Abstract: A composition including at least one anaerobically polymerizable compound; and at least one condensation product of an aldehyde and or ketone/with a polyol. The invention also provides a composition as described above which is in the form of a soft solid, for example, in the form of a stick. A two-part composition is provided, comprising a first part containing at least one polymerizable compound; and a second part containing at least one curing component for polymerizing the composition, wherein at least one of the first or second parts additionally comprises at least one gelling or solidifying agent. A kit is provided comprising the composition according to the invention which includes at least one primer component and at least one carrier solvent for the primer component, and a second composition which includes at least one anaerobically polymerizable compound and at least one condensation product of an aldehyde and or ketone/with a polyol.

Abstract: Metal alkyl borohydrides are used as initiators of polymerisation, particularly in adhesive compositions for bonding a wide range of substrates including low surface energy substrates such as polyolefins. As described, the metal alkyl borohydrides are of the formula I or II. wherein R1 is C1-C10 alkyl, R2 and R3, which may be the same or different, are H, D, C1-C10 alkyl or C3-C10 cycloalkyl, phenyl, or phenyl-substituted C1-C10 alkyl or C3-C10 cycloalkyl, provided that any two of R1-R3 may optionally be part of a carbocyclic ring, and M+ is a metal ion. In particular, alkali metal trialkyl borohydrides are used, the alkali metal salt being selected from: Lithium triethylborohydride, Sodium triethylborohydride, Potassium triethylborohydride, Lithium tri-sec-butylborohydride, Sodium tri-sec-butylborohydride, Potassium tri-sec-butylborohydride, and Lithium triethylborodeuteride. Other exemplified compounds which are less effective on low surface energy substrates include Lithium 9-borabicyclo [3.3.

Abstract: This invention relates to cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, certain accelerators to improve fixture speeds on certain substrates.

Abstract: A composition including at least one solvent for cured product and at least one gelling or solidifying agent. The invention also provides a composition described above which is in the form of a soft solid, for example, in the form of a stick. A pack is also provided, comprising (i) a shaped mass of a composition, which includes at least one solvent for a cured product and at least one gelling or solidifying agent and a container (1) for the composition. The container (1) has a mechanism for expelling the shaped mass.

Abstract: A molding composition that is particularly useful for coating and encapsulating electronic or electrical devices is disclosed. The molding composition exhibits improved flame retardancy and includes an epoxy resin, a hardener for the epoxy resin, and flame retardant compounds of melamine cyanurate and an oxyanion of a Group VIA element, such as tungsten trioxide.

Abstract: Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, a flame retardant compound such as melamine cyanurate, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions exhibit improved flame retardancy. Also, when multifunctional epoxy resins and multifunctional phenolic hardeners such as those derived from phenol with a degree of branching of at least three are used, the molding compounds including the quaternary organophosphonium salt as a catalyst exhibit long flow and low shrinkage and warpage.

Abstract: In accordance with the present invention, there are provided novel benzoxazine compounds and thermosetting resin compositions prepared therefrom. Invention compositions are particularly useful for increasing adhesion at interfaces within microelectronic packages. Invention benzoxazines are useful for the preparation of invention compositions with properties which are associated with increased adhesion at interfaces, such as, for example, low shrinkage on cure and low coefficient of thermal expansion (CTE). In another aspect of the invention, there are provided die-attach pastes having increased interfacial adhesion. Invention die-attach pastes include benzoxazine-containing thermosetting resin compositions. In further aspects of the invention, there are provided methods for enhancing adhesive strength of thermosetting resin compositions and methods for enhancing adhesion of a substrate bound to a metallic surface by a thermosetting resin composition.

Abstract: A moisture curable compound for bonding substrates and a moisture curable adhesive composition are provided. The adhesive composition includes an alkoxysilane functional urethane compound having hydrolyzable alkoxysilane groups anchored on a flexible backbone. Also provided are processes for the preparation of the moisture curable compounds and a method of using them as moisture curable adhesives for bonding substrates to produce bonded composites.

Abstract: A radiation-curable composition that includes a cyanoacrylate component or a cyanoacrylate-containing formulation, a photoinitiated radical generating component, and a photoinitiator component is provided.

Abstract: In accordance with the present invention, it has been discovered that the addition of organic acids provides improved performance properties to curable compositions, e.g., improved flux compatibility, improved flow properties, improved voiding properties, and the like. Accordingly, there are provided curable compositions having improved performance properties, methods for the preparation thereof, and methods employing same. Also provided are novel articles prepared using invention compositions.

Abstract: In accordance with the present invention, there are provided novel heterobifunctional monomers and users for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.

Abstract: The present invention relates to adhesive and sealant compositions in non-flowable form. More particularly, the present invention relates to non-flowable adhesive and sealant compositions which are particularly useful in the threadlocking and sealing applications and which can be packaged in a convenient pocket-sized applicator dispenser.

Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at higher cure speeds and comparable physical properties for the reaction products formed therefrom.

Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

Abstract: The present invention relates to heat curing impregnation sealant compositions, which are readily separable from water upon mixing.

Abstract: Non-staining, active metal-working compositions are disclosed. The compositions contain active sulfur to provide extreme pressure properties for metal-working fluids. A metal corrosion inhibitor is disclosed that reduces the corrosivity of free sulfur on non-ferrous metallic objects.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: An article of manufacture which comprises a material for sealing threaded pipe joints comprising a multifilament yarn ready-coated with a joint sealing composition and packaged in a dispenser from which the coated yarn may be supplied for direct application to a threaded area of a pipe.

Abstract: Cyanoacrylate composition, having a cure indicator within the composition, is disclosed herein. The cyanoacrylate composition is “self-indicating” with respect to its ability to allow the end user to visually inspect the composition to determine whether, and the extent to which, cure has occurred. The composition includes a cyanoacrylate component, and a dye dissolved in the cyanoacrylate component. The cyanoacrylate composition has an initial color, oftentimes colorless or substantially so to the naked eye, and when cured, the cured cyanoacrylate composition has a different or second color. Observation of the second or different color is indicative that cure has occurred and the extent of the color change can be used to determine the degree of cure that has occurred.

Abstract: In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.