Patents Assigned to Laird Technologies
  • Publication number: 20130133941
    Abstract: Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.
    Type: Application
    Filed: January 22, 2013
    Publication date: May 30, 2013
    Applicant: Laird Technologies, Inc.
    Inventors: Kelly G. Cook, Larry D. Creasy, JR.
  • Publication number: 20130133942
    Abstract: Disclosed herein are example embodiments of electromagnetic interference (EMI) shields and method of making EMI shields. In an exemplary embodiment, a method generally includes coating at least part of a core member with metallic material, and coating at least part of the metallic material with a polymer to thereby inhibit separation of the metallic material from the core member. An example EMI shield generally includes a core member, a metallic coating covering at least part of the core member, and a polymeric coating covering at least part of the metallic coating to inhibit separation of the metallic coating from the core member.
    Type: Application
    Filed: January 25, 2013
    Publication date: May 30, 2013
    Applicant: Laird Technologies, Inc.
    Inventors: Shalini Kandoor, Bambore Lokeshwarappa Santhosh Kumar, Sreejith Valiavalappil, Bukkinakere Kapanipathaiya Chandrasekhar
  • Patent number: 8445102
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: May 21, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael D. Craig
  • Patent number: 8441401
    Abstract: Disclosed herein are exemplary embodiments of apparatus, systems, and methods relating to mounting antenna components, modules, assemblies, etc. to mounting surfaces, such as vehicle roofs, hoods, trunk lids, etc. Other aspects relate to antenna assemblies including the mounting apparatus. An exemplary embodiment generally includes one or more contact parts, a clamping piece, and a fastener. The one or more contact parts, clamping piece, and fastener may be used for mounting an antenna assembly to a mounting surface, such as a vehicle body wall (e.g., a vehicle's roof, hood, trunk lid, etc.).
    Type: Grant
    Filed: May 3, 2010
    Date of Patent: May 14, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Ulrich Steinkamp, Jens Simon, Rainer Ecker, Otto Heinemeyer
  • Patent number: 8384604
    Abstract: According to various aspects, exemplary embodiments are provided of portable communications terminals and assemblies thereof. In one exemplary embodiment, a portable communications terminal includes a support member. An antenna is supported by the support member. Electromagnetic interference (EMI) shielding structure is also supported by the support member. A printed circuit board includes one or more electronic components mounted thereon. The EMI shielding structure is operable for providing EMI shielding for one or more electronic components that are disposed within the interior defined by the EMI shielding structure and the printed circuit board.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: February 26, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Reed Niederkorn, Torsten Ostervall
  • Patent number: 8383961
    Abstract: An electromagnetic interference (EMI) shielding apparatus generally includes a lid and a framework. The lid includes a top portion having at least one projection joining part thereon. The at least one projection joining part has a peripheral contour. The framework includes a top portion and a lateral side extending downward from the top portion. The top portion includes at least one joining opening having a peripheral contour coinciding with the peripheral contour of the at least one projection joining part of the lid. Accordingly, the at least one projection joining part of the lid is engagable with the at least one joining opening of the framework via an interference fit.
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: February 26, 2013
    Assignee: Laird Technologies, Inc.
    Inventor: Steven Shen
  • Patent number: 8368609
    Abstract: Exemplary embodiments are provided of omnidirectional MIMO antennas with polarization diversity. In one exemplary embodiment, an omnidirectional MIMO antenna generally includes an array of radiating antenna elements having a linear horizontal polarization and radiating omnidirectionally in azimuth. The antenna also includes at least one radiating antenna element having a linear vertical polarization and radiating omnidirectionally in azimuth. The vertically polarized radiating antenna is spaced-apart from the array. The antenna is operable for producing omnidirectional, vertically polarized coverage for at least one port, as well as omnidirectional, horizontally polarized coverage for at least one other port.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: February 5, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Jarrett D. Morrow, Adam M. Alevy, Shawn W. Johnson
  • Patent number: 8337219
    Abstract: A grounding strip is described configured to be installed along an edge portion of a substrate for establishing electrical grounding contact between the substrates and a card guide. The grounding strip includes integral grounding members. Each grounding member includes opposing sidewall portions defining a channel configured to receive the edge portion of the substrate therein. The sidewall portions of each grounding member are configured to engage the substrate when the edge portion of the substrate is received in the channel to help retain the edge portion of the substrate in the channel. Each grounding member also includes a contact element disposed generally over the channel. The contact element is integrally formed with at least one of the opposing sidewall portions of the grounding member and is configured to establish electrical contact with the card guide when the grounding strip is installed to the substrate and located in the card guide.
