Patents Assigned to Laird Technologies
  • Circuit assemblies including thermoelectric modules
    Patent number: 8649179
    Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.
    Type: Grant
    Filed: February 5, 2011
    Date of Patent: February 11, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Robert Michael Smythe, Michael G. Sutsko
  • Stretched articles suitable for use as EMI absorbers
    Patent number: 8641928
    Abstract: An exemplary embodiment of a method of making an electromagnetic interference (EMI) absorber includes stretching a material that includes EMI absorbing particles along at least a first axis to align at least some EMI absorbing particles.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: February 4, 2014
    Assignee: Laird Technologies, Inc.
    Inventor: Douglas S. McBain
  • FLAME RETARDANT EMI SHIELDS
    Publication number: 20140023851
    Abstract: An electromagnetic interference shield generally includes a resilient core member and an electrically conductive layer. An adhesive bonds the electrically conductive layer to the resilient core member. The adhesive can include halogen-free flame retardant.
    Type: Application
    Filed: October 1, 2013
    Publication date: January 23, 2014
    Applicant: Laird Technologies, Inc.
    Inventor: Larry D. Creasy, Jr.
  • ANTENNA DEVICE AND A PORTABLE RADIO COMMUNICATION DEVICE COMPRISING SUCH AN ANTENNA DEVICE
    Publication number: 20140011553
    Abstract: Exemplary embodiments are disclosed of antenna devices for portable radio communication devices. In an exemplary embodiment, there is an antenna device for a portable radio communication device adapted for receiving radio signals in at least one frequency band. The antenna device includes a radiating element having a first branch and a second branch connected to a common elongated feeding section.
    Type: Application
    Filed: August 12, 2013
    Publication date: January 9, 2014
    Applicant: Laird Technologies AB
    Inventors: Andrei Kaikkonen, Peter Lindberg, Lukasz Grynczel
  • Antenna assemblies
    Patent number: 8570233
    Abstract: Various antenna assemblies are disclosed. In one example, an antenna assembly includes a reflector including a first ground plane, a second ground plane below and spaced apart from the reflector, an antenna adjacent a surface of the reflector opposite the second ground plane, and a grounding post galvanically connecting the first ground plane and the second ground plane.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: October 29, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Björn Lindmark, Patrik Strömstedt, Henrik Ramberg, Kajsa From
  • Multiband high gain omnidirectional antennas
    Patent number: 8552918
    Abstract: Exemplary embodiments are provided of multiband high gain omnidirectional antennas. In one exemplary embodiment, an antenna generally includes first and second radiating elements. The first radiating element is configured to produce a first radiation pattern at a first operating frequency. The second radiating element is configured to produce a second radiation pattern at a second operating frequency. Each of the first and second radiating elements includes a meandering or helical portion.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: October 8, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Ting Hee Lee, Shanmuganathan Suganthan
  • Flame retardant EMI shields
    Patent number: 8545974
    Abstract: An electromagnetic interference shield generally includes a resilient core member and an electrically conductive layer. An adhesive bonds the electrically conductive layer to the resilient core member. The adhesive can include halogen-free flame retardant. The electrically conductive layer can be provided with halogen-free flame retardant and/or a corrosion inhibitor.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: October 1, 2013
    Assignee: Laird Technologies, Inc.
    Inventor: Larry D Creasy, Jr.
  • Thermal interface material with thin transfer film or metallization
    Patent number: 8545987
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: October 1, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Jason Strader, Mark Wisniewski
  • Shielding enclosures
    Patent number: 8542498
    Abstract: Disclosed herein are various exemplary embodiments of shielding enclosures. In an exemplary embodiment, a shielding enclosure generally includes a frame and a lid. The frame includes vertically extending sidewalls and horizontally inwardly extending lateral flanges therefrom. The lateral flanges define a top opening of the frame and include outwardly extending detent legs. The lid includes a top portion for covering the top opening of the frame. The lid also includes flanges downwardly extending from edges of the top portion. At least one of the flanges has a detent structure, such that when the lid is installed on the frame the detent legs of the frame are engaged by the detent structure. The detent structure may, for example, be detent slots or detent protrusions.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: September 24, 2013
    Assignee: Laird Technologies, Inc.
    Inventor: Wanfa Su
  • Low-profile antenna assemblies
    Patent number: 8537062
    Abstract: A low-profile antenna assembly includes at least two antennas co-located under a cover. At least one of the at least two antennas includes an antenna configured for use with AM/FM radio. And, at least one of the at least two antennas includes an antenna configured for use with at least one or more of SDARS, GPS, cell phones, Wi-Fi, DAB-VHF-III, DAB-L, etc.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: September 17, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Ayman Duzdar, Gary Keith Reed, Thomas Shirley, David Allen Swartwood
  • Multi-band Planar Inverted-F (PIFA) Antennas and Systems with Improved Isolation
    Publication number: 20130229318
    Abstract: Exemplary embodiments are provided of multi-band Planar Inverted-F antennas and antenna systems including the same. In an exemplary embodiment, a Planar Inverted-F antenna (PIFA) generally includes a planar radiator or upper radiating patch element having a slot. A lower surface of the PIFA is spaced apart from the upper radiating patch element. First and second shorting elements electrically connect the planar radiator to the lower surface. The PIFA also includes a feeding element electrically connected between the upper radiating patch element and the lower surface. The PIFA may be mounted on a ground plane that is larger than the lower surface of the PIFA.
