Patents Assigned to LTD.
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Publication number: 20250253460Abstract: Holders configured to detachably connect to battery cells may include a first polarity bus-bar portion configured to removably contact a first polarity terminal of a battery cell when the battery cell is positioned in an assembled location. The battery cell may have at least a portion of a casing encircling an axis of the battery cell, the portion of the casing defining the first polarity terminal. The first polarity bus-bar portion may include a first displaceable portion biased towards the assembled location of the battery cell such that the first displaceable portion is pressed into contact with the portion of the casing defining the first polarity terminal when the battery cell is in the assembled location. The holder may include a second polarity bus-bar portion configured to removably contact a second polarity terminal of the battery cell when the battery cell is positioned in the assembled location.Type: ApplicationFiled: December 18, 2024Publication date: August 7, 2025Applicant: LG Energy Solution, Ltd.Inventor: Dong Won Yoo
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Publication number: 20250253473Abstract: A battery structure includes an upper sheet member, a lower sheet member, a plurality of battery cells, a plurality of fixing members, an upper accommodating plate and a lower accommodating plate. The battery cells have a plurality of conductive portions. The conductive portions are located between the upper sheet member and the lower sheet member. The fixing members are configured to fix the upper sheet member and the lower sheet member. The upper accommodating plate has an upper accommodating recess. The upper accommodating recess is configured to accommodate the upper sheet member and a part of the conductive portions. The lower accommodating plate has a lower accommodating recess. The lower accommodating recess is configured to accommodate the lower sheet member and another part of the conductive portions.Type: ApplicationFiled: January 8, 2025Publication date: August 7, 2025Applicant: PROLOGIUM TECHNOLOGY CO., LTD.Inventors: Cheng-Chih Lee, Meng-Hung Wu
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Publication number: 20250253477Abstract: Disclosed are a battery pack and a vehicle including the same. A battery pack according to an embodiment of the present disclosure includes a battery assembly including a plurality of cell units; and a pack case accommodating the battery assembly in the internal space, wherein each cell unit includes at least one battery cell and a cell cover at least partially surrounding the outside of the at least one battery cell, wherein a venting space is provided between the cell cover and the battery cell.Type: ApplicationFiled: July 11, 2023Publication date: August 7, 2025Applicant: LG Energy Solution, Ltd.Inventors: Jin Yong Park, Woo-Yong Kwon, Myung-Woo Lee, Seung-Joon Kim, In-Soo Kim, Se-Yun Chung, Ho-June Chi, Hyun-Mo Yoon
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Publication number: 20250253495Abstract: A battery pack according to an aspect of the present disclosure may include a plurality of battery cells arranged in an array along a plane, the array including a row of battery cells along an axis. The battery pack may include an electrical connection extending along a surface of the array along the plane connected to electrodes of the plurality of battery cells. The battery pack may include a side frame extending alongside the row of battery cells. The side frame may have a metal member embedded within it. The metal member may be electrically connected to the electrical connection.Type: ApplicationFiled: February 6, 2025Publication date: August 7, 2025Applicant: LG Energy Solution, Ltd.Inventors: In-Hyuk Jung, Jun-Young Ahn, Yong-Ho Lee, Jin-Oh Yang
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Publication number: 20250253269Abstract: A memory module may include a module substrate including first substrate pads and an insertion portion that has a module power terminal on a first substrate side portion of the module substrate; at least one semiconductor device on the module substrate and including chip pads electrically connected to the first substrate pads; substrate wirings including a first power connection wiring that electrically connects the module power terminal and the at least one semiconductor device; test wirings including a power test wiring that is branched from the first power connection wiring and has an end portion exposed from a second substrate side portion, the second substrate side portion adjacent the first substrate side portion; and a short protection structure on the module substrate, the short protection structure being adjacent the second substrate side portion, in the power test wiring, and configured to selectively block electrical flow through the power test wiring.Type: ApplicationFiled: January 28, 2025Publication date: August 7, 2025Applicant: Samsung Electronics Co., Ltd.Inventors: Doyoung JUNG, Jinkyu YANG, Jaechan LEE
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Publication number: 20250253273Abstract: A structure includes a controlled polyimide profile. A method for forming such a structure includes depositing, on a substrate, a photoresist containing polyimide and performing a first anneal at a first temperature. The method further includes exposing the photoresist to a radiation source through a photomask having a pattern associated with a shape of a polyimide opening. The method further includes performing a second anneal at a second temperature and removing a portion of the photoresist to form the polyimide opening. The method further includes performing a third anneal at a third temperature and cleaning the polyimide opening by ashing.Type: ApplicationFiled: March 28, 2025Publication date: August 7, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Chi Huang, Chang-Yao Huang, Po-Cheng Chen
