Abstract: A relay circuit may include a solid state relay switch, coupled to an external voltage line and to an charging capacitor; and a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may be arranged to: turn the solid state relay switch to an OFF state when a capacitor voltage of the charging capacitor falls below a low threshold value; and change the solid state relay switch from the OFF state to an ON state when the capacitor voltage increases above a high threshold value.

Abstract: An active/passive fuse module including a fuse having an electrically insulating fuse body, first and second endcaps disposed on opposing ends of the fuse body, a fusible element extending through the fuse body between the first endcap and the second endcap, and an arc quenching material disposed within the fuse body and surrounding the fusible element. The fuse module further includes a pyrotechnic interrupter (PI) coupled to the fuse body, the PI having a housing defining a shaft, a piston disposed within the shaft, a drive pin extending from the piston into the fuse body, the drive pin terminating in a cutter disposed adjacent the fusible element, and a pyrotechnic ignitor disposed within the shaft above the piston configured to detonate upon receiving an initiation signal from a controller, whereby the piston and the drive pin are forcibly driven through the shaft causing the cutter to separate the fusible element.

Abstract: A pressure contact assembly includes a power substrate, a chip, and a lead. The power substrate has a surface connected to a ceramic tile and a cavity. The chip is soldered to the surface. The lead is to be inserted into the cavity and has a top portion to connect to an external device and a bottom portion to fit into the cavity.

Abstract: A substrate assembly may include a power substrate, a chip, a clip, and a trimetal. The power substrate has a first direct copper bonded (DCB) surface connected to a ceramic tile. The chip is soldered onto the first DCB surface. The clip is attached to the power substrate and has a foot at one end and a recessed area at the other, opposite end. The foot is connected to the power substrate. The trimetal has a base, a trapezoid structure, and a clip portion. The base is soldered to the chip. The trapezoid structure is located above the base. The clip portion is located above the trapezoid structure and includes a projecting area. The recessed area of the clip fits into the projecting area of the trimetal.

Abstract: Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a substrate and a fusible element coupled to the substrate, wherein the fusible element may include a first end opposite a second end, and wherein the first and second ends wrap around the substrate. The fusible element may further include a central section comprising a plurality of segments connected end-to-end in a continuous arrangement between the first and second ends, wherein a first set of segments of the plurality of segments extends along a first plane, and wherein a second set of segments of the plurality of segments extends along a second plane, different than the first plane.

Abstract: A power semiconductor device package. The package may include a baseplate that has a plurality of through holes. The package may also include an insulating body, affixed to a top side of the baseplate The insulating body may include a main portion, to enclose a set of semiconductor devices therein, and a plurality of locking structures, the plurality of locking structures disposed along a lower periphery of the main portion, and integrally formed within the insulating body, wherein the plurality of locking structures extend through the baseplate.

Abstract: An electrical device assembly and method to attach an isolated single stud fuse assembly to an electrical device are disclosed. The electrical device assembly consists of multiple studs, one or more of which is replaced with the isolated single stud fuse. A conductive copper landing zone receives an electrically isolated steel stud. When the landing pad assembly is orbital riveted into a plastic housing of the electrical device, the stud is locked into the housing permanently. Electrical devices such as disconnect switches and power distribution modules, both of which include multiple studs, are good candidates for being adapted with the single stud fuse assembly.

Abstract: A fuse includes a stack, a flattened wire, and a terminal. The stack has multiple layers arranged to form steps. The stack has an upper stack with layers of a first size and a lower stack with layers of a second, larger size. The flattened wire is located between the upper stack and the lower stack. The terminal is connected to the flattened wire and includes multiple surfaces to cover the steps at one end of the stack.

Abstract: A single bolt fuse assembly and method to connect a single bolt fuse to a circuit or device are disclosed. The single bolt fuse assembly enables the single bolt fuse to be used on any electrical device having a hole suitable for receiving a threaded shaft and connectable to a circuit or device that electrically connects to a female battery or power cable. The apparatus includes a separate high-conductive metal terminal that mates with the stud that mechanically attaches the fuse between the electrical devices. The stud is insulated to avoid becoming part of the electrical circuit and to ensure proper operation of the fuse. By mechanically attaching the stud to the metal terminal, the stud is unlikely to get separated from the fuse.

