Abstract: An LED drive circuit applied between an LED load and an AC power supply is provided. The circuit includes a rectifier, a power conversion module, a voltage regulator, a photo coupler and a controller. The rectifier rectifies and converts an AC voltage outputted from the AC power supply into a DC voltage. The power conversion module converts the DC voltage into a first drive voltage and a second drive voltage. The first drive voltage drives the LED load. The voltage regulator receives and processes the second drive voltage with a voltage regulating process to generate a third drive voltage not exceeding a maximum voltage rating of the controller. The photo coupler generates a feedback signal according to a signal outputted from the LED load. The controller receives the third drive voltage and generates a control signal to control the power conversion module according to the feedback signal.

Abstract: A flip-chip light-emitting diode structure comprises a carrier substrate, a light-emitting die structure, a reflective layer, an aperture, a dielectric layer, a first contact layer and a second contact layer. The light-emitting die structure, located on the carrier substrate, comprises a first type semiconductor layer, a second type semiconductor layer and a light emitting layer. The light emitting layer is formed between the first type and the second type semiconductor layer. The reflective layer is located on the first type semiconductor layer. The aperture penetrates the light-emitting die structure. The dielectric layer covers an inner sidewall of the aperture and extends to a portion of a surface of the reflective layer. The first contact layer is disposed on the part of the reflective layer not covered by the dielectric layer. The second contact layer fills up the aperture and is electrically connected to the second type semiconductor layer.

Abstract: A light component includes a printed circuit board and a plurality of lighting emitting diodes (LEDs). The printed circuit board has a metal substrate. The LEDs are disposed on the printed circuit board, wherein two opposite edges of the metal substrate protrude out and are bent towards the LEDs to form two metal clamps.

Abstract: A semiconductor light emitting device and a package structure thereof are provided. The semiconductor light emitting device includes a substrate, an epitaxial structure layer, a first electrode, a second electrode and a patterned film structure. The substrate has a first surface and a second surface opposite to the first surface. The epitaxial structure layer is disposed on the first surface, and includes a first type semiconductor layer, an active layer and a second type semiconductor layer on the first surface in sequence. The first electrode is formed on an exposed surface of the first type semiconductor layer. The second electrode is formed on an exposed surface of the second type semiconductor layer. The patterned film structure is disposed on the second surface and includes thin films composed of a metamaterial having a negative refraction index.

Abstract: A lamp structure includes a base, a side-emitting light source, first and second reflecting portions. The base includes a central protrusion portion extending from the base. The side-emitting light source is disposed on a side surface of the central protrusion portion and configured to emit a light beam. The first reflecting portion includes a first reflective curved surface, and a portion of the light beam is reflected thereby and then is directly emitted out. The first reflecting portion is disposed between the central protrusion portion and the second reflecting portion. The second reflecting portion includes a second reflective curved surface adjacent to the first reflective curved surface, and the other portion of the light beam is reflected thereby and then is directly or indirectly emitted out. The first reflective curved surface has a radius of curvature less than that of the second reflective curved surface.

Abstract: A carrier structure and a manufacturing method thereof are provided. The carrier structure includes a substrate, an adhesive layer and a circuit board. The substrate has a plurality of adhesive regions. The adhesive layer is disposed on the adhesive regions. A thermal expansion coefficient of the adhesive layer corresponding one of the adhesive regions is greater than that of another adhesive region. The circuit board is disposed on the adhesive layer.

Abstract: The invention discloses an illumination control circuit and an illumination control method. The illumination control method includes modulating an alternating current input signal and accordingly generating a dimming signal, which includes several waveform pulses each with an adjustable conduction angles; continuously sampling the waveform pulses of the dimming signal and forming an average waveform pulse from the sampled waveform pulses; extracting the average waveform pulse, which has an average conduction angle corresponding to the conduction angles of the waveform pulses; performing an integration on the sampled average waveform pulse and accordingly generating a current-controlling signal; and driving an illumination lamp according to the current-controlling signal.

Abstract: A dual-use light fixture having AC and DC LEDs includes a heat-dissipating housing, a printed circuit board located on a first end of the heat-dissipating housing, AC and DC LED chips located on the printed circuit board, and a power supply pedestal coupled to a second end of the heat-dissipating housing. The power supply pedestal includes an AC plug, a DC driving unit, and a thread connector. The AC plug is electrically connected to the printed circuit board for inserting into an AC outlet to provide an AC power. The DC driving unit is located in an accommodating space formed by the power supply pedestal and the heat-dissipating housing and is electrically connected to the printed circuit board. The thread connector is coupled to another AC power, and the AC power is converted into a DC power by the DC driving unit.

