Abstract: A capacitor with a combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor and results in a resistive failure when this opens during and overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.
Abstract: Provided is a method for forming a capacitor. The method includes: providing an anode with a dielectric thereon and a conductive node in electrical contact with the anode; applying a conductive seed layer on the dielectric; forming a conductive bridge between the conductive seed layer and the conductive node; applying voltage to the anode; electrochemically polymerizing a monomer thereby forming an electrically conducting polymer of monomer on the conductive seed layer; and disrupting the conductive bridge between the conductive seed layer and the conductive node.
Type:
Application
Filed:
September 21, 2011
Publication date:
March 22, 2012
Applicant:
Kemet Electronics Corporation
Inventors:
Jeffrey Poltorak, Brandon K. Summey, Yongjian Qiu
Abstract: A process for forming a solid electrolytic capacitor and an electrolytic capacitor formed by the process. The process includes: providing an anode wherein the anode comprises a porous body and an anode wire extending from the porous body; apply a thin polymer layer onto the dielectric, and forming a dielectric on the porous body to form an anodized anode; applying a first slurry to the anodized anode to form a blocking layer wherein the first slurry comprises a first conducting polymer with an median particle size of at least 0.05 ?m forming a layer of crosslinker on the blocking layer; and applying a layer of a second conducting polymer on the layer of crosslinker.
Type:
Application
Filed:
September 14, 2011
Publication date:
March 15, 2012
Applicant:
Kemet Electronics Corporation
Inventors:
Yongjian Qiu, Randolph S. Hahn, Kristen Key, Qingping Chen
Abstract: An improved capacitor, and method for making the capacitor, is described. The capacitor has an anode and a dielectric on the anode. A cathode layer is on the dielectric wherein the cathode layer comprises at least one conductive layer and an insulative adhesion enhancing layer.
Abstract: A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.
Type:
Grant
Filed:
June 13, 2008
Date of Patent:
February 28, 2012
Assignee:
Kemet Electronics Corporation
Inventors:
John D. Prymak, Peter Blais, George Haddox, Michael Prevallet, Jim Piller, Chris Stolarski, Chris Wayne
Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates.
Type:
Grant
Filed:
February 12, 2008
Date of Patent:
February 7, 2012
Assignee:
Kemet Electronics Corporation
Inventors:
Michael S. Randall, Garry Renner, John D. Prymak, Azizuddin Tajuddin
Abstract: An anode with a pellet wherein the pellet has a bottom surface. The anode further also has an anode wire with a primary axis and extending beyond the pellet along the primary axis wherein the anode wire has a cross-section perpendicular to the primary axis wherein the cross-section of the anode wire breaches the bottom surface.
Abstract: A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on said dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.
Type:
Application
Filed:
May 24, 2011
Publication date:
December 1, 2011
Applicant:
Kemet Electronics Corporation
Inventors:
Antony P. Chacko, John E. McConnell, Philip M. Lessner, Randolph S. Hahn, John Bultitude
Abstract: A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
Type:
Application
Filed:
May 24, 2011
Publication date:
December 1, 2011
Applicant:
Kemet Electronics Corporation
Inventors:
John E. McConnell, John Bultitude, Reggie Phillips, Robert Allen Hill, Garry L. Renner, Philip M. Lessner, Antony P. Chacko, Jeffrey Bell, Keith Brown
Abstract: A method of forming a capacitor includes the steps of: forming an anode with an anode wire extending there from; forming a dielectric on the anode; forming a cathode layer on the dielectric; providing a substrate comprising at least one via and at least two connectors; inserting the anode wire into a first via; forming an electrical connection between the anode wire and a first connector of the connectors; and forming an electrical connection between the cathode layer and a second connector.
Abstract: Porous sintered bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelepiped shapes are used as they were passed, cathode coverage at the sharp corners and edges is non-uniform and failures occur at those locations. Treating pressed anode bodies with an abrasive process alters the sharpness of corners and edges, creating rounded transitions between primary surfaces and remove surface imperfections resultant from the pressing process both of which enhance cathode layer uniformity.
Type:
Grant
Filed:
November 7, 2007
Date of Patent:
November 15, 2011
Assignee:
Kemet Electronics Corporation
Inventors:
Jeffrey Poltorak, Christian Guerrero, Yongjian Qui, Lance Thornton
Abstract: The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
Type:
Application
Filed:
July 21, 2010
Publication date:
November 3, 2011
Applicant:
Kemet Electronics Corporation
Inventors:
Erik Reed, David Jacobs, Randolph S. Hahn
Abstract: A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures.
Abstract: A capacitor, and method of making a capacitor, is provided wherein the capacitor has exceptionally high break down voltage. The capacitor has a tantalum anode with an anode wire attached there to. A dielectric film is on the tantalum anode. A conductive polymer is on the dielectric film. An anode lead is in electrical contact with the anode wire. A cathode lead is in electrical contact with the conductive polymer and the capacitor has a break down voltage of at least 60 V.
Type:
Application
Filed:
June 22, 2011
Publication date:
October 20, 2011
Applicant:
Kemet Electronics Corporation
Inventors:
Yuri Freeman, Jake Yongjian Qiu, Steven C. Hussey, Philip M. Lessner, Yongjian Qiu
Abstract: A method of reforming a wet-tantalum capacitor includes providing a medical device comprising a wet-tantalum capacitor. The capacitor has a rated voltage and including a hydrated anodic deposit. The method further includes charging the capacitor to a voltage that is less than approximately seventy-five percent of the rated voltage and at least partially discharging the capacitor after the charging step. The charging step is performed at a sufficient voltage to dehydrate the anodic deposit while not significantly decreasing the service life of the capacitor.
Abstract: A method for forming a capacitor including forming an anode from a valve metal; forming an oxide on the anode to form an anodized anode; dipping the anodized anode into a slurry of conductive polymer; drying the intrinsically conductive polymer; and providing external terminations in electrical contact with the anode and the conductive polymer.
Type:
Grant
Filed:
May 7, 2008
Date of Patent:
August 2, 2011
Assignee:
Kemet Electronics Corporation
Inventors:
Yongjian Qiu, Randy S. Hahn, Keith R. Brenneman
Abstract: A Zener diode—capacitor combination wherein a Zener diode is mounted in the capacitor body and connected in parallel with the capacitor after the capacitor has been voltage tested. A welded strap or jumper wire completing the diode circuit or a connection of separate terminations during soldering may be used to complete the circuit.
Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.
Type:
Grant
Filed:
September 23, 2008
Date of Patent:
June 14, 2011
Assignee:
Kemet Electronics Corporation
Inventors:
Michael S. Randall, Chris Wayne, John McConnell
Abstract: The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
Type:
Grant
Filed:
April 3, 2008
Date of Patent:
April 19, 2011
Assignee:
Kemet Electronics Corporation
Inventors:
Erik Reed, David Jacobs, Randolph S. Hahn
Abstract: A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combination thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0?x?0.08, 0.0001?s?0.043 and x?1.86s; and b) 0?0.0533, 0.0001?s?0.08 and x?0.667s.
Type:
Grant
Filed:
October 22, 2007
Date of Patent:
April 12, 2011
Assignee:
Kemet Electronics Corporation
Inventors:
Michael S. Randall, Corey Antoniades, Daniel E. Barber, Xilin Xu, James Beeson, Pascal Pinceloup, Abhijit Gurav, Thomas Poole, Azizuddin Tajuddin, Ian Burn