Abstract: Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combination of nitrogen containing compounds and transition metal complexes, and a polysulfide toughening agent.

Abstract: In accordance with the present invention, there are provided gem-diesters and epoxidized derivatives thereof. When cured, thermosets comprising invention gem-diesters and epoxidized derivatives thereof have thermally and/or chemically labile gem-diester groups interspersed throughout the crosslinked network. Thus, thermosets based on invention gem-diesters and epoxidized derivatives thereof can be easily reworked thermally or chemically by treatment with dilute acidic or basic solutions. Further provided by the present invention are adhesive compositions comprising invention gem-diesters and epoxidized derivatives thereof.

Abstract: A one-part adhesive composition for bonding glass including: (a) a cyanoacrylate monomer; (b) 15 to 60% w/w of at least one plasticizer by weight of the composition; (c) 0.01% to 5.0% w/w of at least one silane by weight of the composition.

Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.

Abstract: The present invention is directed to low intensity UV curable adhesives formulated using a blend of acrylate oligomers and monomers which are capable of bonding glass, provide improved low-yellowing properties and fast cure speed over current glass bonding adhesives, while maintaining good bond strength lo and durability comparable to, or better than, state-of-the-art glass bonding adhesives.

Abstract: Anaerobic adhesive compositions, the reaction products of which demonstrate improved cure speed and bond strength are disclosed. A high percentage of ultimate bond strength is reached within the first hour of room temperature cure. Higher ultimate bond strengths as compared to conventional compositions are achieved. The anaerobic adhesive compositions incorporate an adhesion promoter which contributes to these properties.

Abstract: The invention relates to a lead-free solder paste comprising a solder paste flux and solder alloy particles that are substantially lead-free wherein the solder paste flux comprises resin dissolved in a solvent and also includes undissolved resin particles less than 25 &mgr;m in size homogenously dispersed therein to provide improved solder alloy powder coalescence and substrate surface wetting while maintaining appropriate solder paste rheology for use in printed circuit board assembly processes.

Abstract: The present invention relates to anaerobic adhesive compositions which have been optimized using experimental design techniques to produce desired physical properties. A simplified cure system is disclosed which permits enhanced fixture and cure times.

Abstract: In accordance with the present invention, there are provided novel benzoxazine compounds and thermosetting resin compositions prepared therefrom. Invention compositions are particularly useful for increasing adhesion at interfaces within microelectronic packages. Invention benzoxazines are useful for the preparation of invention compositions with properties which are associated with increased adhesion at interfaces, such as, for example, low shrinkage on cure and low coefficient of thermal expansion (CTE). In another aspect of the invention, there are provided die-attach pastes having increased interfacial adhesion. Invention die-attach pastes include benzoxazine-containing thermosetting resin compositions. In further aspects of the invention, there are provided methods for enhancing adhesive strength of thermosetting resin compositions and methods for enhancing adhesion of a substrate bound to a metallic surface by a thermosetting resin composition.

Abstract: The present invention provides a new class of materials effective as curatives for anaerobic adhesive compositions. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH, surprisingly provides at least comparable cure speeds and physical properties for the reaction products formed therefrom.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: Heat-curable silicone compositions employing a reactive silicone, a silicone hydride crosslinker and a catalyst system which includes a rhodium-based catalyst, a stabilizing system are disclosed. A combination of rhodium and platinum-based catalysts are employed as well. The compositions are low temperature curing and are capable of providing low coefficient of thermal expansion compositions. A stabilizer system which includes in combination a peroxide and an acetylenic compound is also disclosed.

Abstract: An alkoxylate adduct of a polyol. The polyol is an amorphous diol having a melting point above about 100° C. The alkoxylate is propylene oxide, butylene oxide, a mixture of propylene oxide and butylene oxide or a mixture of one or both of propylene oxide and butylene oxide with up to 50 mole % of ethylene oxide. The first polyol has an average of from about 1 to about 5 units of alkoxylate per mole of said amorphous diol. The adduct is useful in preparing urethane (meth)acrylate capped resins and compositions thereof. Resins prepared from such adducts have better manufacturing and solubility properties while retaining similar physical properties to resins prepared from the unadducted diol. The adduct may be for instance a propoxylate of hydrogenated bisphenol A having an average of from 1.5 to 3.5 moles of PO per mole of hydrogenated bisphenol A.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: An air-activatable polymerisable composition useful, in the field of adhesives, sealants, surface coatings, moulding resins and composite matrices, comprises: a) at least one free-radically polymerisable monomer, b) an activator system for effective polymerisation of the free-radically polymerisable monomer, said activator system comprising at least one auto-oxidisable compound which is a beta diketone, c) a soluble ionic salt, particularly a transition metal salt, d) and a weak acid or a latent weak acid, with the proviso that the composition does not contain a peroxide, or a peroxide precursor which produces peroxide in the absence of air, or any ingredient which is a significant source of radicals in the absence of air.

Abstract: A device for winding pipe sealant filamentary materials onto a pipe comprising: (a) a retainer for retaining a length of filamentary material; and (b) an elongate dispensing aid projecting from said retainer, the dispensing aid comprising at least one guide located at a position spaced from the retainer and through which the filamentary material passes. The material is for sealing threaded pipe joints. The device may be motorized for rotational motion, for example by attachment to a power tool. The device may also have a locating portion for engaging an end of a pipe to which the filamentary material is to be applied. The locating portion may act as an automatic adjuster of the position of the device. Relative rotation of the dispensing aid and the automatic adjuster actuates the automatic adjuster. The device allows for ease of application of pipe sealant material to pipes and may be hand-held.

Abstract: A shipping container for exothermic material comprises an outer container and a plurality of inner containers enclosed within the outer container with a quantity of coolant material adjacent the inner containers. Each inner container includes a box defining an enclosure, a fluted insert disposed within such enclosure for supporting a plurality of vessels, such as plastic syringes containing exothermic material. Each fluted insert includes a plurality of open ended recesses for receiving the syringes separated by upstanding walls defining a barrier between the supported syringes. A pair of heat shields, one at the bottom and one at the top of each inner box, is included for dissipating heat therewithin. Plural inner containers housing exothermic material are bubble-wrapped in a stacked arrangement with gel packs between each inner container.

Abstract: A UV curing lamp assembly permits adjustable positioning of a UV curing lamp with respect to a bracket supporting a reflector. The assembly includes an elongate UV lamp having opposed ends. A reflector having a central base and a curved reflective wall includes a pair of opposed openings through the reflector wall for passage of the UV lamp therethough. A bracket adjustably supports the reflector and the lamp. The bracket includes a bracket body movably supporting a mounting member for adjustably supporting the reflector with respect to the bracket body. A support arm extends from the bracket body towards one of the openings in the reflector. The support arm adjustably supports one of the ends of the UV lamp with respect to the reflector.

Abstract: In accordance with the present invention, there are provided free-radical polymerizable compositions comprising polycyclic olefins, wherein the polycyclic olefins contain little, if any, cyclopentenyl unsaturation. As a result, these olefins are sufficiently reactive with the propagating free-radicals during cure to provide a highly crosslinked thermoset resin. Moreover, invention compositions comprise high molecular weight polycyclic olefins having low volatility. Accordingly, the observed undesirable weight loss upon cure of prior art thermosetting compositions is considerably reduced. Further provided by the present invention are compositions comprising functionalized polycyclic olefin monomers. These functionalized olefin monomers provide additional benefits such as increased adhesion to a variety of surfaces and greater control over glass transition temperatures.