Abstract: A circuit and method are shown for a continuously adjustable delay circuit. The present invention utilizes two signal delay paths controlled by a tuning signal wherein each delay path receives a reference signal. The first delay path delays the reference signal in response to the tuning signal in a manner that is complementary to the manner in which the second delay path delays the reference signal in response to the tuning signal. By selecting one of the signal output by the first delay path and the signal output by the second delay path and switching between the two signals at a point when the two signals are separated by a period of the reference signal, a delay of the reference signal can be continuously adjusted.

Abstract: A semiconductor device package is presented having signal traces interposed between power and ground conductors in order to form stripline transmission lines. The semiconductor device package includes a substrate having a die area defined upon an upper surface. The die area is dimensioned to receive the integrated circuit. A first planar conductive layer formed upon the upper surface includes a first set of bonding pads and a set of conductive traces. Members of the first set of bonding pads are arranged upon the upper surface proximate the die area, and are used to make electrical connections to the integrated circuit. Members of the set of conductive traces are connected between one of two polarities of a power supply and corresponding members of the first set of bonding pads, and function as reference planes for underlying signal traces. A second planar conductive layer is positioned between the first planar conductive layer and an underside surface of the substrate.

Abstract: An electronic system such as a Board-Level-Product (BLP) includes at least one integrated circuit device which is mounted on a circuit board. Each integrated circuit device includes a thin dielectric substrate bearing a plurality of conductive leads and has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on the circuit board.

Abstract: Digital filtration is accomplished by splitting the incoming signal into phases. Each phase is then converted into a weighted sum reflecting the design of a prototype filter. Then the data is again split into phases at which time specific points may be interpolated and the data accumulated until a filtered signal has resulted. All of the steps can be easily modified after manufacture so that the filtration can handle variable bandwidth systems at low data rates, as well as implement a wide variety of filtering structures.

Abstract: An encoded multimedia terminal having a low cost decompression circuit together with a low cost interconnect circuit coupled to a powerful server. The terminal can accept user input via a mouse, keyboard, remote control, or handset. In one embodiment, the server has ports which provide real-time audio and video encoding of source material based on user edits and the original source. An encoded bitstream is then sent to the encoded multimedia terminal for decoding. Broadly speaking, the present invention contemplates an encoded multimedia terminal comprising a microcontroller, a network interface, a multimedia bitstream decoder, and a display controller. The microcontroller receives input from a user-input device and responsively determines a user input signal. The network interface is coupled to the microcontroller to receive the user input signal and is configured to communicate the user input signal to a multitasking server which is executing a software application.

Abstract: An apparatus is provided for conditioning a polishing pad used for chemical-mechanical polishing. The apparatus comprises the retainer ring used to retain the semiconductor wafer against the polishing pad. Accordingly, the retainer ring serves a dual purpose: to retain the wafer in proper CMP position as well as condition the polishing surface while polishing of the wafer. The retainer ring includes an inner surface defining an opening to receive the semiconductor wafer. Dimensioned radially outside the inner surface is an outer surface. Placed on the distal ends between the inner and outer surfaces is an abrasive surface. The abrasive surface extends along a plane parallel to the retained frontside surface of the wafer. Both the wafer and the abrasive surface contact the polishing surface either in a rotation about a stationary axis or orbital movement about that axis.

Abstract: An MPEG decoder system and method for decoding frames of a video sequence. The MPEG decoder includes motion compensation logic which analyzes motion vectors in an encoded frame of the MPEG stream and uses prior decoded reference blocks to recreate the data encoded by the motion vector. The MPEG decoder stores reference block data according to a novel skewed tile arrangement to minimize the maximum number of page crossings required in retrieving this data from the memory.

Abstract: A modified chemical-mechanical polishing apparatus is described. The apparatus includes: (i) a polishing pad for providing a surface against which a surface of an integrated circuit substrate is polished during polishing; (ii) an anode on which the polishing pad is secured, the anode including an electrolyzable conductive material; and (iii) a voltage source including a first electrical connection and a second electrical connection, the first electrical connection being connected to the anode and the second electrical connection being configured for connection to the integrated circuit substrate undergoing polishing such that when a voltage is applied from the voltage source in the presence of slurry admixed with an electrolyte composition on the polishing pad, an electrolytic cell results in which the conductive material deposits on the surface of the integrated circuit substrate.

