Patents Assigned to Laird Technologies
  • Publication number: 20110310562
    Abstract: A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering at least part of the substrate and at least part of the metal alloy. The substrate may include a metal foil, a heat dissipating unit, a heat generating component, etc. The metal alloy may include a low melting metal alloy coupled to the substrate to form multiple bumps along the substrate in a pattern. The pattern may be generic such that the TIM assembly may be used with multiple different heat generating components to effectively conduct heat away from the multiple different heat generating components, or it may correspond to particular locations on a heat generating component away from which heat is to be conducted.
    Type: Application
    Filed: June 16, 2010
    Publication date: December 22, 2011
    Applicant: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Richard F. Hill
  • Patent number: 8081468
    Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: December 20, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Richard F. Hill, Robert Michael Smythe
  • Publication number: 20110303455
    Abstract: An antenna mount assembly is disclosed. The antenna mount assembly includes an output contact and an antenna mount body. The antenna mount body includes an output portion, a shielding compartment for housing and electromagnetically shielding a connection between a coaxial cable and the output contact, and an access port to permit access to the shielding compartment around the connection between the coaxial cable and the output contact. An antenna mount nut is mechanically attachable to the output portion of the antenna mount body. The antenna mount nut is configured for mechanically attaching an antenna to the antenna mount body. The output contact is coupled to the antenna mount body. The output contact extends from the output portion and into the shielding compartment for electrically connecting the coaxial cable to the output portion. Antenna mount bodies, connector assemblies and methods of making and installing antenna mounts, and connectors are also disclosed.
    Type: Application
    Filed: June 11, 2010
    Publication date: December 15, 2011
    Applicant: Laird Technologies, Inc.
    Inventors: Imad M. Swais, Rafael Haro, Robert K. Antonio
  • Patent number: 8072384
    Abstract: An array antenna module includes multiple antenna assemblies. Each antenna assembly generally includes a first radiating element and a second radiating element spaced apart from the first radiating element and capacitively coupled thereto. A first transmission line is capacitively coupled to the first radiating element, and a second transmission line is electrically coupled to the first radiating element by a connector. The antenna assembly is operable to transmit at least one or more signals to at least one or more wireless application devices and/or to receive at least one or more signals from at least one or more wireless application devices. The first radiating element, second radiating element, first transmission line, and/or second transmission line are coupled to substrates. And at least one or more of the substrates may include epoxy resin bonded glass fabric such as, for example, flame retardant 4.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: December 6, 2011
    Assignee: Laird Technologies, Inc.
    Inventor: Jarrett D. Morrow
  • Patent number: 8072335
    Abstract: An antenna assembly is provided suitable for use with a remote communications module such as, for example, a keyless entry module, a tire pressure monitoring module, etc. The antenna assembly generally includes a support, a folded metallic antenna element mounted on the support, an amplifier coupled to the folded antenna element, and a transmission line coupled to the amplifier.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: December 6, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Ayman Duzdar, Haiyang Wang, Huzefa Abdulkader Bharmal, Joseph M. Combi
  • Patent number: 8068058
    Abstract: The present invention provides an antenna with an integral electrical connection to a printed circuit board. The electrical connection is accomplished by providing a connection beam from a conductive layer to the circuit board. The connection beam is provided with a channel extending through the connection beam, such as a channel through the geometric center of the beam, and the channel is plated. The connection beam terminates with a contact point. The beam is deflectable to provide contact force.
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: November 29, 2011
    Assignee: Laird Technologies, Inc.
    Inventor: Jonathan L. Sullivan
  • Patent number: 8063835
    Abstract: The present invention relates to an antenna arrangement comprising a flexible film (1) having a radiating element (8) mounted to a first side of a dielectric carrier (3). The dielectric carrier (3) has a through hole (5) from the first side thereof to a second side, opposite the first side, thereof. The flexible film (1) is dielectric and comprises a cut linear pattern providing a flip (2) positioned over said through hole (5), wherein said flip (2) is flush with said flexible film (1).
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: November 22, 2011
    Assignee: Laird Technologies AB
    Inventors: Johan Sjöberg, Jerry Nilsson
  • Patent number: 8059044
    Abstract: According to various aspects, exemplary embodiments are provided of apparatus and methods relating to mounting antenna components, modules, and assemblies, such as antenna modules or RF amplifier modules. In an exemplary embodiment, a fastener includes a clamping portion. An actuator is configured to convert a rotational force applied for rotating the fastener into a clamping force applied to the mounting surface generally between the at least one antenna component and the clamping portion of the fastener, to thereby mount the at least one antenna component to the mounting surface.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: November 15, 2011
    Assignee: Laird Technologies GmbH
    Inventors: Nils Rode, Jens Simon, Gerd Kallmeyer
  • Patent number: 8058569
    Abstract: A gasket generally includes upper and lower members and first and second oppositely-disposed lateral members. The first and second oppositely-disposed lateral members connect the lower member to the upper member such that a spaced distance separates the lower member's inner surface from the upper member's inner surface. The first and second lateral members, lower member, and lower member may collectively define a generally trapezoidal profile.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: November 15, 2011
    Assignee: Laird Technologies, Inc.
