Light emitting diode package

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Description

FIG. 1 is a front perspective view of a light emitting diode package showing the new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

The ornamental design for a light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D505397 May 24, 2005 Asakawa
D517025 March 14, 2006 Asakawa
D568261 May 6, 2008 Lee et al.
D576573 September 9, 2008 Kobayakawa
D592617 May 19, 2009 Bando
D593967 June 9, 2009 Fushimi
D619110 July 6, 2010 Lin et al.
D624885 October 5, 2010 Lin et al.
D662902 July 3, 2012 Shieh et al.
D674361 January 15, 2013 Lin et al.
D693780 November 19, 2013 Chen et al.
D695239 December 10, 2013 Ko et al.
D698047 January 21, 2014 Sasaoka et al.
D698742 February 4, 2014 Niikura et al.
20120104426 May 3, 2012 Chan et al.
Patent History
Patent number: D712851
Type: Grant
Filed: Jun 5, 2013
Date of Patent: Sep 9, 2014
Assignee: Lextar Electronics Corporation (Hsinchu)
Inventors: Pei-Song Cai (Miao Li County), Shing-Kuo Chen (Taipei), Chun-Wei Wang (New Taipei)
Primary Examiner: Selina Sikder
Application Number: 29/456,955
Classifications