Abstract: A serial network interface unit which uses indirect addressing to access an exchange table. In one embodiment, the serial network interface unit comprises a serial communications transceiver, a transmit controller, a receive controller, and a register file for storing an exchange table and an index table. The exchange table has slots for storing information about data exchanges, and the index table has an entry for each ongoing exchange to indicate which of the slots is storing information about the exchange. The transmit and receive controllers are coupled to the register file to reference the index table to determine an exchange table slot corresponding to a current exchange and to thereafter update information in the current exchange table slot. A processor may be coupled to the register file via an i/o bus to store inactive (but ongoing) data exchange information to system memory and to replace the inactive data exchange information with information for active data exchanges.

Abstract: A microelectronic integrated circuit includes a semiconductor substrate, and a plurality of CMOS microelectronic devices formed on the substrate. Each device includes a hexagonal ANY element of a first conductivity type (PMOS or NMOS), and a hexagonal ALL element of a second conductivity type (NMOS or PMOS), the ANY and ALL elements each having a plurality of inputs and an output that are electrically interconnected respectively. The ANY element is basically an OR element, and the ALL element is basically an AND element. However, the power supply connections and the selection of conductivity type (NMOS or PMOS) for the ANY and ALL elements can be varied to provide the device as having a desired NAND, AND, NOR or OR configuration, in which the ANY element acts as a pull-up and the ALL element acts as a pull-down, or vice-versa.

Abstract: A method and apparatus for equalizing the frequency response of a transmission line is provided. The method includes the steps of modelling the frequency response of the transmission media for a predetermined frequency range to a predetermined accuracy; determining a desired equalizer response by taking an inverse of the modelled frequency response of the first step; implementing an equalizer that exhibits the desired response; and utilizing the equalizer to equalize the frequency response of the transmission line. The apparatus includes an adaptive equalizer circuit which includes a plurality of signal processor circuits which each take an input signal from the transmission line and process it to mimic a term in a transfer function which represents an inverse of the transfer function of the transmission line. The signals from these processors are then summed and multiplied by a programmable gain term. Then the input is added to the output of the multiplier to form an output equalizer signal.

Abstract: A tri-state input-output (I/O) buffer which includes a core terminal, a pad terminal and an enable terminal. A pad pull-down transistor and pad pull-up transistor are coupled to the pad terminal and have pull-up and pull-down control terminals, respectively. A pull-down control circuit is coupled between the core terminal and the pull-down control terminal. A pull-up control circuit is coupled between the core terminal and the pull-up control terminal. A feedback circuit is coupled between the pad terminal and the pull-up control terminal for sensing a first voltage on the pad terminal and adjusting a second voltage on the pull-up control terminal based on the sensed first voltage to reduce leakage current through the pull-up transistor when an enable signal received on the enable terminal is an inactive state.

Abstract: A clock delay circuit which creates control signals relative to a clock signal which vary in relation to inherent variables arising from manufacturing process, temperature and voltage influences on a memory array. The clock delay circuit preferably comprises a pair of spare word lines and a pair of spare bit lines of the memory, each of which extends across the memory array. Signals conducted along the spare word and bit line create a signal which is supplied to a counter and decoder to supply a plurality of control signals having a timing relationship established relative to the clock. The spare word line and spare bit line comprise electrical characteristics affecting signal propagation time similar to a signal propagation time along one of an actual word line or actual bit line, respectively.

Abstract: A wireless communication device may take the form of a cellular telephone, of a portable personal communication device, or even of a desk top personal computer which is equipped to communicate over the wireless cellular communication system in effect in a particular area. The wireless communication device is configured to self-adapt to various operating frequencies and communication protocols which may be present in the cellular communication environment so that the device is able to provide communications in several service areas even though the frequencies of operation and the communication protocols in use in the service areas may be incompatible with one another. The wireless communication device may also include facilities for transmitting and receiving video, graphics, and data files over an RF bandwidth.

