Abstract: A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.

Abstract: A light emitting diode display panel includes a substrate and a plurality of pixels. The substrate includes a plurality of transverse signal lines and a plurality of longitudinal signal lines crossing each other. The pixels are mounted on the substrate in a matrix form. Each pixel includes a plurality of LEDs. The LEDs are electrically connected to one of the transverse signal lines and one of the longitudinal signal lines.

Abstract: A light-emitting module includes a first conductive lead frame, a second conductive lead frame physically separated from the first conductive lead frame, a protective plastic layer, a reflective plastic layer, and a light-emitting die. The protective plastic layer surrounds the first and second conductive lead frames, and an accommodating space s defined by the protective plastic layer, and the first and second conductive lead frames. Inner surfaces of the first and second conductive lead frames are exposed through the accommodating space. The accommodating space further includes a die-mounting region. The reflective plastic layer is formed on the inner surfaces within the accommodating space. The light-emitting die is located on the die-mounting region and is electrically connected to the first and second conductive lead frames. The light-emitting die protrudes from the reflective plastic layer.

Abstract: A method of detecting a flickering frequency of an ambient light source includes the following steps. First, a light intensity of the light source is sensed in a predetermined time period according to a sampling frequency to obtain a plurality of sample values. Then, the sample values are calculated to obtain a median value. Next, the sample values are binarized according to a result of a comparison between the sample values and the median value to obtain a first sequence. The first sequence is differentiated to obtain a second sequence, and the second sequence includes numbers ?1, 0, and 1. Then, a distance between the same numbers in the second sequence is calculated, and the sampling frequency is divided by the distance to obtain the flickering frequency of the ambient light source. A system of detecting a flickering frequency of an ambient light source is also disclosed herein.

Abstract: A first substrate of a light bar assembly includes a first edge and a second edge parallel to each other along a first direction. A first connecting end includes a first connecting portion protruding further outward than a second connecting portion. A first bonding pad and a second bonding pad are disposed on the first substrate. First solid-state semiconductor light sources are disposed along the first edge and the second edge. A second substrate, disposed corresponding to the first substrate, includes a third edge, a fourth edge, a second connecting portion, a third bonding pad, a fourth bonding pad, and second solid-state semiconductor light sources. A first connecting device is electrically connected to the first bonding pad and the fourth bonding pad; a second connecting device is electrically connected to the second bonding pad and the third bonding pad to fix the first substrate and the second substrate.

Abstract: A light emitting diode chip structure includes a substrate, a mesa type light emitting diode structure, and an electroluminescent layer. The mesa type light emitting diode structure includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The mesa type light emitting diode structure is formed on the substrate. The first semiconductor layer is formed on the substrate. The light emitting layer is formed on a portion of the first semiconductor layer, and a portion of the first semiconductor layer is uncovered. The second semiconductor layer is formed on the light emitting layer. The electroluminescent layer is formed on the second semiconductor layer. Furthermore, a light emitting diode element is also disclosed herein.

Abstract: An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base.

Abstract: A lighting unit is provided and includes a cup body, a substrate, a first conductive wire connector and a second conductive wire connector. The cup body has a light emitting surface, a first end portion, and a second end portion. The substrate is located in the concave accommodating cavity of the cup body. A lighting element is located on the substrate, and has a light emitting direction toward the light emitting surface. The first and second conductive wire connectors are respectively located at two sides of the substrate in the accommodating cavity. A portion of the first conductive wire connector protrudes from the surface of the first end portion to form a first male connection terminal. The second conductive wire connector is recessed in the surface of the second end portion to form a first female connection terminal.

Abstract: A dimming circuit and a lighting device using the same are provided. The dimming circuit comprises an interface trigger unit, an average duty cycle calculating unit, a control voltage calculating unit and a comparing unit. The interface trigger unit receives an on-time of each pulse width from each period in a PWM signal. The average duty cycle calculating unit is coupled to the interface trigger unit and calculates a ratio of the on-time to the period. The control voltage calculating unit is coupled to the average duty cycle calculating unit, and calculates a desired voltage according to the ratio. The comparing unit is coupled to the control voltage calculating unit, and sends the desired voltage and a differential voltage to a driving circuit.

