Abstract: A method for forming a hermetically sealed capacitor including: forming an anode; forming a dielectric on the anode; forming a conductive layer on the dielectric thereby forming a capacitive element; inserting the capacitive element into a casing; electrically connecting the anode to an exterior anode connection; electrically connecting the cathode to an exterior cathode connection; filling the casing with an atmosphere comprising a composition, based on 1 kg of atmosphere, of at least 175 g to no more than 245 g of oxygen, at least 7 g to no more than 11 g of water, at least 734 grams to no more than 818 grams of nitrogen and no more than 10 grams of a minor component; and hermetically sealing the casing with the atmosphere with the capacitive element contained in the casing.

Abstract: A method for treating anodes of refractory valve metals by deoxidizing the anodes using Mg in an oven, prior to sintering. The process limits free oxygen in the metal compact and improves performance of a capacitor, especially with regards to rated voltage.

Abstract: A capacitor, and method of making a capacitor, is provided wherein the capacitor has exceptionally high break down voltage. The capacitor has a tantalum anode with an anode wire attached there to. A dielectric film is on the tantalum anode. A conductive polymer is on the dielectric film. An anode lead is in electrical contact with the anode wire. A cathode lead is in electrical contact with the conductive polymer and the capacitor has a break down voltage of at least 60 V.

Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A transition layer is on the cathode wherein the transition layer has a blocking layer. A plated layer is on the transition layer. The cathode is electrically connected to a cathode termination through the transition layer.

Abstract: A powder compaction press having opposed rib and channel punches which are interleaved and a production method are used to produce capacitor elements having a uniform compaction density and which are free of surface imperfections.

Abstract: The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.

Abstract: A capacitor with a combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor and results in a resistive failure when this opens during and overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.

Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.

Abstract: A capacitor with a combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor and results in a resistive failure when this opens during and overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.

Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

Abstract: A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.

Abstract: Provided is a method for forming a capacitor. The method includes: providing an anode with a dielectric thereon and a conductive node in electrical contact with the anode; applying a conductive seed layer on the dielectric; forming a conductive bridge between the conductive seed layer and the conductive node; applying voltage to the anode; electrochemically polymerizing a monomer thereby forming an electrically conducting polymer of monomer on the conductive seed layer; and disrupting the conductive bridge between the conductive seed layer and the conductive node.

Abstract: A process for forming a solid electrolytic capacitor and an electrolytic capacitor formed by the process. The process includes: providing an anode wherein the anode comprises a porous body and an anode wire extending from the porous body; apply a thin polymer layer onto the dielectric, and forming a dielectric on the porous body to form an anodized anode; applying a first slurry to the anodized anode to form a blocking layer wherein the first slurry comprises a first conducting polymer with an median particle size of at least 0.05 ?m forming a layer of crosslinker on the blocking layer; and applying a layer of a second conducting polymer on the layer of crosslinker.

Abstract: An improved capacitor, and method for making the capacitor, is described. The capacitor has an anode and a dielectric on the anode. A cathode layer is on the dielectric wherein the cathode layer comprises at least one conductive layer and an insulative adhesion enhancing layer.

Abstract: A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.

Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates.

Abstract: An anode with a pellet wherein the pellet has a bottom surface. The anode further also has an anode wire with a primary axis and extending beyond the pellet along the primary axis wherein the anode wire has a cross-section perpendicular to the primary axis wherein the cross-section of the anode wire breaches the bottom surface.

Abstract: A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on said dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.

Abstract: A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.

Abstract: A method of forming a capacitor includes the steps of: forming an anode with an anode wire extending there from; forming a dielectric on the anode; forming a cathode layer on the dielectric; providing a substrate comprising at least one via and at least two connectors; inserting the anode wire into a first via; forming an electrical connection between the anode wire and a first connector of the connectors; and forming an electrical connection between the cathode layer and a second connector.