Abstract: A luminous element includes a heat dissipation plate, a body, a plurality of LED chips, a first connector and a second connector. The heat dissipation plate includes a die-bonding area and a heat dissipation area opposite to the die-bonding area. The body surrounds the heat dissipation plate, and includes a first body surface and a second body surface opposite to the first body surface. The first body surface includes a concave part exposing the die-bonding area. The second body surface includes an opening exposing the heat dissipation area. The LED chips are mounted on the die-bonding area. The first and the second connectors are disposed on the body, and they can be pluggably connected to an external power source or other connectors. The LED chips are connected to the electrical input terminals in the first and the second connectors.

Abstract: A lamp tube structure includes a first end cap, a second end cap, a heat sink holder, a light emitting element array and a lamp cover. The first end cap includes a pair of electrical terminals and a first insulating portion. The electrical terminals are integrated into the first insulating portion by insert molding, and one end of each electrical terminal is protruded from an outside of the first insulating portion. The second end cap includes a grounding terminal and a second insulating portion. The grounding terminal is integrated into the second insulating portion by insert molding, and one end of the grounding terminal is protruded from an outside of the second insulating portion. The light emitting element array is disposed on top surface of the heat sink holder. A bottom surface of the lamp cover is fixed on the heat sink holder for receiving the light emitting element array.

Abstract: A lamp includes a light-emitting device, a lamp cover and a lamp driver. The lamp cover covers the light-emitting device, such that the light emitted by the light-emitting device partly passes through the lamp cover and is partly reflected from the lamp cover. The lamp driver determines whether the lamp cover is damaged or the lamp cover still covers the light-emitting device based on the light reflected from the lamp cover to subsequently drive or turn off the light-emitting device selectively. The lamp driver includes a driving unit. The driving unit stops driving the light-emitting device when the lamp cover is damaged or the light-emitting device is not covered by the lamp cover. The driving unit keeps driving the light-emitting device when the lamp cover is not damaged or the light-emitting device is normally covered by the lamp cover.

Abstract: A package structure of semiconductor light emitting element is provided. The package structure of semiconductor light emitting element includes a substrate, a light emitting element and a transparent conductive board. A first electrode and a second electrode are disposed on the substrate. The light emitting element is disposed on the substrate and between the first electrode and the second electrode. A first bonding pad and a second bonding pad are disposed on the light emitting element. The transparent conductive board has a first surface and a second surface opposite to the first surface. The second surface of the transparent conductive board is located over the light emitting element for electrically connecting the first electrode and the first bonding pad and electrically connecting the second electrode and the second bonding pad.

Abstract: An assembly light bar structure includes: a substrate, having at least one recess; a first conductive elastic element and a second conductive elastic element, disposed on the substrate and respectively located at two parallel sides of the recess; and at least one light-emitting element. The light-emitting element is compressed by the first and second conductive elastic elements to be removably fixed in the recess of the substrate. The light-emitting element is electrically connected to the first and second conductive elastic elements.

Abstract: A light emitting module includes a light-emitting unit, a wavelength converting element and an optical convergent element for partially or totally converting the wavelength of incident light. The light-emitting unit includes a light-emitting element which emits a first light, the wavelength converting element and an optical convergent element disposed in a light path of the first light from the light-emitting element, such that the first light is converted into a particular light at a specific area with a reduced beam diameter after passing through the optical convergent element and before entering the wavelength converting element.

Abstract: A LED sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface. The first electrical-conductive layers are positioned on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove.

Abstract: An information exhibition system includes an exhibition cabinet and a least one information display device. The exhibition cabinet is used to exhibit at least one object. The information display device is positioned on the exhibition cabinet. The information display device includes a display panel and an illumination module. The display panel includes a front surface and a back surface opposite to the front surface. The front surface shows information. The illumination module is positioned on the back surface of the display panel, so that the light can be emitted into the display panel through the back surface and also illuminate the object on the backside of the display panel.

Abstract: The invention provides a substrate structure used for manufacturing a light-emitting diode and a method for manufacturing the light-emitting diode. The substrate structure includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of grooving structure formed on the first surface of the substrate. The light-emitting diode is formed on the first surface of the substrate.

Abstract: An illumination structure including an illumination module, a light base and a cover is provided. The light base includes a cylindrical shell and an electrical connector, wherein the cylindrical shell is used for receiving and supporting the illumination module. A first end of the cylindrical shell has a first edge including a plurality of protrusions. A second end of the cylindrical shell is connected to the electrical connector. The cover has a second edge including a plurality of recessions. Each recession is complementary in shape to a corresponding protrusion, so that the protrusions are received in corresponding recessions respectively.

Abstract: The disclosure provides a light-emitting diode and a method for manufacturing the same. The light-emitting diode comprises a N-type metal electrode, a N-type semiconductor layer contacted with the N-type metal electrode, a P-type semiconductor layer, a light-emitting layer interposed between the N-type semiconductor layer and the P-type semiconductor layer, a low-contact-resistance material layer positioned on the P-type semiconductor layer, a transparent conductive layer covered the low-contact-resistance material layer and the P-type semiconductor layer, and a P-type metal electrode positioned on the transparent conductive layer.