Abstract: An ostomy appliance for a single ostomy pouch, alternative a couple able pouch, namely an ostomy appliance as a pressure ring; said a flat cylindrical pressure ring, with an outer circularly diameter, and an inner circularly diameter; said which inner circularly diameter in its size is made or chosen so it fit, and touch to the surface of the actually stoma, and where the pressure ring is hold and coupled floating to the system.

Abstract: A probe card is disclosed, which has a conductive layer additionally provided on an insulating seat of a probe stand and the conductive layer is electrically connected to a ground circuit on the probe card via a conductive pin being fed through the insulating seat. A conductive wire is wound surrounding the intermediate segment of the probe, one end of the conductive wire is electrically connected to the ground circuit of the circuit board, and the other end of the conductive wire is electrically connected to the conductive layer of the probe stand. Thus, due to that an additional ground portion of the conductive layer is provided on the conductive wire wound surrounding the probe, a loop inductance of the probe in the insulating seat can be reduced such that accuracy of test data of the probe can be enhanced.

Abstract: A pogo-type probe to be installed in a probe socket and a probe card for testing chip scale package of a semiconductor device is characterized in that the pogo probe has a hollow main body for receiving at least one resilient element internally and the main body comprises two end portions disposed with a first probe head and a second probe head respectively, wherein each of the probe heads is composed of a plurality of taper members to form a crown shape, and each of the taper members has an individual chamfer so that each chamfer has a tip to contact each contact pad of the semiconductor device under test for chip scale package.

Abstract: A position-returning mechanism for a pick-and-place apparatus is disclosed, in which three first circular recesses are respectively concavely provided and three fixing blocks are respectively convexly provided in an equal angle along an outer periphery on a lower surface of a fixing base, and each of the three first circular recesses is inserted and disposed between two adjacent fixing blocks. A movable base is correspondingly installed on the lower part of the fixing base. Three corresponding second circular recesses are concavely provided and three recesses are provided on an upper surface of the movable base. Three ring sprig pillars are provided and received respectively in the corresponding first circular recesses and the corresponding second circular recesses. Therefore, according to the invention, the movable base is allowed to provide functions of radial displacement and axial rotation relative to the fixing base via the three ring sprig pillars.

Abstract: Disclosed is a probe card assembly including a main body, a probe base provided at a center of the main body, and a plurality of test probes connecting the main body and the probe base. Therein, each of the test probes has a tip extending out from the probe base for contacting and testing a wafer. The test probes include at least one power probe, at least one grounding probe and a plurality of signal probes, wherein each of the test probes has a middle section between the main body and the probe base. Each of the power probe and the signal probes further contains therein a core that is wrapped by an insulation layer.

Abstract: A heat-resistant lens kit configured within the pogo tower of the wafer tester is disclosed. The heat-resistant lens kit has two parallel lenses and a main body with a through hole. The main body and two parallel lenses enclose a vacuum room within the through hole.

Abstract: The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig.

Abstract: An under testing device interface with mixed-signal processing circuit is disclosed. The under testing device interface with mixed signal processing circuit software of integrates the mixed-signal processing circuit into the probe card or device under testing card, the mixed-signal processing circuit with the pin electric channel of the tester, and the programs for handling the process of mixed-signal processing circuit into the system software of the tester.

Abstract: This invention discloses a probe card assembly with adjustable ZIF connectors. The probe card assembly comprises a substrate, a plurality of ZIF connectors and a plurality of adjustable fastening means for assembling and disassembling the ZIF connectors on the substrate. The substrate is a disc-like plate, having a first surface, a second surface, a plurality of concave sections disposed on the second surface and a plurality of first through holes perpendicular to the first surface. The first through holes are circularly arranged toward the substrate center. Pairs of first contacts are provided on the first surface adjacent to both sides of first through holes. A plurality of terminals are protruded from the second surface of the substrate for contacting and testing the wafer. The ZIF connectors are also circularly arranged toward the substrate center.

Abstract: Disclosed are a probe card assembly and test probes used therein. The probe card assembly includes a main body, a probe base provided at a center of the main body, and a plurality of test probes connecting the main body and the probe base. Therein, each of the test probes has a tip extending out from the probe base for contacting and testing a wafer. The test probes include at least one power probe, at least one grounding probe and a plurality of signal probes, wherein each of the test probes has a middle section between the main body and contains therein a core that is wrapped by an insulation layer.

