Abstract: A fuse holder can include a first holding part and a second holding part. The first holding part can include a first mounting apparatus, a first joint interface, and a first conductive terminal therebetween, and the second holding part can include a second mounting apparatus, a second joint interface, and a second conductive terminal therebetween. The first joint interface can lock with the second joint interface in a primary latching position or a secondary latching position. When the first joint interface locks with the second joint interface in the primary latching position, the first conductive terminal can be a first distance from the second conductive terminal, but when the first joint interface locks with the second joint interface in the secondary latching position, the first conductive terminal can be a second distance from the second conductive terminal that is greater than the first distance.

Abstract: Novel methods of preparing a metal bonded substrate. A method may include providing a ceramic substrate, the ceramic substrate comprising a ceramic body. The method may include bonding a thick metal sheet to the ceramic substrate, wherein the bonding comprises forming a metal oxide layer by powder deposition on a metal surface, and bringing the ceramic substrate and thick metal sheet together, wherein the metal oxide layer and the thick metal sheet interact to form an interface layer between the thick metal sheet and the ceramic substrate, after the bonding.

Abstract: A fuse comprising including a housing, a fusible element disposed within the housing, first and second terminals extending from opposite ends of the fusible element and out of the housing, and a quantity of arc suppressing material disposed on the fusible element, wherein the arc suppressing material is formed of a polyamide hotmelt adhesive mixed with a flame retardant.

Abstract: A dike as an epoxy squeeze out barrier in a fuse device is provided. The fuse device can include first and second layers of laminate material, a cavity formed by central openings of the first and second layers of the laminate material, a fuse element that is supported by at least one of the first and second layers of the laminate material and traverses the cavity, an adhesive located on at least one of the first and second layers of the laminate material for bonding thereof, and a dike located on at least one of the first and second layers of the laminate material and surrounding a circumference of the cavity. When the first and second layers of the laminate material, the fuse element, the adhesive, and the dike are pressed together during manufacture, the dike can prevent the adhesive from flowing into the cavity.

Abstract: A fuse device is provided that can include a rectangular fuse and a round fuse socket cap that can include a rectangular receptacle for receiving the fuse. The fuse socket cap and the fuse can be free of red phosphorous, and the rectangular receptacle can consume a percentage of a surface area or a volume of the fuse socket cap below a predetermined threshold that prevents reduction of a breaking capacity of the round fuse socket cap.

Abstract: A terminal assembly, arranged for an automobile harness, comprising: a substrate; a modified terminal, arranged as a plate structure that is arranged on the substrate and extends perpendicularly with respect to a plane of the substrate; and a resettable fuse component, the resettable fuse component comprising a polymer positive temperature coefficient (PPTC) material, and coupled in series with the modified terminal.

Abstract: A connector for contacting a semiconductor chip. The connector may include a tab, where the tab includes an outer portion, having a planar shape, the outer portion having a lower surface, adapted to contact a surface of the semiconductor chip, and an upper surface that defines a main plane of the tab. The tab may also include a ring potion, the ring portion connected to the outer portion and extending proud of the main plane, wherein the ring portion defines an inner hole within the tab structure, the inner hole being adapted to expose a contact portion of the surface of the semiconductor chip, wherein the ring portion includes at least two slots. The connector may further include a clip, comprising a connection portion, the connection portion having an aperture that is adapted to couple around the ring portion.

Abstract: A method of manufacturing a metal oxide varistor (MOV), the method including placing a quantity of a MOV composition in a pressing die, the MOV composition including metal oxide granules mixed with a polyaniline-polymer, performing a pressing operation including operating the pressing die to compress the MOV composition into a solid MOV chip, and applying first and second electrodes to opposing first and second sides of the MOV chip, wherein the pressing operation is performed at a temperature in a range of 15 degrees Celsius to 200 degrees Celsius.

Abstract: A semiconductor device protection arrangement. The semiconductor device protection arrangement may include a semiconductor chip; a controller, coupled to the power semiconductor chip; and a temperature sensor, disposed in thermal contact with the semiconductor chip, where the temperature sensor includes a positive temperature indicator (PTI) component.

Abstract: Approaches disclosed herein are related to vertically oriented fusible devices and vertically oriented fuse blocks. In one approach, a vertical fuse assembly may include a body comprising an upper section and a lower section, and a fuse extending between an upper terminal and a lower terminal, wherein the upper terminal is positioned within the upper section, wherein the lower terminal is positioned within the lower section, and wherein the lower terminal extends through the lower section. The vertical fuse assembly may further include a side terminal adjacent the fuse body, wherein the side terminal extends through the lower section.

