Abstract: The present invention relates to adhesive and sealant compositions in non-flowable form. More particularly, the present invention relates to non-flowable adhesive and sealant compositions which are particularly useful in the threadlocking and sealing applications and which can be packaged in a convenient pocket-sized applicator dispenser.

Abstract: The present invention relates to dual curing silicone compositions which are capable of cross-linking when subjected to ultraviolet (“UV”) or visible (“VIS”) light and/or by a moisture condensation method. When cured, these compositions have excellent adhesion to a variety of substrates. These are particularly useful in potting and coating applications.

Abstract: The present invention is directed to radical-curable adhesive compositions which include a (meth)acrylate component; a thermal resistance-conferring component; and a radical cure-inducing composition. Reaction products of the compositions of this invention exhibit superior resistance of thermal degradation.

Abstract: The present invention provides silicone compositions, cured elastomers thereof demtonstrate improved resistance to oil. The compositions include a reactive silicone component, wherein the silicone component cures by way of an addition cure mechanism or a condensation cure mechanism; and a basic filler component to confer oil resistance to the cured elastomer. Where the reactive silicone component cures by way of an addition cure mechanism, an addition cure catalyst is also included. To that end, in one embodiment of the invention, the composition includes a vinyl-terminated silicone fluid, a hydrogen-functionalized silicone fluid; a basic filler to confer oil resistance to the cured elastomer and an addition cure catalyst. In another embodiment of the invention, the composition includes a hydroxy-terminated diorganopolysiloxane, a precipitated calcium carbonate, at least about 5% by weight of a composition comprising magnesium oxide particles having a mean particle size of about 0.5 &mgr;M to about 1.

Abstract: A single stroke fluid dispense system, including a dispense member having a dispense end defining a dispense end opening and a container well communicating with the dispense end opening for receiving a fluid to be dispensed. A closure cap is supported over the dispense end opening of the dispense member and further defines a fluid passageway therethrough in fluid communication with the container well. A compression assembly for forcing the fluid through the fluid passageway of the closure cap is also provided. A sealing piston assembly maintains the closure cap in sealing engagement with the dispense member. The closure cap may further defined a burst port at one end of the fluid passageway facing the container well which is especially useful for dispensing fluid from a flexible rupturable container. The compression assembly maintains fluid integrity between the container and the closure cap about the rupture port throughout dispensement so as to thwart fluid from leaking into the container well.

Abstract: A methacrylate ester or acrylate ester two-part reactive adhesive composition including vinyl-terminated liquid rubber and polymeric elastomer. The vinyl-terminated liquid rubber is preferably methacrylate-terminated or acrylate-terminated polybutadiene; the polymeric elastomer is preferably polychloroprene, core shell polymer and/or block copolymer rubber.

Abstract: A radiation-curable composition which includes a cyanoacrylate component or a cyanoacrylate-containing formulation; a metallocene component; and a polymerizingly effective amount of a photoinitiator to accelerate the rate of cure is provided.

Abstract: Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed are the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits.

Abstract: In accordance with the present invention there are provided cycloaliphatic epoxy compounds and thermosetting resin compositions prepared therefrom. Inventive compounds are based on polycyclic hydrocarbon backbones, as illustrated by the following exemplary structure: wherein: each R is independently lower alkyl or halogen, n′″ is 1 up to about 8, and each x is independently 0, 1, or 2. Inventive compounds provide resins with desirable characteristics such as, for example, hydrophobicity, high Tg values, ionic purity, hydrolytic stability, and the like.

Abstract: In accordance with present invention there are provided novel epoxy derivatives of polycyclic compounds. Invention epoxies are particularly suited for incorporation into thermosetting resins. Resins comprising invention epoxies are hydrophobic and therefore less susceptible to popcorning upon cure or use in high temperature applications. The hydrophobicity also makes such resins less susceptible to hydrolysis upon exposure to moisture.

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

Abstract: In accordance with the present invention, there are provided novel heterobifunctional monomers and uses for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.

Abstract: A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.

Abstract: A silicone composition that is oil resistant when cured is described. More particularly, this composition includes a silanol terminated silicone fluid, an organic plasticizer, a filler and a crosslinker, wherein the cured composition remains adhesive after exposure to oil. The present compositions provide superior adhesive properties after exposure to oil than conventional RTV silicone adhesives having M-stopped silicone plasticizers. Methods of making and using cured elastomeric products made from the present compositions are also provided.

Abstract: The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses, as well as films containing such arrays and recesses. The present invention also relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable or non-curing/non-solidifiable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between leads or pads.

Abstract: The invention provides a method and apparatus for controlling in a path-dependent manner the force generated by a piston. A first piston travels in a first cylinder—divided into a first and second chamber by the first piston—together with a pressure fluid. A second cylinder is provided in which a second piston travels. Like the first cylinder, the second cylinder is also divided by the second piston into a first and a second chamber, in this case by the second piston. The first and second pistons are coupled mechanically. The pressure in the second chamber of the second cylinder is regulated such that it is always equal to the counterpressure in the first chamber of the second cylinder and the second chamber of the first cylinder.

Abstract: The present invention provides anaerobic adhesive compositions, reaction products of which demonstrate controlled-strength at ambient temperature conditions and enhanced resistance to thermal degradation at elevated temperature conditions. The compositions are (meth)acrylate- and/or polyorganosiloxane-based and may include one or more of a variety of other components, such as certain coreactants, a maleimide component, a diluent component reactive at elevated temperature conditions, mono- or poly-hydroxyalkane components, and other components.

Abstract: The invention relates to a method of preparing a polybenzoxazine which includes heating a molding composition including a benzoxazine and a heterocyclic dicarboxylic acid to a temperature sufficient to cure the molding composition, thereby forming the polybenzoxazine. Also disclosed are a method of preparing a polybenzoxazine composition having near-zero volume change after post cure and a method of coating a device using a polybenzoxazine composition of this invention.

Abstract: A non-ozone depleting, non-flammable co-solvent composition useful as a carrier for actives such as accelerators, catalysts, initiators, activators and other primer materials for use as adhesive promoter compositions in combination with adhesive compositions. The co-solvent compositions include an azeotropic, non-flammable solution of a fluorinated compound and a substituted benzene compound.

Abstract: The present invention relates to epoxy compositions; in particular the present invention relates to stable low temperature curing epoxy-based compositions.