Abstract: In one or more examples, a sound apparatus includes a sound generating module, an enclosure including an internal space and configured at a periphery of the sound generating module, and a connection member connected to a portion of a rear surface of the enclosure. One or more examples of a vehicular apparatus having the sound apparatus are also disclosed.

Abstract: In one or more examples, a sound apparatus includes an enclosure including an internal space, a sound generating module in the internal space of the enclosure, and a coupling member partially provided between the enclosure and the sound generating module. One or more examples of a vehicular apparatus having the sound apparatus are also disclosed.

Abstract: The present disclosure discloses an earphone. The earphone may include a wearing assembly and a core module. The core module may be disposed on one end of the wearing assembly. The wearing assembly may be configured to fix the core module on a head of a user. The core module may include a core housing, a core, and a cover plate. An opening may be disposed on one end of the core housing, and the cover plate may be covered on the opening of the core housing, so as to form a chamber structure inside the core housing for accommodating the core.

Abstract: A semiconductor device includes a first integrated circuit, a bridge die, and a redistribution layer (RDL) structure. The first integrated circuit includes a first interconnect structure, a first passivation layer and a first conductive connector electrically connected to the first interconnect structure and disposed on the first passivation layer. The bridge die bridge die includes a second interconnect structure, a second passivation layer and a second conductive connector electrically connected to the second interconnect structure. The RDL structure is disposed between and electrically connected to the first integrated circuit and the bridge die, wherein the first passivation layer is in direct contact with the first conductive connector, the first conductive connector is in direct contact with the RDL structure, and the first passivation layer is a single layer and includes a first inorganic material.

Abstract: A semiconductor package includes: a first semiconductor chip; a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip and each including a plurality of connection terminals arranged side-by-side in a horizontal direction of the semiconductor package; a center encapsulation layer between the plurality of second semiconductor chips and surrounding at least some of the plurality of connection terminals; and a package encapsulation layer on a top surface of the first semiconductor chip and surrounding the plurality of second semiconductor chips, wherein the center encapsulation layer does not contact an outermost connection terminal from among the plurality of connection terminals.

Abstract: This application provides a positioning method and an apparatus. The method includes: A first communication apparatus obtains first information, where the first information includes time difference information and location information for sending and receiving reference signals by the first communication apparatus; the first communication apparatus receives second information from a second communication apparatus and third information from a third communication apparatus, where the second information includes time difference information and location information for sending and receiving reference signals by the second communication apparatus, and the third information includes time difference information for sending and receiving reference signals by the third communication apparatus; and the first communication apparatus positions the third communication apparatus based on the first information, the second information, and the third information.

Abstract: A DCS controller configured to control a digitally controllable scatterer, DCS, to simultaneously serve a subset of multiple receivers, where the DCS includes a plurality of scattering elements arranged on a scattering surface. The DCS controller is configured to determine a single-user codeword for each of the multiple receivers, where the single-user codeword defines a set of scattering elements of the scattering surface of the DCS for the respective receiver and a respective phase shift configuration for each scattering element in the set of scattering elements. The DCS controller is configured to determine a required signal gain for each of the multiple receivers and determine a subset of receivers based on the required signal gains. The DCS controller is configured to determine a subset of scattering elements of the scattering surface for each receiver in the subset of receivers and determine a multiple-user codeword based on the subsets.

Abstract: A communication method and apparatus are provided. In the method, when a symbol length remains unchanged, different cyclic shift code lengths and different useful symbol lengths may be configured, for example, a first cyclic shift code length and a second cyclic shift code length that are different, and a first useful symbol length and a second useful symbol length that are different, to flexibly adjust a frame structure.

Abstract: A control method of an electronic device, for handling determined sensory perception changes of a user in an Internet of Things (IoT) environment, includes measuring at least one first sensory parameter of at least one first IoT device in the IoT environment, wherein the at least one first sensory parameter indicates a determined sensory perception change of the user based on the user using the at least one first IoT device over a first period of time; identifying at least one second IoT device in the IoT environment used by the user after the at least one first IoT device, wherein the at least one second IoT device is operating in a first configuration; and controlling the at least one second IoT device to switch from the first configuration to a second configuration based on the at least one first sensory parameter.

Abstract: The present disclosure discloses an ejector including a housing; a handle pivotally connected to the housing around a first pivot axis and having a first pivot position and a second pivot position; and a button pivotally connected to the housing around a second pivot axis and having a locking position and an unlocking position, wherein the handle is locked by the button when the button is in the locking position and the handle is in the first pivot position, wherein the first fixing element prevents the housing from moving in a first direction relative to the object and allows the housing to move in a second direction relative to the object, and the second fixing element prevents the housing from moving in the first direction and the second direction relative to the object. The ejector provided by the present disclosure is simple in structure and convenient to install.