Abstract: Provided is a multi-piece integrated heat spreader/stiffener assembly which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the integrated heat spreader/stiffener. In a preferred embodiment, the integrated heat spreader/stiffener assembly has two pieces, both composed of a high modulus, high thermal conductivity material shaped to attach to each other and a die on the surface of a packaging substrate. A first piece of this assembly is bonded to the substrate surface adjacent to an electrically connected die and to the top surface of the die prior to the dispensation and curing of underfill material which provides the mechanical connection between the die and the substrate. With the first piece of the assembly in place, access may still be had to at least one edge of the die to dispense and cure the underfill epoxy.

Abstract: In this invention is described a circuit and method for auto programming of a flash memory cell of an EEPROM. A step split gate is used that has low voltage and low current program conditions. This allows a load device to be connected to each bit line, and sets up a voltage divider between the cell being programmed and the load device. The load device limits the programming current and provides programming data to the cell being programmed. The load device is shut off when the bit line voltage is reduced below a predetermined reference, ending programming of the flash memory cell. The source to drain voltage increases as the memory cell is programmed as a result of the voltage divider between the load device and the cell being programmed thus maintaining pinch off. This produces more energy to program the flash cell and with proper design allows the programming efficiency to be relatively constant over the time that elections are injected onto the floating gate of the flash memory cell.

Abstract: A method and apparatus for processing interrupts for a plurality of components connected to and sharing an interrupt line in a data processing system in which interrupts are level sensitive interrupts. The components are connected to the interrupt line by interrupt connections, such as a pin. An interrupt is detected when the interrupt line is in a first state, while an interrupt is absent when the interrupt line is in a second state. Other interrupts cannot be processed while the interrupt line is in a first state. In response to detecting one or more interrupts, the connection associated with the component, for which one or more interrupts are generated, is disabled until all of the interrupts are processed. Disabling the interrupt connection allows the interrupt line to return to the first state and for additional interrupts for other components connected to the interrupt line to be detected and processed.

Abstract: A semiconductor package (110) includes a tape substrate (135) having a top surface, a bottom surface, a plurality of conductive metal traces (115) formed on the top surface and a plurality of holes (130) arraigned in an array pattern formed through the tape substrate (135) exposing the conductive traces (115) from the bottom surface. A nonconductive metal plate or stiffener frame (155) attached to the bottom surface of the tape substrate (135) to support the tape substrate (135) during assembly. The stiffener frame (155) having through holes (160) corresponding to the holes (130) in the tape substrate (135) and being made from anodized aluminum, thus making it electrically nonconductive. An integrated circuit (IC) chip (120) is mounted on the top surface, opposite the stiffener frame (155).

Abstract: The present invention provides for ESD protection while allowing the use of an input signal that is higher than V.sub.DD. The present invention preferably includes a protection device and a delay circuit coupled to an input pad and to a ground reference. The protection device is a preferred silicon controlled rectifier, and the delay circuit is preferably a low pass filter RC circuit that includes a resistor and a capacitor. A node associated with the delay circuit is coupled to circuitry of an integrated circuit. The circuitry has associated therewith at least one gate oxide breakdown voltage. A gate oxide breakdown voltage is prevented from being applied to the circuitry of the integrated circuit. When an ESD voltage is applied to the input pad, the voltage at that pad ramps or increases quickly. The delay circuit prevents the node from ramping as quickly by delaying the ramping or increasing of the node voltage. This delay provides time for the protection device to turn on and sink the ESD current.

Abstract: A method and apparatus for equalizing the frequency response of a transmission line is provided. The method includes the steps of modelling the frequency response of the transmission media for a predetermined frequency range to a predetermined accuracy; determining a desired equalizer response by taking an inverse of the modelled frequency response of the first step; implementing an equalizer that exhibits the desired response; and utilizing the equalizer to equalize the frequency response of the transmission line. The apparatus includes an adaptive equalizer circuit which includes a plurality of signal processor circuits which each take an input signal from the transmission line and process it to mimic a term in a transfer function which represents an inverse of the transfer function of the transmission line. The signals from these processors are then summed and multiplied by a programmable gain term. Then the input is added to the output of the multiplier to form an output equalizer signal.