Abstract: This application provides an antenna unit and an electronic device. A signal at a C-mode port and a signal at a D-mode port of a same loop antenna in any antenna unit are respectively excited by using two feeds, and the antenna unit is electrically symmetrically disposed, so that the signal at the C-mode port is self-cancelled at the D-mode port, and the signal at the D-mode port is self-cancelled at the C-mode port, to implement signal isolation between the two ports and interference self-cancel, and the signal at the C-mode port and the signal at the D-mode port can be complementary to each other in different radiation directions, to implement two antennas with high isolation and a low envelope correlation coefficient ECC based on the same loop antenna.

Abstract: A crib includes a left support mechanism, a right support mechanism, and a sleeping basket frame provided between the left support mechanism and the right support mechanism. The sleeping basket frame is height-adjustable. A detachable support frame and a detachable storage frame are further provided between the left support mechanism and the right support mechanism. The support frame is located below the sleeping basket frame, and the storage frame is located below the support frame. The crib has a novel structure and clever design. A sleeping basket is height-adjustable, so the height of the sleeping basket can be adjusted according to actual needs. The storage frame is configured to support a storage basket for storing baby items, such as diapers and clothes. Therefore, it is convenient for the parent to get the diaper or clothing from the storage basket to change the baby.

Abstract: A semiconductor device including a semiconductor chip, an insulating circuit board having a circuit pattern formed on an insulating plate, a case including a frame part having an opening that is substantially rectangular in a plan view of the semiconductor device, inner wall surfaces of the frame part at the opening forming a storage part to store the insulating circuit board, and a printed circuit board which has a flat plate shape and which protrudes from one of the inner wall surfaces of the frame part toward the storage part. The semiconductor device further includes a sealing material filled in the storage part, to thereby seal the semiconductor chip and the printed circuit board. A front surface of the sealing material forms a sealing surface, and in a thickness direction of the semiconductor chip, the sealing surface is higher around the printed circuit board than around the semiconductor chip.

Abstract: The present invention provides an image encoding method and an image decoding method. An image decoding method according to the present invention, for decoding an image by decoder-side motion information derivation, comprises the steps of: checking, from among a plurality of motion information derivation types, the motion information derivation type applied to the current block: and deriving motion information of the current block according to the checked motion information derivation type, wherein different motion information compensation techniques are applicable according to the motion information derivation type.

Abstract: An imaging lens includes sequentially a first lens group, a second lens group having a positive refractive power, an aperture stop, a third lens group having a positive refractive power, and a fourth lens group. The first lens group includes, sequentially from the object side to the image side, a positive lens having a convex surface facing the object side, and a negative lens having a concave surface facing the image side. The second lens group includes a negative lens disposed closest to the object side and having a concave surface facing the object side, and a positive lens disposed closer than the negative lens to the image side and having a convex surface facing the object side. The third lens group includes a positive lens having a convex surface facing the image side, and a negative lens. The fourth lens group includes a negative lens having a concave surface.

Abstract: The disclosure relates to a method and apparatus by which a transmission terminal allocates resources in a vehicle-to-everything (V2X) system.

Abstract: A manufacturing method of an antimicrobial and adhesion-proof titanium tableware having a contact portion for contacting foods, food ingredients, drinking water, beverages, or body parts of a user. The manufacturing method includes a preparation step implemented by using a titanium substrate to produce a tableware preform; a preparation step implemented by using a titanium substrate to produce a tableware preform; a surface treatment step implemented by washing a surface of the tableware preform and removing a primary oxidation layer on the surface of the tableware preform; and an oxidation step which includes: placing the tableware preform in a vacuum calcination furnace, heating the tableware preform to reach a temperature ranging from 700° C. to 850° C., and introducing oxygen for allowing one part of the surface of the tableware preform corresponding to the contact portion to be exposed to the oxygen for 3 hours to 12 hours.

Abstract: A method, system, and circuit for providing a bandgap voltage reference are provided. In an example, the method includes producing a first bandgap curve based at least in part on a first circuit, a second circuit, an operational amplifier, and one or more feedback resistors, where the first circuit corresponds to a first voltage that is complementary to absolute temperature (CTAT) and the second circuit corresponds to a second voltage that is proportional to absolute temperature (PTAT). The method also includes providing a temperature independent compensation to the first bandgap curve based at least in part on a bandgap device, a biasing circuit, and a resistor; providing a non-temperature compensation to the first bandgap curve based at least in part on an adjustable divider circuit; and generating a resulting bandgap curve from the first bandgap curve.

Abstract: This disclosure discloses a method for detecting link failure of a sidelink and a terminal. The method includes: transmitting target information through a sidelink, where the target information includes a first reference signal or a data packet; and determining, if a transmission status of the target information meets a preset criterion, that no link failure occurs on the sidelink, and determining, if otherwise, that link failure occurs on the sidelink.

Abstract: A semiconductor device structure includes a source/drain (S/D) feature comprising a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface. The structure also includes a first silicide layer in contact with the first surface of the S/D feature, a second silicide layer opposing the first silicide layer and in contact with the second surface of the S/D feature, a front side S/D contact in contact with the first silicide layer, a back side S/D contact in contact with the second silicide layer, a semiconductor channel layer comprising a sidewall in contact with the sidewall of the source/drain feature, a gate dielectric layer surrounding exposed surfaces of the semiconductor layer, an interlayer dielectric (ILD) disposed adjacent to the gate dielectric layer, and a liner disposed between and in contact with the ILD and the gate dielectric layer.

Abstract: A storage system includes one or more storage nodes each having a non-volatile storage device, a storage controller, and a volatile memory, in which the storage device includes a plurality of base image storage areas including at least a first base image storage area and a second base image storage area as areas for storing entire predetermined information stored in the memory as a base image, and the storage controller starts processing to store a next base image in the second base image storage area when the base image storage with respect to the first base image storage area is complete, and reads out the storage-completed base image and restores the image to the memory in a case where the predetermined information is lost from the memory.

Abstract: A controller that controls a dump truck in such a manner that the dump truck travels on a travelling route and stops at a loading specified position is provided in the dump truck. The controller computes, from travelling route data, a front-rear direction (a first stop direction) of the dump truck in a case in which the dump truck has travelled on the travelling route and stopped at the loading specified position, and corrects the travelling route to compute a post-correction travelling route including the loading specified position as an end point in such a manner that an excavator is located on an extension line of the front-rear direction (a second stop direction) of the dump truck in a case in which the dump truck has travelled on the post-correction travelling route and stopped at the loading specified position, on the basis of the computed first stop direction, position data of the loading specified position, and swing center position data of the excavator.

Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

Abstract: An electronic device includes: (i) a first chiplet including a first seal ring, which is disposed in metal layers embedded between a first surface of the first chiplet, and a first substrate of the first chiplet, (ii) a second chiplet including a second seal ring, which is disposed in metal layers embedded between a second surface of the second chiplet, and a second substrate of the second chiplet, and (iii) a third seal ring, which surrounds the first and second chiplets and is disposed in a dielectric substrate extrinsic to the metal layers and overlaying the first and second surfaces of the first and second chiplets.

Abstract: Provided are virtual try-on applications, telepresence applications, relating to modeling realistic clothing worn by humans and realistic modeling of humans in three-dimension (3D). Proposed is a hardware comprising software products that perform method for imaging clothes on a person, that is adapted to the body pose and the body shape, based on point cloud draping model, the method including using of point cloud and a neural network that synthesizes such point clouds to capture/model the geometry of clothing outfits, and using of point based differentiable neural rendering to capture the appearance of clothing outfits.