Abstract: A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

Abstract: A chip fuse includes a first terminal disposed on a first end of a fuse element array and a second terminal disposed on a second end of the fuse element array opposite the first end. The fuse element array includes multiple layers disposed in a stacked arrangement, each layer including a first terminal portion disposed within the first terminal, a second terminal portion disposed within the second terminal, a first fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion, and a second fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion. The first fuse element portion is adjacent the second fuse element portion.

Abstract: A fuse holder includes a movable tab, a base, and a cover. A stud is affixed to the movable tab and secures a terminal of a bolt-down fuse. A second stud is affixed to the base and secures a second terminal of the bolt-down fuse. The base has a channel into which the movable tab is slidably inserted. The cover connects to the base and is located over the stud and the second stud.

Abstract: A relay circuit, including a solid state relay switch, connected to a first relay line and to a charging capacitor, and connected to a second relay line. The relay circuit may also include a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may include a voltage detection circuit, having an input coupled to an output of the charging capacitor, and having an output arranged to generate a LOW voltage signal when a voltage level of the charging capacitor is below a low threshold value. The solid state relay control circuit may also include a zero crossing circuit, coupled to the first relay line and the second relay line, and having an output to generate a clock signal when a zero crossing event takes place between the first relay line and the second relay line.

Abstract: A relay circuit may include a solid state relay switch, coupled to an external voltage line and to an charging capacitor; and a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may be arranged to: turn the solid state relay switch to an OFF state when a capacitor voltage of the charging capacitor falls below a low threshold value; and change the solid state relay switch from the OFF state to an ON state when the capacitor voltage increases above a high threshold value.

Abstract: A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

Abstract: A high breaking capacity fuse including an electrically insulating fuse body, a fusible element extending through the fuse body, an electrically conductive first terminal connected to a first end of the fusible element, an electrically conductive second terminal connected to a second end of the fusible element, and a first fire extinguishing pad and a second fire extinguishing disposed within the fuse body and sandwiching the fusible element therebetween, each of the first and second fire extinguishing pads formed of a polymeric substrate and a plurality of microcapsules embedded in the polymeric substrate, the plurality of microcapsules filled with an arc-quenching liquid.

Abstract: A fuse including a fuse body having first and second end faces at opposing first and second longitudinal ends thereof, each of the first and second end faces having at least one notch formed therein, a fusible element extending through the fuse body and having a first end bent over the first end face and disposed within the at least one notch in the first end face and a second end bent over the second end face and disposed within the at least one notch in the second end face, and a first endcap disposed on the first longitudinal end of the fuse body and a second endcap disposed on the second longitudinal end of the fuse body, wherein the first and second endcaps flatly abut the first and second end faces without interference from the fusible element.

Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. The PPTC device may include a PPTC body; a first electrode disposed on a first surface of the PPTC body and a second electrode disposed on a second surface of the PPTC body, opposite the first electrode. The PPTC body may include a polymer matrix; and a conductive filler, disposed in the polymer matrix. The conductive filler may include a tungsten carbide component comprising at least 30 volume percent of the PPTC body; and a carbon component, wherein a total volume fraction of the conductive filler comprises between forty volume percent and sixty five volume percent of the PPTC body.

Abstract: A fuse assembly includes a housing and a wound wire operable as a fusible element. The housing has a cavity for the fusible element. The fusible element is formed by coating a wire with enamel and wrapping the wire around a core to produce enamel-coated wound wire. The enamel-coated wound wire is attached to the housing. The core is etched away until the core is dissolved and the enamel is stripped away.

Abstract: A relay circuit may include a solid state relay switch, coupled to an external voltage line and to an charging capacitor; and a solid state relay control circuit, coupled between the charging capacitor and the solid state relay switch. The solid state relay control circuit may be arranged to: turn the solid state relay switch to an OFF state when a capacitor voltage of the charging capacitor falls below a low threshold value; and change the solid state relay switch from the OFF state to an ON state when the capacitor voltage increases above a high threshold value.