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Publication number: 20250253277Abstract: A semiconductor device includes a substrate, a routing structure, a device layer and a bonding layer. The routing structure is disposed over the substrate, and includes a plurality of dielectric layer and a plurality of conductive features. The device layer is disposed over the routing structure. The bonding layer is disposed between the substrate and the routing structure, wherein the bonding layer includes a plurality of microchannels.Type: ApplicationFiled: February 4, 2024Publication date: August 7, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Kun Lo, Wei-Yen Woon
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Publication number: 20250253285Abstract: A semiconductor package may include a semiconductor die stack in a stepped pattern, an encapsulation layer sealing the semiconductor die stack and including a first surface coplanar with a bottommost surface of the semiconductor die stack and a second surface opposite the first surface, the second surface having a groove, a printed circuit board on the second surface of the encapsulation layer and including a conductive pad facing the second surface of the encapsulation layer, a conductive connector filling the groove, and a bonding wire group penetrating the conductive connector in a vertical direction and connecting the semiconductor die stack to the conductive pad of the printed circuit board. A width of the conductive connector in a lateral direction may be greater than or equal to a width of the conductive pad in the lateral direction.Type: ApplicationFiled: October 29, 2024Publication date: August 7, 2025Applicant: Samsung Electronics Co., Ltd.Inventor: Kwangyong LEE
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Publication number: 20250254012Abstract: Embodiments of the present disclosure relates to the field of communications technology, and provide an information processing method, device, and readable storage medium for reducing signaling overhead. The method includes: determining, by a terminal, the location of transmission resources based on a first information; and/or determining, by a terminal, the size of transmission resources based on a second information; wherein the first information includes one of the following: location relationships between transmission resources; information of the terminal; or pre-configured location of starting resource block (RB); the second information includes: size relationships among transmission resources.Type: ApplicationFiled: March 15, 2023Publication date: August 7, 2025Applicant: DATANG MOBILE COMMUNICATIONS EQUIPMENT CO., LTD.Inventors: Yue ZHAO, Xuejuan GAO, Qianqian SI
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Publication number: 20250254081Abstract: First and second communication devices employ reference signals for channel estimation in a communication system. The reference signals are based on modulation sequences from a set of QA modulation sequences of length L?1. The set of QA modulation sequences includes Q subsets of modulation sequences, Q?1, where each subset of modulation sequences comprises A modulation sequences, A?1. A correlation between any two reference signals based on any two modulation sequences in a same subset of modulation sequences satisfies a first correlation criterion, and a correlation between any two reference signals based on any two modulation sequences in respective any two different subsets of modulation sequences satisfies a second correlation criterion.Type: ApplicationFiled: January 17, 2025Publication date: August 7, 2025Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Peng Wang, Branislav M. Popovic, Fredrik Berggren
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Publication number: 20250254096Abstract: A method of performing communication by a virtual node includes receiving a registration request from at least one node of a plurality of nodes, performing registration of the at least one node, based on information related to the at least one node, receiving, from a control plane, a pod indicating at least one distributable computing unit of a task to be completed, identifying a first node from among the at least one node to which the pod is to be transmitted, based on the information related to the at least one node, and transmitting the pod to the first node. The plurality of nodes and the virtual node are controlled by the control plane.Type: ApplicationFiled: April 22, 2025Publication date: August 7, 2025Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Jonggyu HAM
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Publication number: 20250251049Abstract: A valve cap includes a cap housing, where a self-sealing inflation valve is provided in a chamber of the cap housing; the self-sealing inflation valve includes a valve core rod, a reset spring, a valve core sealing gasket, and a valve core base; the valve core base is mounted in a middle-lower part of the chamber; the valve core rod is movably provided in the chamber, and a lower end of the valve core rod penetrates into an inflation channel of the valve core base; a circular sealing protrusion is provided in the inflation channel; the valve core sealing gasket is sleeved on the valve core rod; the valve core sealing gasket is in a seal fit with the sealing protrusion; the reset spring is sleeved on the valve core rod; the lower end of the valve core rod is riveted to a valve core rivet joint.Type: ApplicationFiled: September 5, 2024Publication date: August 7, 2025Applicant: NINGBO SIMING AUTOMOTIVE Co.,Ltd.Inventors: Lihong WANG, ERMALD MUCA, Xinfeng WANG
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Publication number: 20250251071Abstract: The application provides a female-end valve stem of a fluid connector, a female-end structure of a fluid connector, a fluid connector including a male-end structure, and a male-end piston of a fluid connector. The female-end valve stem of the fluid connector includes a female-end rear stem part and a female-end front column part arranged at a front end of the female-end rear stem part. wherein a flattered part is provided at a rear end of the female-end rear stem part and configured to guide a flow forward.Type: ApplicationFiled: November 29, 2022Publication date: August 7, 2025Applicant: SHENZHEN ENVICOOL SMART CONNECTION TECHNOLOGY CO., LTD.Inventor: Gang CHEN