    Type: Application
    Filed: February 18, 2011
    Publication date: September 5, 2013
    Applicant: Laird Technologies, Inc.
    Inventors: Kok Jiunn Ng, Ee Wei Sim, Joshua Ooi Tze Meng
  • Low-Profile Antenna Assemblies
    Publication number: 20130229315
    Abstract: A low-profile antenna assembly includes at least two antennas co-located under a cover. At least one of the at least two antennas includes an antenna configured for use with AM/FM radio. And, at least one of the at least two antennas includes an antenna configured for use with at least one or more of SDARS, GPS, cell phones, Wi-Fi, DAB-VHF-III, DAB-L, etc.
    Type: Application
    Filed: March 29, 2013
    Publication date: September 5, 2013
    Applicant: Laird Technologies, Inc.
    Inventors: Ayman Duzdar, Gary Keith Reed, Thomas Shirley, David Allen Swartwood
  • Low-profile antenna assembly
    Patent number: 8519897
    Abstract: A low-profile antenna assembly includes at least two antennas co-located under a cover. At least one of the at least two antennas includes an antenna configured for use with AM/FM radio. And, at least one of the at least two antennas includes an antenna configured for use with at least one or more of SDARS, GPS, cell phones, Wi-Fi, DAB-VHF-III, DAB-L, etc.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: August 27, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Ayman Duzdar, Gary Keith Reed, Thomas Arthur Shirley, David Allen Swartwood
  • MULTI-BAND, WIDE-BAND ANTENNAS
    Publication number: 20130187820
    Abstract: Disclosed herein are various exemplary embodiments of multi-band, wide- band antennas. In exemplary embodiments, the antenna generally includes an upper portion and a lower portion. The upper portion includes two or more upper radiating elements and one or more slots disposed between the two or more upper radiating elements. The lower portion includes three or more lower radiating elements and one or more slots disposed between the three or more lower radiating elements. A gap is between the upper and lower portions such that the upper radiating elements are separated and spaced apart from the lower radiating elements.
    Type: Application
    Filed: October 5, 2010
    Publication date: July 25, 2013
    Applicant: Laird Technologies, Inc
    Inventors: Kok Jiunn Ng, Kean Meng Lim
  • Method for providing a conductive material structure on a carrier
    Patent number: 8492077
    Abstract: An exemplary method for providing a conductive material structure on a carrier generally includes applying a photo sensitive material on the carrier and applying a mask on the photo sensitive material. The mask defines a conductive material structure to be formed on the carrier. The method also includes irradiating the defined structure on the carrier in order to prepare for metallization, and metalizing the defined structure for forming the conductive material structure.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: July 23, 2013
    Assignee: Laird Technologies, Inc.
    Inventor: Ulf Palin
  • Low profile antenna assemblies
    Patent number: 8482466
    Abstract: An antenna assembly including a ground plane and a radiator supported above the ground plane is disclosed. The radiator may include a slot to configure the radiator to be resonant in at least two frequency ranges and a grounding point coupled to the ground plane. The radiator may be a dual-band planar inverted F antenna (PIFA) having an upper surface opposite the ground plane. First and second antenna modules may be coupled to the upper surface of the PIFA. The first and second antenna modules may be patch antennas, such as stacked patch antennas.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: July 9, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Cheikh T. Thiam, Andreas D. Fuchs, John V. Kowalewicz, Ralf Lindackers
  • Assemblies and methods for dissipating heat from handheld electronic devices
    Patent number: 8477499
    Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: July 2, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Richard F. Hill, Shahi Riaz
  • ADHESIVE, THERMALLY CONDUCTIVE, ELECTRICAL INSULATORS
    Publication number: 20130148303
    Abstract: According to various aspects, exemplary embodiments are disclosed of adhesive, thermally conductive electrically insulators. In an exemplary embodiment, a thermally conductive, electrically insulating material includes 4 to 40 parts by weight of a macromolecular matrix material; 1 to 20 parts by weight of an adhesive additive; and 40 to 85 parts by weight of thermally conductive electrically insulating particles. The adhesive additive includes a reactive group that is the same as or similar to at least one curable active group in the macromolecular matrix material.
    Type: Application
    Filed: February 5, 2013
    Publication date: June 13, 2013
    Applicant: Laird Technologies, Inc.
    Inventors: Yousen Wang, Jingqi Zhao
  • Shielding antennas in wireless application devices
    Patent number: 8456371
    Abstract: An antenna assembly that includes an antenna module fitting between a display panel of an electronic device and a metallic cover of the device. The antenna module includes an antenna and a support for the antenna. A shielding layer fits between the antenna module and the cover. The shielding layer has a grounding area configured for electrical connection with the antenna and for electrical isolation from the cover.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: June 4, 2013
    Assignee: Laird Technologies Taiwan Inc.
    Inventors: Jia-woei Chen, Po-chih Chen
  • Profile for a co-extrusion
    Patent number: D690272
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: September 24, 2013
    Assignee: Laird Technologies, Inc.
    Inventor: James E. Kline