Abstract: The present invention provides an improved method and apparatus for manufacturing elastic hair fasteners that eliminate the need for a metal clamp in the fastener assembly. The apparatus of the present invention that employs the inventive process is an incremental, automatic system that utilizes intricate mechanisms that are pneumatically actuated and controlled electrically. The machine feeds textile feedstock from a bulk supply along a feed track to a predefined staging position. Once the feedstock has reached this position, it is cut into an extension having a predetermined length and a pair of opposed free ends. The extension is rolled into a half circle, and one free end is positioned in a precise location. In this location, adhesive is applied to the free end, and the other half of the extension is thereafter rolled into a half circle, completing the loop. At this point, the two loop ends are positioned adjacent one another so as to be adhesively joined.

Abstract: A controllable device for applying a flowable material such as anti-seize composition to a workpiece utilizes a plurality of elongated nozzles insertably accommodated through a fixture plate to deposit such material onto the workpiece in a predetermined pattern. The fixture plate is provided with a corresponding number of apertures which accommodate different sizes and numbers of nozzles so that material may be applied to a large variety of workpieces without significant maintenance and modification to the device. The fixture plate is essential to define a predetermined clearance between an outlet through which the flowable material escapes from a nozzle and a surface onto which such material is applied and further cleans the nozzles in between application cycles to prevent overrun on to a workpiece surface.

Abstract: The present invention relates to anaerobic adhesive compositions which have been optimized using experimental design techniques to produce desired physical properties. A simplified cure system is disclosed which permits enhanced fixture and cure times.

Abstract: A squeezable, multi-layer, structurally self-supporting container capable of dispensing a controlled amount of a liquid product. The container comprises an external layer of a polyolefin material, an internal layer formed of a polyolefin material, and an intermediate layer positioned between the external layer and the internal layer. The intermediate layer is formed of a barrier material blended with an adhesive resin and a carrier.

Abstract: A container is described which is suitable for use with anaerobic products such as sealants and adhesives which cure, set-up or polymerise in the absence of air. The container is flexible having at least one wall made of a deformable, oxygen permeable material, which defines a cavity for receiving and retaining the anaerobic product. The wall may be made of polyethylene or polypropylene.

Abstract: A curable composition and method for making hollow shell molds, such as those employed to make hearing aids. The curable composition includes a (meth)acryl functionalized curable component, a cure system, a pigment composition, and a dispersion stabilizing additive. The pigment composition includes at least one pigment disbursed within the curable composition. The dispersion additive maintains the pigment in a disbursed form prior to cure. The dispersion additive includes an alkali metal cation and a reaction product.

Abstract: The present invention discloses a thermally conductive adhesive composition that is useful for encapsulating electronic parts. More particularly, this invention provides adhesive compositions that have 90% of the alumina particles having an average diameter sufficiently low to maintain the particles in suspension. The thermally conductive compositions of the present invention have a low viscosity and excellent thermal conductivity properties. Also contemplated is an electronic part that is encapsulated with the inventive composition, an article of manufacture having a container with the inventive composition contained therein and a method of manufacturing the inventive thermally conductive adhesive composition.

Abstract: In accordance with the present invention, there are provided novel heterobifunctional monomers and uses for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.

Abstract: For manufacturing a seal between two machine parts (10, 11) which together enclose a space (14) in which, at least at times, high pressure and/or high temperature prevail, sealing means which contain a curable composition (30) are arranged between the two machine parts (10, 11). The curable composition (30) is applied directly onto one or both machine parts (10, 11) in liquid form at least in the area which does not directly adjoin the space (14) in which, at least at times, high temperature and/or high pressure prevails. The two machine parts are built in before the curing of composition (30). A sealing ring can be inserted between the two machine parts (10, 11) directly around the edge of the high pressure and high temperature space (14) or that edge can be slightly raised and the curable composition (30) can be used for sealing outside this area.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: A dispensing closure assembly provides for the dispensing of fluid from a fluid container. The dispensing closure assembly includes a cap and a dispensing cover which is movably supported with respect to the cap. The dispensing cover includes a distal tip through which the fluid is dispensed. The cover further includes an outer surface extending from the distal tip and continuous therewith defining a fluid drainage surface where residual fluid drains. A finger contacting surface is provided on the cover and space from the fluid draining surface. A fluid containment well is defined between the fluid drainage surface and the finger contacting surface for retaining fluid drained therealong preventing fluid contact along the finger contacting surface.

Abstract: In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.

Abstract: The invention provides a device and method for dispensing fluid materials from a product reservoir onto a substrate. The device includes at least one dispensing nozzle having at least one inner conduit leading to an exit port and adaptable to be in fluid communication with a supply source for the fluid dispensable material. The nozzle further comprises an end portion defining the exit port such that a ribbon of fluid dispensable material can be applied to the substrate. The nozzle is mountable on means that effect substantially perpendicular free movement of the nozzle relative to the substrate, such that the end portion of the nozzle maintains contact with the fluid material applied to the substrate. During dispensing, movement towards the substrate is effected by an applied force and movement away from the substrate is effected by a thrust exerted by the dispensed fluid material against said end portion of the nozzle and the dispensable material in the exit port.

Abstract: An aerosol solvent and co-solvent system provides for a more miscible fluorinated oil composition so that typical oil additives such as anti-wear, extreme pressure, lubricity additives, corrosion inhibitors, and oxidation inhibitors may be combined with perfluorinated and highly fluorinated oils.

Abstract: Heat sink and electrically non-conducting thermal interface having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The base plate is attachable to a heat-dissipating component, and may optionally include a ground contact connection for use with components that are not already grounded.

Abstract: Multi-component compositions comprising as a first component a fluorinated compound, as a second component a fluorinated aromatic compound and a third component comprising an alkane are disclosed. These compositions can be formulated to provide single phase systems which serve as effective solvents for fluorinated oils as well as petroleum oils. The compositions can serve as solvent cleaners or can be combined directly with oils to provide a delivery system for the oil.

Abstract: This invention relates to cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, the combination of two accelerators to improve fixture speeds on certain substrates.

Abstract: Compositions and methods for inhibiting corrosion of metallic surfaces are disclosed. The corrosion-inhibiting compositions are cost efficient, easy to use and can be conveniently removed or replaced. The corrosion-inhibiting compositions include a putty-like base material that is pliable and has sufficient tackiness to be securely affixed to surfaces. Corrosion inhibiting compounds are combined with the base material. These compositions provide a vapor phase corrosion inhibitor for both direct and indirect contact with metallic objects.

Abstract: The present invention provides UV/anaerobic dual cure adhesives, particularly well-suited for sealing the ring around the primer cup in center fire ammunition by UV cure and the primer cup in the cartridge by anaerobic cure.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.