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Publication number: 20250254665Abstract: Provided is a method of operating an electronic device, the method including receiving data blank information from a serving cell, identifying at least one first subframe and at least one second subframe based on a timing offset and the data blank information, resource allocations between the serving cell and an interference cell overlapping in the at least one first subframe, and the resource allocations not overlapping in the at least one second subframe, increasing a first weight for a first log likelihood ratio (LLR) corresponding to the at least one first subframe, decreasing a second weight for a second LLR corresponding to the at least one second subframe, and calculating a third LLR based on the first LLR and the second LLR.Type: ApplicationFiled: January 16, 2025Publication date: August 7, 2025Applicant: Samsung Electronics Co., Ltd.Inventors: Jinwoo OH, Jinho KIM, Jungmin PARK
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Publication number: 20250254708Abstract: A method and apparatus, and a storage medium for transmission synchronization in a wireless communication system. The transmission synchronization is performed by: sending synchronization control information to at least one first network-side node, wherein the synchronization control information is configured to control the at least one first network-side node to perform multicast broadcast service (MBS) control channel (MCCH) transmission synchronization.Type: ApplicationFiled: April 12, 2022Publication date: August 7, 2025Applicant: Beijing Xiaomi Mobile Software Co., Ltd.Inventors: Xiaofei LIU, Yumin WU
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Publication number: 20250255042Abstract: A display device includes a pixel circuit layer disposed on a substrate; an anode electrode disposed on the pixel circuit layer; a cathode electrode disposed on the pixel circuit layer and spaced apart from the anode electrode; and a first light emitting element and a second light emitting element electrically connected in parallel between the anode electrode and the cathode electrode. The first light emitting element and the second light emitting element may be spaced apart from each other in a second direction and oriented diagonally.Type: ApplicationFiled: September 26, 2024Publication date: August 7, 2025Applicant: Samsung Display Co., LTD.Inventors: Sung Chul HONG, Do Yeong PARK, Ki Hyun PYO
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Publication number: 20250255044Abstract: An LED device includes a light emission layer including a first semiconductor layer including a first surface and a second surface facing the first surface, the second surface having an area larger than an area of the first surface, an active layer on the first surface, and a second semiconductor layer on the active layer, an insulating layer on the first surface, the insulating layer defining an open region of the first semiconductor layer, a first electrode that contacts the first semiconductor layer via the open region, and a second electrode on the second semiconductor layer and contacting the second semiconductor layer.Type: ApplicationFiled: March 27, 2025Publication date: August 7, 2025Applicants: SAMSUNG ELECTRONICS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATIONInventors: Kyungwook HWANG, Ho Won JANG, Junsik HWANG
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Publication number: 20250255051Abstract: Provided is a near-infrared light emitting device including a solid-state light emitting element that emits blue primary light, a wavelength converter that converts the primary light into near-infrared wavelength-converted light, an organic polymer member through which mixed light of the primary light and the wavelength-converted light is transmitted. The organic polymer member has a thickness of 3 ?m or more and less than 300 ?m, a light transmittance of less than 0.1% at a wavelength of 400 nm or less, a light transmittance of less than 1% at or below a wavelength of the emission peak of the primary light, and a light transmittance of less than 30% at a wavelength of 500 nm or less, a light transmittance of 75% or more and less than 100% within a wavelength range of 750 nm or more and less than 1,100 nm.Type: ApplicationFiled: April 6, 2023Publication date: August 7, 2025Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Mitsuru NITTA, Ryosuke SHIGITANI, Shozo OSHIO
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Publication number: 20250255070Abstract: The display device may include a substrate, a first assembling wiring on the substrate, a second assembling wiring on the substrate, an adjustment member under the second assembling wiring, an insulation layer on the first assembling wiring and the second assembling wiring, a partition wall comprising an assembly hole on the first assembling wiring and the second assembling wiring, and a semiconductor light-emitting element in the assembly hole.Type: ApplicationFiled: March 22, 2022Publication date: August 7, 2025Applicants: LG ELECTRONICS INC., LG DISPLAY CO., LTD.Inventors: Kisu KIM, Kiseong JEON
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Publication number: 20250255079Abstract: A display module includes a substrate and a plurality of pixels on the substrate. Each pixel of the plurality of pixels includes a self-luminescence layer, a first color conversion layer and a second color conversion layer on the self-luminescence layer, a first color filter and a second color filter on the first color conversion layer and the second color conversion layer, a third color filter adjacent to the first color filter and the second color filter, and a size of the third color filter is larger than a size of the first color filter and a size of the second color filter; and partition walls between the first color filter and the second color filter and between the second color filter and the third color filter, and blue dye on the partition walls.Type: ApplicationFiled: March 28, 2025Publication date: August 7, 2025Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Heebum ROH, Jihoon KANG, Yeseul PARK, Sanghyun SOHN