Abstract: A fuse assembly includes a housing and a wound wire operable as a fusible element. The housing has a cavity for the fusible element. The fusible element is formed by coating a wire with enamel and wrapping the wire around a core to produce enamel-coated wound wire. The enamel-coated wound wire is attached to the housing. The core is etched away until the core is dissolved and the enamel is stripped away.

Abstract: A self-limiting heater and method for building the self-limiting heater are disclosed. The self-limiting heater consists of a resistor and a PTC resistor coupled together in series with a power supply. Both resistive devices have good thermal coupling. The resistor has a low temperature coefficient while the resistance of the PTC resistor increases with an increase in temperature. The ohmic resistance ratio between the resistor and the PTC may be used to adjust the heater characteristics and limit the characteristic sharpness.

Abstract: Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a substrate, and a fusible element extending between a first terminal and a second terminal, wherein the fusible element, the first terminal, and the second terminal are coupled to the substrate. The protection device may further include a cover formed over the fusible element, wherein the fusible element is positioned between the cover and the substrate.

Abstract: A fuse holder includes a housing and a knob. The housing has a telescoping chamber designed to receive a knob terminal, where the knob terminal is adapted to receive a fuse. The knob has a neck which is inserted into the telescoping chamber to enclose the cylindrical fuse. The housing and neck are made of a polymer having a thermal conductivity in a range of 4.0 to 10 W/mK.

Abstract: A device assembly for surface mount devices includes a matrix of SMD skeletons and a polymeric positive temperature coefficient (PPTC) material disposed over the matrix. The matrix consists of multiple rows, with each SMD skeleton having a pair of terminals and multiple whiskers perpendicular to and between the terminals. The PPTC material connects the terminals to the whiskers.

Abstract: A lead-free power semiconductor package (PSP) includes a substrate, multiple copper leads, a die, and an encapsulant. The substrate has alternating layers of copper and silicon nitride. The copper leads, which are not part of a leadframe, are connected to the substrate using active metal brazing. The die, which contains circuitry to allow the PSP to operate, is connected to the substrate using silver sintered paste. The encapsulant encases the substrate and the die with a portion of the multiple leads being outside the encapsulant.

Abstract: A positive temperature coefficient (PTC) heater including a PTC layer formed of a material exhibiting a non-linear change in resistance in response to changes in temperature, an electrode layer including first and second electrodes disposed atop the PTC layer, each of the first and second electrodes including a spine and a plurality of tines extending inwardly therefrom, with the spine of the first electrode oriented parallel to the spine of the second electrode and with the tines of the first electrode disposed in an interdigitated relationship with the tines of the second electrode, an adhesive layer including first and second adhesive strips disposed atop the spines of the first and second electrodes, respectively, and a busbar layer including first and second busbars disposed atop the first and second adhesive strips, respectively, and adhered to the spines of the first and second electrodes by the first and second adhesive strips, respectively.

Abstract: Circuitry and techniques for providing a bidirectional switch in devices for overcurrent protection and voltage protection are disclosed herein. In one embodiment, a circuit may include a first reverse-blocking insulating gate bipolar transistor (IGBT), having a first gate terminal, first collector terminal and a first emitter terminal. The circuit may include a second reverse-blocking IGBT, having a second gate terminal, a second collector terminal, electrically coupled to the first emitter terminal, and a second emitter terminal, electrically coupled to the first collector terminal. As such the first IGBT and the second IGBT may define a first current path, extending from the first collector to the second emitter; and a switch control circuit, coupled to send a control signal to at least one of: the first gate terminal and the second gate terminal, during an overcurrent event.

Abstract: A pre-charge circuit. The precharge circuit may include a switching device for controlling a voltage to be supplied to a battery; and a heterogeneous thermistor circuit, coupled to the switching device. The heterogeneous thermistor circuit may include a negative temperature coefficient (NTC) component; and a polymer positive temperature coefficient (PPTC) component, arranged in electrical series with the NTC component and the switching device.

Abstract: Disclosed is an adaptive pre-charge control circuit, for use in a solid state battery disconnect and protection system, wherein the adaptive pre-charge control circuit includes a high-voltage switch coupled between an electric battery and a DC link capacitor of an electric vehicle, and wherein the electric vehicle is powered by the electric battery. The control circuit may be operable to issue a pulse width modulated (PWM) signal to generate a current profile wherein every other pulse exceeds a predefined limit, monitor, during pre-charging, the current profile, and to determine an overcurrent fault exists in the case that two consecutive pulses exceed the predefined limit.