Abstract: A pixel circuit may include a first light-emitting element; a second light-emitting element; a driving element configured to drive the first and second light-emitting elements; a first switch element connected between the driving element and the first light-emitting element; a second switch element connected between the driving element and the second light-emitting element; and a compensation circuit including: a capacitor connected to a gate electrode of the driving element; a third switch element configured to apply a reference voltage to one electrode of the capacitor; a fourth switch element connected between the first light-emitting element and an initialization voltage line to which an initialization voltage is applied; and a fifth switch element connected to the second light-emitting element and the initialization voltage line. A display device is also disclosed.

Abstract: Disclosed are a gate driving circuit and a display device including the same. The gate driving circuit includes a first controller configured to control the voltage of a set node, a second controller configured to control the voltage of a reset node, a first output transistor connected to the set node, and a second output transistor connected to the reset node.

Abstract: A display device includes a display panel, a gate driving circuit having a plurality of stages, and a power supply for sequentially applying first to third discharge signals in a power off mode, wherein an n-th stage includes a pull-up transistor that outputs a high-voltage gate signal in a driving mode, a pull-down transistor that outputs a low-voltage gate signal in the driving mode and discharges a gate signal output node in response to the second discharge signal in the power off mode, a Q node discharge transistor that charges and discharges the Q node and the QB node in the driving mode and discharges the Q node in response to the second discharge signal in the power off mode, and a QB node discharge transistor that discharges the QB node in response to the third discharge signal in the power off mode.

Abstract: A display apparatus includes display elements disposed in a display area, a first bottom metal layer disposed on a substrate, a second bottom metal layer disposed on the first bottom metal layer, and a thin-film transistor disposed on the second bottom metal layer, the thin film transistor including a semiconductor layer and a gate electrode, the semiconductor layer including a channel region, and the gate electrode overlapping the semiconductor layer, the channel region includes a first region and a second region, the first region overlapping one of the first bottom metal layer and the second bottom metal layer in a plan view, and the second region overlapping the other of the first bottom metal layer and the second bottom metal layer in the plan view.

Abstract: A display apparatus including a display including sub-pixel circuits, data lines, a data driving circuit that outputs data signals through output lines, a data distributor selectively connecting each of the output lines to one of a corresponding pair of data lines among the data lines according to a first control signal and a second control signal, and a control circuit that alternately outputs the first control signal and the second control signal, wherein the data lines include a first data line and a second data line that receive data signals according to different ones of the first and second control signals, and a third data line and a fourth data line that receive data signals according to a same one of the first and the second control signals

Abstract: Embodiments of the present disclosure disclose a method and apparatus for controlling in-vehicle noise, medium and a device, where the method includes: determining an out-of-vehicle first noise reference signal; the first noise reference signal including a first noise signal acquired by an out-of-vehicle sound sensor; determining, based on the first noise reference signal, a first excitation signal corresponding to an in-vehicle sound player; and controlling, based on the first excitation signal, the in-vehicle sound player to play a noise control sound signal, such that a signal of the noise control sound signal transmitted to the target location in the vehicle at least partially counteracts the noise signal transmitted to the target location from the out-of-vehicle noise.

Abstract: A mobility management method performed by a terminal device includes: receiving first configuration information, the first configuration information comprising a beam identifier; determining, according to the beam identifier, a beam to be measured; measuring said beam to obtain a beam measurement result; and triggering measurement reporting or handover according to the beam measurement result and a result threshold value.

Abstract: The disclosure aims to provide a fluororesin for use in electrochemical device binders which enables formation of an electrode mixture sheet with high strength, and an electrochemical device binder, an electrode mixture, an electrode, and a secondary battery. Provided is a fluororesin for use in electrochemical device binders, the fluororesin including a tetrafluoroethylene unit and a chlorotrifluoroethylene unit.

Abstract: A cooling system for a fuel cell onboard a vehicle includes a coolant circuit and a thermal energy storage device in fluid communication with the coolant circuit. The coolant circuit defines a coolant passageway and is configured to circulate a coolant through the coolant passageway and through a portion of the fuel cell to absorb heat from the fuel cell. The thermal energy storage device includes a phase change material configured to store thermal energy released from the coolant flowing through the coolant circuit and through the thermal energy storage device in the form of latent heat. The phase change material is configured to dissipate thermal energy stored therein to a circumambient airflow flowing relative to the vehicle when the vehicle is moving.

Abstract: A semiconductor device includes a FEOL structure and a transistor. The transistor is disposed on the FEOL structure and includes a back gate, an active channel layer, an electrode, a dielectric layer and a first blocking layer. The back gate is disposed on the FEOL structure. The active channel layer is disposed on the back gate. The electrode electrically is connected to the active channel layer. The dielectric layer is disposed over the active channel layer. The first blocking layer is disposed on the dielectric layer and overlaps the active channel layer.

Abstract: A method for manufacturing a semiconductor structure includes: forming stacks on a substrate; forming gate structures on the stacks, portions of the stacks are exposed from the gate structures; forming trenches respectively in the portions of the stacks and respectively extending into upper portions of the substrate, after forming the trenches, each of the stacks being formed into stack portions each including first nanosheets, and second nanosheets that alternate with the first nanosheets; forming base epitaxy layers respectively at bottoms of the trenches; performing an ion implantation process to obtain doped base epitaxy layers, each of which is embedded with a blocking feature; and forming source/drain portions respectively in the trenches on the doped base epitaxy layers such that each of the source/drain portions is isolated from the substrate through the blocking feature in a respective one of the doped base epitaxy layers.