    Type: Grant
    Filed: February 19, 2011
    Date of Patent: December 25, 2012
    Assignee: Laird Technologies, Inc.
    Inventors: Daniel C. Green, James E. Kline
  • Publication number: 20120280888
    Abstract: An antenna assembly including a ground plane and a radiator supported above the ground plane is disclosed. The radiator may include a slot to configure the radiator to be resonant in at least two frequency ranges and a grounding point coupled to the ground plane. The radiator may be a dual-band planar inverted F antenna (PIFA) having an upper surface opposite the ground plane. First and second antenna modules may be coupled to the upper surface of the PIFA. The first and second antenna modules may be patch antennas, such as stacked patch antennas.
    Type: Application
    Filed: July 18, 2012
    Publication date: November 8, 2012
    Applicant: Laird Technologies, Inc.
    Inventors: Cheikh T. Thiam, Andreas D. Fuchs, John V. Kowalewicz, Ralf Lindackers
  • Patent number: 8299159
    Abstract: Thermally-conductive moldable thermoplastic compositions or composites may generally include a plurality of metal-coated filler particles; a plurality of secondary filler particles; and a polymer matrix in admixture with the metal-coated filler particles and the secondary filler particles. The composition or composite may have a thermal conductivity ranging from about 20 Watts per meter-Kelvin to about 35 Watts per meter-Kelvin. Injection molded articles having a moldable thermally-conductive thermoplastic composition or composite can be formed for microelectronics, automotive, avionic, and other heat dissipation applications.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: October 30, 2012
    Assignee: Laird Technologies, Inc.
    Inventors: Bukkinakere Kapanipathaiya Chandrasekhar, Manjunatha Hosahalli Ramachandraiah, Bambore Lokeshwarappa Santhosh Kumar, Srinivasan Duraiswamy
  • Patent number: 8299372
    Abstract: An antenna mount assembly is disclosed. The antenna mount assembly includes an output contact and an antenna mount body. The antenna mount body includes an output portion, a shielding compartment for housing and electromagnetically shielding a connection between a coaxial cable and the output contact, and an access port to permit access to the shielding compartment around the connection between the coaxial cable and the output contact. An antenna mount nut is mechanically attachable to the output portion of the antenna mount body. The antenna mount nut is configured for mechanically attaching an antenna to the antenna mount body. The output contact is coupled to the antenna mount body. The output contact extends from the output portion and into the shielding compartment for electrically connecting the coaxial cable to the output portion. Antenna mount bodies, connector assemblies and methods of making and installing antenna mounts, and connectors are also disclosed.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: October 30, 2012
    Assignee: Laird Technologies, Inc.
    Inventors: Imad M. Swais, Rafael Haro, Robert K. Antonio
  • Patent number: 8279624
    Abstract: Disclosed herein are exemplary embodiments of EMI shielding apparatus (e.g., one-piece shields, multi-piece shields, frames, etc.) having one or more latching members insertable into openings or holes in a substrate (e.g., printed circuit board, etc.) and engagable to the substrate. The engagement of the latching members with the substrate mechanically attaches the EMI shielding apparatus to the substrate.
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: October 2, 2012
    Assignee: Laird Technologies, Inc.
    Inventor: Paul Crotty
  • Publication number: 20120228018
    Abstract: An exemplary embodiment of a method of making an electromagnetic interference (EMI) absorber includes stretching a material that includes EMI absorbing particles along at least a first axis to align at least some EMI absorbing particles.
    Type: Application
    Filed: May 18, 2012
    Publication date: September 13, 2012
    Applicant: Laird Technologies, Inc.
    Inventor: Douglas S. McBain
  • Patent number: 8259025
    Abstract: A multi-band antenna assembly that is operable to receive and/or transmit signals at one or more frequencies generally includes at least two radiating elements, a transmission line coupled to each of the at least two radiating elements, and a tunable match resonator coupled to the transmission line. The tunable match resonator is operable to vary input impedance of a signal received and/or transmitted by the antenna assembly by changing an electrical field within the tunable match resonator.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: September 4, 2012
    Assignee: Laird Technologies, Inc.
