Patents Assigned to Laird Technologies
  • Patent number: 8866685
    Abstract: Disclosed herein are various exemplary embodiments of omnidirectional multi-band antennas. In an exemplary embodiment, an antenna includes upper and lower portions. The upper portion includes one or more radiating elements, one or more tapering features for impedance matching, and one or more slots configured to enable multi-band operation of the antenna. The lower portion includes one or more radiating elements and one or more slots.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: October 21, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Ting Hee Lee, Ng Kok Jiunn, Ooi Tze Meng
  • Patent number: 8860625
    Abstract: Disclosed herein are exemplary embodiments of interlocking spacers that may be used for suspending transmission lines of a feed network between electrically-conducting ground planes of an antenna assembly. Also disclosed are exemplary embodiments of antenna assemblies including such interlocking spacers. An exemplary embodiment of an antenna assembly generally includes a feed network including one or more transmission lines, a first ground plane, and a second ground plane spaced apart from the first ground plane with a space therebetween. At least one pair of spacers is configured to be interlocked to one another when positioned on opposite sides of a substrate including the transmission lines of the feed network. The spacers are operable for suspending the transmission lines in the space between the ground planes.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: October 14, 2014
    Assignee: Laird Technologies AB
    Inventors: Björn Lindmark, Patrik Strömstedt
  • Publication number: 20140272351
    Abstract: Disclosed are exemplary embodiments of a flame retardant, electrically conductive adhesive material. In an exemplary embodiment, a flame retardant, electrically conductive adhesive material suitable for use as tape generally includes a layer of adhesive. A layer of electrically conductive fabric is on the layer of adhesive. A flame retardant coating is on the layer of electrically conductive fabric. The flame retardant coating includes a carbon-containing resin.
    Type: Application
    Filed: February 12, 2014
    Publication date: September 18, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: Larry Don Creasy, JR., Min-Wei Hsu, Yishen Lin
  • Patent number: 8837151
    Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: September 16, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Richard F. Hill, Robert Michael Smythe
  • Patent number: 8823600
    Abstract: An exemplary embodiment of an antenna assembly mountable to an antenna mount having a contact, generally includes a printed circuit board (PCB) and a contact assembly configured to provide a solderless connection between at least one antenna element of the PCB and the contact when the antenna assembly is mounted to the antenna mount. Another exemplary embodiment of an antenna assembly generally includes a base and a housing configured to be coupled to the base such that an interior enclosure is cooperatively defined by the housing and base. The interior enclosure is configured for receiving a PCB and being sealed to thereby inhibit the ingress of water into the interior enclosure. One or more electrical grounding taps are configured for establishing at least a portion of an electrically-conductive grounding pathway from outside of or external to the interior enclosure and which extends into the interior enclosure.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: September 2, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Imad M. Swais, Robert K. Antonio
  • Patent number: 8810467
    Abstract: Multi-band dipole antennas for wireless application devices are disclosed. An example antenna includes at least one dipole including a resonant element and a ground element. A feed point is coupled to the resonant element, and a ground point is coupled to the ground element. The example antenna also includes a parasitic element adjacent at least a portion of the resonant element. The parasitic element is coupled to the ground element and configured to be operable for changing a resonant frequency of at least a portion of the resonant element.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: August 19, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Ting Hee Lee, Kok Jiunn Ng
  • Publication number: 20140216806
    Abstract: According to various aspects, exemplary embodiments are disclosed of EMI shields, such as EMI gaskets. In an exemplary embodiment, the gasket includes a body of indefinite length. The gasket also includes a base with a generally flat outer surface, an upright portion extending generally upwardly away from the base, and a tail portion extending laterally away from the base. The base and the upright portion may intersect the tail portion at a fold line. One or more perforations and/or a crease may be along the fold line.
    Type: Application
    Filed: February 7, 2013
    Publication date: August 7, 2014
    Applicant: Laird Technologies, Inc
    Inventors: Michael Poulsen, Sri Talpallikar
  • Publication number: 20140209374
    Abstract: According to various aspects, exemplary embodiments include one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals.
    Type: Application
    Filed: March 29, 2013
    Publication date: July 31, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: John Song, Paul Francis Dixon, Yoeri Ariën
  • Publication number: 20140209373
    Abstract: According to various aspects, exemplary embodiments are disclosed of shielding structures including one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals through open structures.
    Type: Application
    Filed: January 25, 2013
    Publication date: July 31, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: John Song, Paul Francis Dixon
  • Publication number: 20140203069
    Abstract: A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.
    Type: Application
    Filed: March 19, 2014
    Publication date: July 24, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: Weifan Wang, Yi-Shen Lin, Larry D. Creasy, JR.