    Inventor: James E. Kline
  • Patent number: 8045592
    Abstract: Exemplary embodiments are provided of apparatus and methods relating to antenna multiplexers and demultiplexers are disclosed. In exemplary embodiments, antenna multiplexers include two or more inputs for receiving a corresponding number of signals from multiple antennas. The antennas may include world cell antennas, AM/FM antennas, SDARS antennas, GPS antennas, and/or antennas combining the preceding. Exemplary antenna multiplexers also include an output for simultaneously outputting the combined signals received by the multiplexer. Demultiplexers for receiving such combined signals and outputting each signal via a separate output are also disclosed.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: October 25, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Joseph Michael Combi, Ayman Duzdar, Gary Keith Reed
  • Publication number: 20110204280
    Abstract: Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel.
    Type: Application
    Filed: February 23, 2010
    Publication date: August 25, 2011
    Applicant: Laird Technologies, Inc.
    Inventor: Karen J. Bruzda
  • Patent number: 7969379
    Abstract: An antenna assembly having a radiating element and a circuit board is provided. The radiating element is coupled to the circuit board by a conductive extension and hook portion where the hook portion extends into and possibly through a bore on the circuit board.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: June 28, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Jon Knudsen, Tony Meza, Mark Mayer, Abhinav Srivastava
  • Patent number: 7969748
    Abstract: According to various aspects, exemplary embodiments are provided of slide assemblies for slidably opening and closing portable communications terminals, which also are configured to provide electromagnetic interference (EMI) shielding for electronic components of a substrate, such as board-mounted electronic components on a printed circuit board (PCB) of a cellular phone, etc. In one exemplary embodiment, a slide assembly generally includes first and second slide members slidably coupled so as to allow the first slide member to be slidably moved relative to the second slide member. EMI shielding structure is along at least one surface of at least one of the first and second slide members.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: June 28, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Reed Niederkorn, Torsten Ostervall
  • Patent number: 7967346
    Abstract: Exemplary embodiments are provided of slider mechanisms for slidably opening and closing portable communications terminals. In one exemplary embodiment, a portable communications terminal includes a main body and a slider body sliding on the main body. The slider mechanism includes a first slider member fixed to one of the main body and slider body and a second slider member fixed to the other one. The second slider member is slidably engaged with the first slider member. A zigzag spring is disposed between the first and second slider members. One end portion of the zigzag spring is rotatably supported on one of the first and second slider members and the other end thereof is rotatably supported on the other one of the first and second slider members. The zigzag spring is formed of a first zigzag portion and a second zigzag portion having spring characteristics different from the first zigzag portion.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: June 28, 2011
    Assignee: Laird Technologies Korea YH
    Inventors: Tae Hyun Kim, Jae Man Hwang
  • Patent number: 7968012
    Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: June 28, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
  • Patent number: 7965514
    Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: June 21, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Richard F. Hill, Shahi Riaz
  • Publication number: 20110130179
    Abstract: An antenna device for a portable electronic device, preferably for the FM frequency range, generally includes a monopole radiating and/or radiation receiving element including a feeding portion adapted to be connected to an antenna connection point. An inductor is connectable between the antenna connection point and ground. The input of an amplifier stage is also connectable to the antenna connection point. An output of the amplifier stage is connectable to a radio circuit, all provided in the interior of the portable electronic device.
    Type: Application
    Filed: July 21, 2009
    Publication date: June 2, 2011
    Applicant: Laird Technologies AB
    Inventor: Yuantao Luan
  • Publication number: 20110095954
    Abstract: According to various aspects, antenna elements are provided for multi-band sleeve dipole antenna assemblies for use with wireless application devices. The antenna elements generally include first and second radiating elements. The first radiating elements may be tuned for receiving electrical resonant frequencies within a first frequency bandwidth. The second radiating elements may be tuned for receiving electrical resonant frequencies within a second frequency bandwidth different from the first frequency bandwidth.
    Type: Application
    Filed: January 5, 2011
    Publication date: April 28, 2011
    Applicant: Laird Technologies, Inc.
    Inventors: Ee Wei Sim, Kok Jiunn Ng
  • Patent number: 7926166
    Abstract: An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: April 19, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Allan Zuehlsdorf, Igor Vinokur
  • Patent number: RE42512
    Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: July 5, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Michael R. Lambert, Jeff McFadden, Philip van Haaster