Abstract: A loudspeaker noise inspection method is to be implemented by an electronic device and includes the steps of: obtaining a frequency sweeping audio signal from an audio output generated by a loudspeaker in response to a frequency sweeping input signal; performing differentiation upon the frequency sweeping audio signal so as to generate a differentiated frequency sweeping audio signal; and dividing the differentiated frequency sweeping audio signal by a constant which is greater than 2? times a maximum frequency of the frequency sweeping audio signal, so as to obtain an attenuated frequency sweeping audio signal for inspection of a noise pulse in the frequency sweeping audio signal.

Abstract: An LED package structure includes: an insulating substrate that has a front bonding pad assembly; a dark-colored die-attach adhesive; blue and green LED chips mounted on the front bonding pad assembly via the dark-colored die-attach adhesive; and a dark-colored and light-transmissible encapsulant that is disposed on the insulating substrate and that encapsulates the blue and green LED chips. The encapsulant has a light transmittance that ranges from 7% to 28% for the blue light and has a light transmittance that ranges from 9% to 30% for the green light.

Abstract: A light emitting diode (LED) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board. The metal substrate has a first carrier portion and a second carrier portion. The second carrier portion is projected from the first carrier portion. The first carrier portion has a first carrier face. The second carrier portion has a second carrier face located higher than the first carrier face. The circuit board is disposed on the first carrier face, and the second carrier portion passes through the circuit board. The light emitting unit includes at least one LED chip disposed on the second carrier face of the second carrier portion, and the LED chip electrically connected to the circuit board. The encapsulant encapsulates the LED chip.

Abstract: A light emitting diode (LED) component includes a base having a main body and a wiring pattern. The main body defines an axis and includes two connecting surfaces respectively located at two opposite sides thereof, and a plurality of interconnected mounting surfaces surrounding the axis and connected between the connecting surfaces. The wiring pattern is at least disposed on the mounting surfaces and includes electrically insulated anode and cathode. A plurality of light emitting diode (LED) chips are disposed on the mounting surfaces. Each LED chip is electrically connected to the anode and the cathode.

Abstract: A light emitting diode (LED) device includes: a substrate having a central portion; an LED chip unit formed on the central portion of the substrate; a circuit pattern having a positive electrode and a negative electrode that are formed on the substrate, each of the positive electrode and the negative electrode including an arc portion and at least one extending portion that extends from the arc portion toward the central portion; a wire unit connecting the LED chip unit to the extending portions; a glass layer disposed on the substrate, covering the arc portions and including an opening unit that is aligned with the central portion of the substrate; a dam structure formed on the glass layer and extending along the arc portions; and an encapsulated body disposed substantially within the dam structure to cover the extending portions, the wire unit and the LED chip unit.

Abstract: An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the uniform light-emitting intensity of the second light through the progressive-type thickness of the second layer.

Abstract: A loudspeaker noise inspection method is to be implemented by an electronic device and includes the steps of: obtaining a frequency sweeping audio signal from an audio output generated by a loudspeaker in response to a frequency sweeping input signal; performing differentiation upon the frequency sweeping audio signal so as to generate a differentiated frequency sweeping audio signal; and dividing the differentiated frequency sweeping audio signal by a constant which is greater than 2? times a maximum frequency of the frequency sweeping audio signal, so as to obtain an attenuated frequency sweeping audio signal for inspection of a noise pulse in the frequency sweeping audio signal.

Abstract: A light-emitting touch-switch device includes a first circuit board, a cap unit and a light-emitting element. The first circuit board is electrically coupled to a sensing chip. The cap unit is disposed on the first circuit board and that is at least partially made of an electrically conductive plastic material having a resistance of equal to or smaller than 1×105 ?. The cap unit and the first circuit board cooperate to define a receiving space. The light-emitting element is disposed in the receiving space and is electrically coupled to the first circuit board. A light-emitting touch-switch module including the light-emitting touch-switch device is also disclosed.

Abstract: A light emitting diode (LED) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board. The metal substrate has a first carrier portion and a second carrier portion. The second carrier portion is projected from the first carrier portion. The first carrier portion has a first carrier face. The second carrier portion has a second carrier face located higher than the first carrier face. The circuit board is disposed on the first carrier face, and the second carrier portion passes through the circuit board. The light emitting unit includes at least one LED chip disposed on the second carrier face of the second carrier portion, and the LED chip electrically connected to the circuit board. The encapsulant encapsulates the LED chip.

Abstract: A light emitting diode (LED) component includes a base having a main body and a wiring pattern. The main body defines an axis and includes two connecting surfaces respectively located at two opposite sides thereof, and a plurality of interconnected mounting surfaces surrounding the axis and connected between the connecting surfaces. The wiring pattern is at least disposed on the mounting surfaces and includes electrically insulated anode and cathode. A plurality of light emitting diode (LED) chips are disposed on the mounting surfaces. Each LED chip is electrically connected to the anode and the cathode.