Abstract: A tray transportation device is disclosed in this invention. The tray transportation device includes a transfer stage, a loading handler, an operation handler and an unload stage. The transfer stage has a buffer area and an operation area. The loading handler is disposed on the buffer area to handle a tray in the buffer area. The operation handler is disposed on the operation area to handle a tray in the operation area. The unload stage is used to carry the tray transferred from the transfer stage. The loading handler and the operation handler move together, when the operation handler transfers the tray from the operation area to the unload stage; the loading handler transfers the tray from the buffer area to the operation area.

Abstract: A pick-and-place head device with a pushing mechanism for handling electronic components is disclosed in this invention. The pick-and-place head device includes a fixing base connected to a robot arm and a cylinder member disposed on the fixing base, the cylinder member has a first pressure passage, one end of the first pressure passage is connected to a suction member and another end of the first pressure passage is connected to a first pressure source, and the cylinder member is connected to a second pressure source so as to push at least one pushing tip. One of the first pressure source and the second pressure source is controllably selected by a pressure controller at a given time to have a pressure operation so as to enable the suction member to pick up an electronic component or to enable the pushing tip to push the electronic component.

Abstract: The present invention provides an automatic detecting device for radio frequency environment used to detect radio frequency noise. The device uses an antenna to receive radio frequency noise and the radio frequency noise is passing a radio frequency comparator and transformed into a voltage signal. Then, the voltage signal passes through an amplifier and is amplified to be an output voltage. If the output voltage exceeds a threshold voltage, it drives a post stage circuit to warn when the radio frequency noise is beyond a normal value.

Abstract: The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig.

Abstract: The present invention discloses an electronic testing apparatus and a continuous test method for electronic component, which includes multiple test areas, each area possesses respective pick and place module. The apparatus includes multiple shuttles located between the test area and input/output trays. Moreover, a further pick and place module is utilized, between the shuttles and the input/output trays, for picking and placing the devices under test or tested device. The method delivers different electronic component to different test area for testing by different shuttles and to perform testing continuously.

Abstract: A tray to tube manual exchanger is disclosed herein. The manual exchanger includes a tray-fastening module and a bi-axle-rotating module. The tray-fastening module includes a tray-fastening member, a buffer-rail substrate, and a tube-inserting member. The buffer-rail substrate having a plurality of rails is disposed under the tray-fastening member, and the tube-inserting member is disposed at the outlets of the plurality of rails for respectively receiving tubes. The bi-axle-rotating module is pivotally connected to the tray-fastening module. The tray-fastening module clips a tray carrying a plurality of packaged semiconductor devices at a horizontal position, followed by rotating 180 degrees around a second rotating axle of the bi-axle-rotating module, thereby falling the packaged semiconductor devices of each row of the tray onto each rail.

Abstract: A method and system for generating test pulses to test electronic elements are disclosed. After determining a transmission clock, which is smaller than a test clock, and a serial of predetermined pulses, the serial of data bits corresponding to the serial of predetermined pulses can be generated. Then the serial of data bits can be transformed into a serial data stream for transmission. By transmitting the serial data stream according to the transmission clock, the serial of predetermined pulses corresponding to the test clock can be generated.

Abstract: A pick-and-place head device with a pushing mechanism for handling electronic components is disclosed in this invention. The pick-and-place head device includes a fixing base connected to a robot arm and a cylinder member disposed on the fixing base, the cylinder member has a first pressure passage, one end of the first pressure passage is connected to a suction member and another end of the first pressure passage is connected to a first pressure source, and the cylinder member is connected to a second pressure source so as to push at least one pushing tip. One of the first pressure source and the second pressure source is controllably selected by a pressure controller at a given time to have a pressure operation so as to enable the suction member to pick up an electronic component or to enable the pushing tip to push the electronic component.

Abstract: The present invention is directed to apparatus and method of automatically counting the loaded electronic components in a carrier tape. A pair of detectors is arranged respectively above and below the carrier tape, and a counting wheel having teeth on the periphery is operatively coupled to the keyholes of the tape and reel machine. An encoder is utilized having its axis coupled to the counting wheel.

Abstract: In the present invention, a feeding apparatus comprising a plurality of feeding mechanisms is provided. The feeding apparatus comprises a power source, a base, a rotating axle, a plurality of feeding mechanisms, a plurality of connecting units and a plurality of fixing units. The power source is driven to rotate the rotating axle, and then the feeding mechanisms are rotated by the rotating axle to proceed feeding process. In addition, the rotation of each of the feeding mechanisms is controlled by the connecting units and the fixing units. However, the feeding mechanisms can be rotated together or individually to proceed feeding process. Therefore, the production capacity is increased by the feeding apparatus, as well as the cost is reduced by decreasing power needed.