Abstract: A fin including a bottom portion, a first sacrificial layer disposed over the bottom portion, a first semiconductor layer disposed over the first sacrificial layer, a second sacrificial layer disposed over the first semiconductor layer and a second semiconductor layer disposed over the second sacrificial layer, is formed. The second semiconductor layer protrudes from a first insulating layer. A dummy gate is formed over the second semiconductor layer. A sidewall spacer layer is formed on side faces of the dummy gate. A first dielectric layer is formed over the dummy gate and the sidewall spacer layer. The dummy gate is removed, thereby forming a gate space. The first insulating layer is etched in the gate space, thereby exposing the first semiconductor layer and the first and second sacrificial layers. The first and second sacrificial layers are removed. A gate dielectric layer and a gate electrode layer are formed.

Abstract: Provided is a protection diode for protecting a transistor from a transient voltage, the protection diode including a substrate, a lower insulation film on the substrate, an oxide semiconductor layer on the lower insulation film, a first electrode and a second electrode arranged on the oxide semiconductor layer to be horizontally spaced apart from each other and providing a Schottky contact, and an interlayer insulation film surrounding the first electrode and the second electrode on the oxide semiconductor layer, wherein the first electrode is electrically connected to a gate electrode of the transistor, and the second electrode is connected to a ground level or a certain DC level.

Abstract: A circuit for protecting a micro inverter and a circuit system having micro inverter topology. The circuit includes a current sampling module, a hardware adjusting module, and a shutdown module that are sequentially connected. The current sampling module is configured to collect a first current signal in a bridge arm, in which a switch transistor is located, in secondary-side bridge arm circuitry including switch transistors. The hardware adjusting module is configured to receive the first current signal and a reference current signal and output an overcurrent indicating signal for the first current signal. The shutdown module is configured to receive the overcurrent indicating signal and a grid-polarity signal and output a shutdown control signal for the switch transistors, to enable secondary-side driving circuitry to shut down the switch transistors in the secondary-side bridge arm circuitry.

Abstract: A system may include a multi-level power converter comprising a plurality of switches, a power inductor electrically coupled to the plurality of switches, and a flying capacitor coupled to the plurality of switches, wherein the plurality of switches are controllable among a plurality of switch configurations in order to generate an output voltage from an input voltage received by the multi-level power converter. The system may also include a flying capacitor voltage control loop configured to, based on an error signal between a measurement of a flying capacitor voltage across terminals of the flying capacitor and a flying capacitor reference voltage, generate switch control signals for switching among the plurality of switch configurations in order to regulate the flying capacitor voltage and a compensator configured to apply compensation to the flying capacitor voltage control loop based on a measurement of an inductor current flowing through the power inductor.

Abstract: An inductor includes a body containing soft magnetic powder and resin, a coil embedded in the body, outer electrodes on the body, and a protective film on the surface of the body. The protective film has a thickness of 10 ?m or more and contains silica particles and resin. In the protective film, the silica particles have an average diameter of 15 nm to 75 nm, and the percentage by weight of the silica particles to the resin is between 150% and 250%.

Abstract: A magnetic component includes a first housing, a second housing, a magnetic core assembly, a pin and a high-current carrier. The first housing is in a hollow structure and is provided with a first pin socket and a second pin socket. The second housing is snap-fitted with the first housing to form an installation space, and is provided with a first socket and a second socket. The magnetic core assembly is arranged in the installation space, the pin is connected with a leading wire of the magnetic core assembly, and the pin is arranged in the first pin socket or the second pin socket. The high-current carrier passes through the second housing, and includes a connection section for connecting to a circuit board, and the high-current carrier is arranged in the first socket or the second socket.

Abstract: A target image display method and display apparatus, an electronic device, and a storage medium. The target image display method includes: receiving an emoji image corresponding to a target image; performing, according to a preset encoding rule, encoding conversion on the emoji image to generate a code corresponding to the emoji image; acquiring a dot matrix font corresponding to the code; and displaying the dot matrix font, where the dot matrix font forms the emoji image; where the dot matrix font is obtained by performing data conversion on the emoji image in advance.

Abstract: A wearable device includes: a display; a sensor, memory storing instructions, and at least one processor comprising processing circuitry, wherein the instructions, when executed by the at least one processor individually or collectively, cause the wearable device to: identify, in a displaying area of the display, areas in which each of a plurality of screens is displayed; identify, based on a direction of a body part of a user wearing the wearable device, a first area among the areas corresponding to the direction, wherein the direction of the body part of the user is identified by data of the sensor; display, based on the identified first area, a first screen corresponding to the first area in a first preset state, and display at least one second screen that is different from the first screen in a second preset state that is different from the first preset state.

Abstract: A cooling plate assembly, an assembly method applied to the cooling plate assembly, a battery module and a battery pack are provided. The cooling plate assembly includes a cooling plate configured to control a temperature of the battery module; and at least one current collector connected to an end portion of the cooling plate through bonding. The cooling plate assembly is conducive to improving the connection stability between the cooling plate and the current collector and the assembly efficiency.