Abstract: Disclosed are exemplary embodiments of a flame retardant, electrically conductive adhesive material. In an exemplary embodiment, a flame retardant, electrically conductive adhesive material suitable for use as tape generally includes a layer of adhesive. A layer of electrically conductive fabric is on the layer of adhesive. A flame retardant coating is on the layer of electrically conductive fabric. The flame retardant coating includes a carbon-containing resin.

Abstract: A thermoelectric assembly is disclosed, the assembly having a cold side and a hot side, where each of the hot side and cold side comprises a fan sink. Thermoelectric modules may be between the hot side and cold side and arranged in one circuit or multiple parallel circuits, and in direct thermal contact with both the hot side and the cold side. Each of the hot side and cold side has an air intake direction and an exhaust direction.

Abstract: A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material.

Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.

Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.

Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.

Abstract: An exemplary embodiment of an antenna assembly mountable to an antenna mount having a contact, generally includes a printed circuit board (PCB) and a contact assembly configured to provide a solderless connection between at least one antenna element of the PCB and the contact when the antenna assembly is mounted to the antenna mount. Another exemplary embodiment of an antenna assembly generally includes a base and a housing configured to be coupled to the base such that an interior enclosure is cooperatively defined by the housing and base. The interior enclosure is configured for receiving a PCB and being sealed to thereby inhibit the ingress of water into the interior enclosure. One or more electrical grounding taps are configured for establishing at least a portion of an electrically-conductive grounding pathway from outside of or external to the interior enclosure and which extends into the interior enclosure.

Abstract: Multi-band dipole antennas for wireless application devices are disclosed. An example antenna includes at least one dipole including a resonant element and a ground element. A feed point is coupled to the resonant element, and a ground point is coupled to the ground element. The example antenna also includes a parasitic element adjacent at least a portion of the resonant element. The parasitic element is coupled to the ground element and configured to be operable for changing a resonant frequency of at least a portion of the resonant element.

Abstract: According to various aspects, exemplary embodiments are disclosed of EMI shields, such as EMI gaskets. In an exemplary embodiment, the gasket includes a body of indefinite length. The gasket also includes a base with a generally flat outer surface, an upright portion extending generally upwardly away from the base, and a tail portion extending laterally away from the base. The base and the upright portion may intersect the tail portion at a fold line. One or more perforations and/or a crease may be along the fold line.

Abstract: According to various aspects, exemplary embodiments include one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals.

Abstract: According to various aspects, exemplary embodiments are disclosed of shielding structures including one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures.

Abstract: A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.

Abstract: Disclosed are exemplary embodiments of electrically conductive porous material assemblies. Also disclosed are exemplary methods of making or producing electrically conductive porous material assemblies. In an exemplary embodiment, an electrically conductive porous material assembly generally includes an electrically conductive porous material and a first layer of electrically conductive porous fabric. A first layer of adhesive is between the first layer of electrically conductive porous fabric and the electrically conductive porous material.

Abstract: In one aspect, embodiments are provided of metal coated fillers that include porous filler particles having pores and metal particles coated on the filler particles and inside the pores. In an exemplary embodiment, the weight of metal particles on the porous filler particles and inside the pores may range from 100 percent to 400 percent of the weight of the porous filler particles. The porous filler particles may have a porosity from 30 percent to 99 percent.

Abstract: According to various aspects, exemplary embodiments are provided of thermoelectric materials, which embodiments may have improved figure of merit. In one exemplary embodiment, a thermoelectric material generally includes bismuth telluride nanoparticles, which may be undoped or doped with at least one or more of silver, antimony, tin, and/or a combination thereof. The bismuth telluride nanoparticles may be dispersed in a matrix material comprising particulate bismuth telluride. Methods for making undoped and doped bismuth telluride nanoparticles are also disclosed, which may include a solvothermal method for making bismuth telluride nanoparticles having a size ranging from 1 to 200 nanometers.

Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.

Abstract: According to various aspects, exemplary embodiments are provided of electrical contacts, which may be used for establishing an electrical pathway between first and second electrically conductive surfaces. In an exemplary embodiment, an electrical contact may include an electrically conductive base member and at least one resilient contact member. The at least one resilient contact member may have a configuration at least partially defined by a laser cut in or into the electrically conductive base member. The at least one resilient contact member may also be formed so as to protrude outwardly from the electrically conductive base member.

Abstract: According to various aspects, exemplary embodiments are disclosed of antenna assemblies having dipole elements and Vivaldi elements. In an exemplary embodiment, an antenna assembly includes a plurality of dipole elements operable in at least a first frequency range and a plurality of Vivaldi elements operable in at least a second frequency range. The plurality of Vivaldi elements may be crossed or arranged relative to each other in a cruciform or a crossed Vivaldi arrangement.

Abstract: Disclosed are exemplary embodiments of multiband antenna assemblies, which generally include helical and linear radiating elements. In an exemplary embodiment, a multiband antenna assembly may generally include at least one helical radiator having a longitudinal axis. At least one linear radiator is aligned with and/or disposed at least partially along the longitudinal axis of the at least one helical radiator. The antenna assembly is resonant in at least three frequency bands.