December 27, 2012
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventors: Dietmar Zeidler, Witali Spitzer, Ralf Deisenhofer
  • Method of producing a capacitor
    Patent number: 8339769
    Abstract: A method of making an electrolytic capacitor includes providing a first electrode that includes a metal substrate, a carbide layer, and a carbonaceous material. The metal substrate includes a metal selected from the group consisting of titanium, aluminum, tantalum, niobium, zirconium, silver, steel, and alloys and combinations thereof. The method further includes providing a second electrode and an electrolyte.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: December 25, 2012
    Assignees: Medtronic, Inc., Kemet Electronics Corporation
    Inventors: Joachim Hossick Schott, Brian Melody, John Tony Kinard
  • Leaded multi-layer ceramic capacitor with low ESL and low ESR
    Patent number: 8331078
    Abstract: A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: December 11, 2012
    Assignee: Kemet Electronics Corporation
    Inventors: John E. McConnell, Reggie Phillips, Alan P. Webster, John Bultitude, Mark R. Laps, Lonnie G. Jones, Garry Renner
  • High voltage and high efficiency polymer electrolytic capacitors
    Patent number: 8323361
    Abstract: A capacitor, and method of making a capacitor, is provided wherein the capacitor has exceptionally high break down voltage. The capacitor has a tantalum anode with an anode wire attached there to. A dielectric film is on the tantalum anode. A conductive polymer is on the dielectric film. An anode lead is in electrical contact with the anode wire. A cathode lead is in electrical contact with the conductive polymer and the capacitor has a break down voltage of at least 60 V.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: December 4, 2012
    Assignee: Kemet Electronics Corporation
    Inventors: Yuri Freeman, Jake Yongjian Qiu, Steven C. Hussey, Philip M. Lessner, Yongjian Qiu
  • NbO capacitors with improved performance and higher working voltages
    Patent number: 8325465
    Abstract: A capacitor is described with an NbO anode. The capacitor has an NbO anode and an NbO anode lead extending from the NbO anode. A dielectric is on the NbO anode and a conductor is on the dielectric.
    Type: Grant
    Filed: July 8, 2008
    Date of Patent: December 4, 2012
    Assignee: Kemet Electronics Corporation
    Inventors: Yuri Freeman, Philip M. Lessner, Jeffrey Poltorak, Randolph S. Hahn
  • CONDUCTIVE POLYMER DISPERSIONS FOR SOLID ELECTROLYTIC CAPACITORS
    Publication number: 20120300370
    Abstract: A capacitor with an anode and a dielectric over the anode. A first conductive polymer layer is over the dielectric wherein the first conductive polymer layer comprises a polyanion and a first binder. A second conductive polymer layer is over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder and wherein the first binder is more hydrophilic than the second binder.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 29, 2012
    Applicant: Kemet Electronics Corporation
    Inventor: Antony Chacko