Abstract: An electronic apparatus includes: a chassis; and a fan which is provided in the chassis and has a suction surface with a suction port formed therein, wherein the chassis has a projecting part which is provided in such a manner as to protrude from a bottom surface and extends along a width direction, the projecting part has a vertical wall which extends in a longitudinal direction thereof, the vertical wall has a vent formed therein, and the suction surface is placed, facing an inner space of the projecting part.

Abstract: Embodiments of the invention relate to a two-phase heat sink (100) for cooling an electrical heat source (200). The two-phase heat sink (100) comprises a chamber (110) which is configured to receive a cooling fluid (F). For improved cooling and heat dissipation, the chamber (110) in its inner surface (112?) comprises a wick area (134) for converting the cooling fluid (F) from a liquid phase to a vapor phase. The wick area (134) and an attachment area (132) overlap with each other at least partly. Thereby, improved cooling is provided. Furthermore, embodiments of the invention also relate to a heat sink comprising two or more such two-phase heat sinks.

Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

Abstract: A method includes a number of operations. A semiconductor fin is formed and extends from a substrate. A dummy gate structure is formed across the semiconductor fin. An exposed surface of the gate layer is converted into a surface modification layer over the gate layer. Source/drain regions are formed on the semiconductor fin. The dummy gate structure is removed. A gate structure is formed over the semiconductor fin and extends between the source/drain regions and in the surface modification layer.

Abstract: An image sensor including a pixel group including a plurality of unit pixels, each of the plurality of unit pixels including an infrared pixel including a first photoelectric conversion element (PD); and a non-infrared pixel including a second PD having a smaller light-receiving area than the first PD in a plan view, the non-infrared pixel configured to sense a visible light, a plurality of infrared pixels arranged in a first direction and a second direction perpendicular to the first direction, and the non-infrared pixel disposed diagonally to the infrared pixel in a third direction different from the first and second directions.

Abstract: A display device in one example includes a substrate in which a plurality of sub-pixels is defined, and a plurality of reflective electrodes disposed on the substrate. The display device further includes a plurality of first light emitting diodes (LEDs) disposed on the plurality of reflective electrodes in each of the plurality of sub-pixels, and a second LED disposed on the plurality of reflective electrodes in each of the plurality of sub-pixels and being different from the plurality of first LEDs. In addition, the display device includes a first light scattering layer disposed on the plurality of first LEDs, and a second light scattering layer disposed on the second LED and separated from the first light scattering layer.

Abstract: A display device can include a substrate having a first region and a second region, an TFT disposed on the substrate, a plurality of insulation layers disposed on the TFT, an anode disposed on the plurality of insulation layers at the first region, an organic layer at the first region and at the second region, a cathode on the organic layer of the first region, a bank disposed on the anode and between the first region and the second region, an optical compensation layer on the cathode of the first region and the organic layer of the second region, and an encapsulation layer on the optical compensation layer at the first region and the second region. The cathode is interposed between the optical compensation layer and the organic layer over the first region.

Abstract: A battery pack includes: a battery pack in which a plurality of battery modules are arranged; an upper heat sink covering the upper surface of the battery pack and having a plurality of upper cooling flow passages through which a cooling fluid may flow to cool the battery modules; and a lower heat sink covering the lower surface of the battery pack and having a plurality of lower cooling flow passages through which a cooling fluid may flow to cool the battery modules.

Abstract: A lumen stent (100) includes a tubular stent and an imaging marker; the tubular stent includes a main body stent (11); the imaging marker includes a first marker (211) provided on the main body stent (11); and the shape of the first marker (211) provided on the main body stent (11) is asymmetrical at least along a longitudinal axis. A non-axisymmetric imaging marker is provided on the main body stent (11), and the position and orientation of the lumen stent (100) implanted in the body can be accurately and clearly displayed through the imaging marker, to allow the operator to observe and quickly judge and timely adjust, thereby shortening the operation time of the endovascular treatment and reducing the difficulty of the operation.

Abstract: A controlling system method docking for a mobile patient bed with a medical device. The method may include: obtaining, based on a docking instruction, positioning information of a target; controlling, based on the positioning information of the target, a movement of the mobile patient bed; and in response to determining that the mobile patient bed moves into a docking region of the medical device, controlling the mobile patient bed to dock with the medical device using a first docking structure on the mobile patient bed and a second docking structure on the medical device, wherein the first docking structure and the second docking structure are mechanical connection structures.