  • Publication number: 20140199904
    Abstract: Disclosed are exemplary embodiments of electrically conductive porous material assemblies. Also disclosed are exemplary methods of making or producing electrically conductive porous material assemblies. In an exemplary embodiment, an electrically conductive porous material assembly generally includes an electrically conductive porous material and a first layer of electrically conductive porous fabric. A first layer of adhesive is between the first layer of electrically conductive porous fabric and the electrically conductive porous material.
    Type: Application
    Filed: October 24, 2013
    Publication date: July 17, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: Larry Don Creasy, JR., Richard Tsai, Baoquan Ou, David B. Wood
  • Publication number: 20140175328
    Abstract: In one aspect, embodiments are provided of metal coated fillers that include porous filler particles having pores and metal particles coated on the filler particles and inside the pores. In an exemplary embodiment, the weight of metal particles on the porous filler particles and inside the pores may range from 100 percent to 400 percent of the weight of the porous filler particles. The porous filler particles may have a porosity from 30 percent to 99 percent.
    Type: Application
    Filed: February 28, 2014
    Publication date: June 26, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: Bukkinakere Kapamipathaiya Chandrasekhar, Shalini Kandoor, Adyam Srinivasa Mukunda
  • Patent number: 8748726
    Abstract: According to various aspects, exemplary embodiments are provided of thermoelectric materials, which embodiments may have improved figure of merit. In one exemplary embodiment, a thermoelectric material generally includes bismuth telluride nanoparticles, which may be undoped or doped with at least one or more of silver, antimony, tin, and/or a combination thereof. The bismuth telluride nanoparticles may be dispersed in a matrix material comprising particulate bismuth telluride. Methods for making undoped and doped bismuth telluride nanoparticles are also disclosed, which may include a solvothermal method for making bismuth telluride nanoparticles having a size ranging from 1 to 200 nanometers.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: June 10, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Arup Purkayastha, Purushottam Joshi
  • Publication number: 20140150839
    Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.
    Type: Application
    Filed: February 10, 2014
    Publication date: June 5, 2014
    Applicant: Laird Technologies, Inc.
    Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Robert Michael Smythe, Michael G. Sutsko
  • Patent number: 8742272
    Abstract: According to various aspects, exemplary embodiments are provided of electrical contacts, which may be used for establishing an electrical pathway between first and second electrically conductive surfaces. In an exemplary embodiment, an electrical contact may include an electrically conductive base member and at least one resilient contact member. The at least one resilient contact member may have a configuration at least partially defined by a laser cut in or into the electrically conductive base member. The at least one resilient contact member may also be formed so as to protrude outwardly from the electrically conductive base member.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: June 3, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Gerald Robert English, Joseph C. Boetto
  • Publication number: 20140111397
    Abstract: Disclosed are exemplary embodiments of multiband antenna assemblies, which generally include helical and linear radiating elements. In an exemplary embodiment, a multiband antenna assembly may generally include at least one helical radiator having a longitudinal axis. At least one linear radiator is aligned with and/or disposed at least partially along the longitudinal axis of the at least one helical radiator. The antenna assembly is resonant in at least three frequency bands.
    Type: Application
    Filed: December 20, 2013
    Publication date: April 24, 2014
    Applicant: Laird Technologies, Inc.
    Inventor: Kean Meng Lim
  • Patent number: 8691393
    Abstract: Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: April 8, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Kelly G. Cook, Larry D. Creasy, Jr.
  • Patent number: 8663506
    Abstract: A method relating to making a metal coated filler includes mixing a solution of an organic diol with a plurality of porous filler particles to obtain a support mixture; contacting a metal salt solution with the support mixture forming a reaction mixture; and heating the reaction mixture to a temperature within a temperature range from about 50 degrees Celsius to about 200 degrees Celsius. The metal cations in the metal salt solution are reduced to metal particles by the organic diol and are disposed on the porous filler particles and on filler particle pore surfaces. The metal coated filler may then be optionally isolated. Electrically and/or thermally conductive articles including the metal coated fillers and methods for their manufacture are also disclosed.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: March 4, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Bukkinakere Kapanipathaiya Chandrasekhar, Shalini Kandoor, Adyam Srinivasa Mukunda
  • Patent number: 8647752
    Abstract: A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering at least part of the substrate and at least part of the metal alloy. The substrate may include a metal foil, a heat dissipating unit, a heat generating component, etc. The metal alloy may include a low melting metal alloy coupled to the substrate to form multiple bumps along the substrate in a pattern. The pattern may be generic such that the TIM assembly may be used with multiple different heat generating components to effectively conduct heat away from the multiple different heat generating components, or it may correspond to particular locations on a heat generating component away from which heat is to be conducted.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: February 11, 2014
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L Strader, Richard F Hill
  • Patent number: D707185
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: June 17, 2014
    Assignee: Laird Technologies, Inc.
    Inventor: James E. Kline