    Inventors: Imad M. Swais, Rafael Haro
  • Patent number: 8248315
    Abstract: An antenna assembly for installation to a mobile platform includes a base portion and an antenna module capable of being removably coupled to the base portion. The base portion includes a longitudinal axis and defines a channel extending along at least part of the longitudinal axis. The antenna module includes a mount and an antenna element coupled to the mount. The mount and antenna element can be received into the channel of the base portion, in electrical contact with the base portion, and then subsequently removed from the channel of the base portion as desired. Further, the base portion of the antenna assembly is configured to accommodate multiple different antenna modules as desired.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: August 21, 2012
    Assignee: Laird Technologies, Inc.
    Inventors: Ralf Lindackers, Ayman Duzdar, Joseph M. Combi, Huzefa A. Bharmal
  • Patent number: 8228238
    Abstract: An antenna assembly including a ground plane and a radiator supported above the ground plane is disclosed. The radiator may include a slot to configure the radiator to be resonant in at least two frequency ranges and a grounding point coupled to the ground plane. The radiator may be a dual-band planar inverted F antenna (PIFA) having an upper surface opposite the ground plane. First and second antenna modules may be coupled to the upper surface of the PIFA. The first and second antenna modules may be patch antennas, such as stacked patch antennas.
    Type: Grant
    Filed: October 2, 2009
    Date of Patent: July 24, 2012
    Assignee: Laird Technologies, Inc.
    Inventors: Cheikh T. Thiam, Andreas D. Fuchs, John V. Kowalewicz, Ralf Lindackers
  • Publication number: 20120145212
    Abstract: According to various aspects, exemplary embodiments are provided of thermoelectric materials, which embodiments may have improved figure of merit. In one exemplary embodiment, a thermoelectric material generally includes bismuth telluride nanoparticles, which may be undoped or doped with at least one or more of silver, antimony, tin, and/or a combination thereof. The bismuth telluride nanoparticles may be dispersed in a matrix material comprising particulate bismuth telluride. Methods for making undoped and doped bismuth telluride nanoparticles are also disclosed, which may include a solvothermal method for making bismuth telluride nanoparticles having a size ranging from 1 to 200 nanometers.
    Type: Application
    Filed: February 16, 2012
    Publication date: June 14, 2012
    Applicant: Laird Technologies, Inc.
    Inventors: Arup Purkayastha, Purushottam Joshi
  • Patent number: 8193439
    Abstract: An example method for making thermoelectric modules generally includes coupling a first wafer and a second wafer together, processing the first and second wafers to produce a first thermoelectric element and a second thermoelectric element where the first thermoelectric element and the second thermoelectric element are coupled together, coupling the first thermoelectric element to a first conductor, coupling the second thermoelectric element to a second conductor, separating the first thermoelectric element and the second thermoelectric element, coupling the first thermoelectric element to a third conductor whereby the first thermoelectric element, the first conductor, and the third conductor form at least part of a thermoelectric module, and coupling the second thermoelectric element to a fourth conductor whereby the second thermoelectric element, the second conductor, and the fourth conductor form at least part of another thermoelectric module.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: June 5, 2012
    Assignee: Laird Technologies, Inc.
    Inventors: Robert Michael Smythe, Jeffrey Gerard Hershberger
  • Publication number: 20120061135
    Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of EMI shielding, thermally-conductive interface assemblies. In various exemplary embodiments, an EMI shielding, thermally-conductive interface assembly includes a thermal interface material and a sheet of shielding material, such as an electrically-conductive fabric, mesh, foil, etc. The sheet of shielding material may be embedded within the thermal interface material and/or be sandwiched between first and second layers of thermal interface material.
    Type: Application
    Filed: September 14, 2010
    Publication date: March 15, 2012
    Applicant: Laird Technologies, Inc.
    Inventors: Richard F. Hill, Robert Michael Smythe
  • Patent number: 8111196
    Abstract: According to various exemplary embodiments, an antenna assembly generally includes one or more antennas, such as a single multi-frequency antenna, first and second stacked patch antennas, etc. The antenna assembly may be operable for receiving signals having different frequencies (e.g., a frequency associated with a satellite digital audio radio service (SDARS), a frequency associated with a global positioning system (GPS), etc.). The antenna assembly may generally include at least one antenna (e.g., a single multi-frequency antenna, first and second stacked patch antennas, etc.) having at least one feed point and tuned to at least one of a first frequency and a second frequency that is different than the first frequency. A low noise amplifier may be in communication with the at least one feed point for amplifying signals having the first frequency and signals having the second received from a signal output. A single communication link may be used for communicating an output signal of the antenna assembly.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: February 7, 2012
    Assignee: Laird Technologies, Inc.
    Inventors: Cheikh Thiam, Andreas Fuchs, Ayman Duzdar, Chun Kit Lai