Abstract: A light emitting device comprising a light guiding frame and a light source is provided. The light guiding frame has a recess, and an edge of an opening of the recess defines a light-emitting opening. The light guiding frame comprises a first light guiding structure and a second light guiding structure connected to the first light guiding structure. The light source is disposed on a bottom of the recess and has a light-emitting surface. The first light guiding structure is extended along a direction away from the light-emitting surface and the light-emitting opening. The second light guiding structure is extended along a direction away from the light-emitting surface but close to the opening.

Abstract: A package structure of semiconductor light emitting element is provided. The package structure of semiconductor light emitting element includes a substrate, a light emitting element and a transparent conductive board. A first electrode and a second electrode are disposed on the substrate. The light emitting element is disposed on the substrate and between the first electrode and the second electrode. A first bonding pad and a second bonding pad are disposed on the light emitting element. The transparent conductive board has a first surface and a second surface opposite to the first surface. The second surface of the transparent conductive board is located over the light emitting element for electrically connecting the first electrode and the first bonding pad and electrically connecting the second electrode and the second bonding pad.

Abstract: A plant illumination apparatus includes a light source module including a first light source and a second light source generating lights having different wavelengths, an environment-detecting module detecting an external environment to obtain a real-time environment parameter, and a control module connected to the light source module and the environment-detecting module. The control module includes a processor unit and a storage unit storing a database of plant growing environment parameters. The processor unit loads at least one preset growing environment parameter corresponding to a plant growth timing from the database of plant growing environment parameters, and compares the preset growing environment parameter with the real-time environment parameter to output at least one comparison result. The processor unit adjusts the first light source and the second light source according to the comparison result, so that an adjusted environment parameter matches the preset growing environment parameter.

Abstract: An illumination system includes a light-emitting device, a first switch element, a driving device, a detecting circuit, an arithmetic unit and a power supply unit. The first switch element is configured for receiving an external voltage supplied by an external power source. The driving device is configured for converting the external voltage to a direct-current power signal for driving the light-emitting device to emit light; the detecting circuit is configured for detecting a voltage across the first switch element and converting the voltage to a detecting signal; the arithmetic unit is configured for performing an arithmetic operation on the direct-current power signal and the detecting signal to generate a control signal; and the power supply unit is configured for supplying power for the light-emitting device according to the control signal and driving the light-emitting device to emit light. An illumination driving method is also disclosed herein.

Abstract: A light emitting device comprising a carrier, a first and a second reflective layers, a first and a second micro-structures, a LED package device, a light guide device and a light directing cover is provided. The carrier comprises an upper plate and a lower plate each having a first surface and a second surface. The lower plate has a through hole. The first and second reflective layers are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The first and second micro-structures are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The LED package device is disposed below the through hole. The light guide device is connected to the LED package device. The light directing cover surrounds the light guide device.

Abstract: A detachable bulb includes a lighting source module and a driving module. The lighting source module includes a support plate, a lighting module, a heat sink, and a light-permeable cover. The heat sink has a cavity, a first end, a second end and an engaging slot disposed on an outer periphery thereof. The support plate is secured on the first end of the heat sink. The light-permeable cover disposed on the first end of the heat sink covering the lighting module. The driving module includes a driving body with a socket, a shell, and a power receiving base. The shell is around the driving body and has several engaging parts that detachably engage with the engaging slot. The power receiving base is electrically connected to the driving body.

Abstract: A LED (Light-Emitting Diode) lighting fixture and a manufacturing method thereof are disclosed. The LED lighting fixture comprises a LED module generating light at a wavelength range of 300-700 nm, a lamp cover shielding the LED module, and a phosphor layer. The phosphor layer which is coated on an inner surface towards the LED module comprises at least two types of phosphor mixed at a default ratio for transforming the light of 300-700 nm in wavelength to luminary light in the wavelength range of 400-700 nm.