Abstract: Systems, devices, and methods are disclosed in which one or more light sources, a detector, a processor and a controller are configured such that light from the one or more light sources improves the ability of a human or automated motor vehicle driver to identify and avoid pedestrians. The one or more light sources may provide spot illumination to moving objects or pedestrians on a road surface, with the spot illumination following the moving object or pedestrians along the portion of the road surface. The one or more light sources may project images on the ground or on other surfaces. The light source may be carried by a pedestrian or on personal transport used by a pedestrian. The light sources may be stationary and provide lighting for a pedestrian street crossing.

Abstract: A flexible lighting device includes a flexible transparent body that extends along a length direction of the lighting device, the flexible transparent body comprising particles dispersed therein. The flexible light device also includes a flexible substrate, embedded in the flexible transparent body, and extending along a length direction of the lighting device. The flexible substrate separates the flexible transparent body into a first portion that has a first concentration of the particles and a second portion that has a second concentration of the particles. The first concentration may be different than the second concentration, and the first surface of the flexible substrate may face the first portion and a second surface of the flexible substrate may face the second portion. At least two light emitting elements may be arranged on the first surface of the flexible substrate along the length direction of the lighting device.

Abstract: A light emitting device is disclosed and includes an emission source configured to emit a primary blue light and a wavelength-converting element configured to convert the primary blue light to a secondary light, where the wavelength-converting element including a red phosphor material having a peak emission wavelength that is less than 620 nm and a green phosphor material having a peak emission wavelength that is greater than 530 nm. The device may have a correlated color temperature (CCT) in the range of 1600K-2500K, may exhibit a melanopic/photopic ratio less than 0.25 and/or may exhibit a radiometric power fraction of light having a wavelength below 530 nm below 0.1.

Abstract: An illumination system can include a dual junction light-emitting diode (LED) array including first and second junctions that extend in a plane. The first junction can emit first light from a plurality of first light-emitting areas that are separated by first boundaries. The second junction can be disposed on the first junction such that the first light passes through the second junction. The second junction can emit second light from a plurality of second light-emitting areas. The second light-emitting areas can be separated by second boundaries that correspond in a one-to-one correspondence to the first boundaries. The second boundaries can be offset in the plane from the corresponding first boundaries. The offset can help reduce or eliminate dark bands in the combined first and second light, which could be present if the second boundaries were not offset from the first boundaries.

Abstract: This specification discloses lighting device the includes a combination of a royal-blue and blue pump LEDs with a mixture of phosphors to provide light with a high melanopic content and maximize an m/p ratio while maintaining high color fidelity, and a tunable lighting system including the lighting device.

Abstract: A lighting device comprises a light-emitting module with light-emitting elements, wherein the light-emitting elements are arranged adjacent to each other and are configured to emit light towards a light-emitting side. The light-emitting module is configured such that the light-emitting elements can be addressed partially independently of each other, such that some may be brought into a switched-on state while others are brought into a switched-off state. A top layer is disposed on the light-emitting module at the light-emitting side. Further comprising a switching material capable of a reversible change in transmittance for the light emitted by changing to a higher transmittance in regions where the top layer situated on light-emitting elements in the switched-on state or to a lower transmittance in regions of the top layer situated in the switched-off state. The invention further refers to methods for producing and operating a lighting device and using a lighting device.

Abstract: An LED retrofit lamp for a projection headlight system comprises a heat dissipating body portion and a substantially rectangular substrate. A first LED group is mounted on a first surface of the substrate and a second LED group is mounted on a second surface. A support bracket is configured to engage longitudinal sides of the substrate to mechanically support the substrate in alignment with a central optical axis of the headlight system so that light emitted by the first and second LED groups parallel to the first and second surfaces illuminates corresponding top and bottom segments of a cooperating reflector with sufficient intensity for projection headlight system to form a beam having substantially homogenous light intensity.

Abstract: Described are light emitting diode (LED) devices comprising a plurality of mesas defining pixels, each of the mesas comprising semiconductor layers, an N-contact material in a space between each of the plurality of mesas, a dielectric material which insulates sidewalls of the P-type layer and the active region from the metal. A hard mask layer is above the semiconductor layers, the hard mask layer having a plurality of openings therein, each partially filled with a liner layer and partially filled with a P-metal material plug, the P-metal material plug having a width; and a passivation film is on the hard mask layer, the passivation film having a plurality of passivation film openings therein defining a width, the width of each passivation film opening being less than the width of a combination of the P-metal material plug and the liner layer.

Abstract: A semiconductor device is electrically connected to a power source through an electrical contact and at least one bump disposed on the electrical contact. The semiconductor device may be an LED on a CMOS wafer with the electrical contact spaced apart from it and disposed on the wafer. The semiconductor device and the electrical contact have side coating material disposed to surround them, and the at least one bump may be stacked to reach or nearly reach the top surface of the side coating material. This allows wire bonding of the semiconductor device to an external power source through the easily accessible bump(s), whose top surface is exposed by the side coating material.

Abstract: A lighting device comprises a support comprising a mounting section having at least one mounting face. The at least one mounting face has an arrangement direction and comprising at least two contact sections along the arrangement direction. The support further comprises a body section adjacent to the mounting section. The support further comprises a plurality of layered conductors connecting the body section to the at least one mounting face. The lighting device comprises at least one light-emitting element mounted along the arrangement direction of the at least one mounting face such that the at least one light-emitting element is in electrical contact to the at least two contact sections.

Abstract: A light-emitting diode (LED) package assembly includes a substrate. The substrate includes a top surface, a bottom surface and an opening formed through the substrate. The opening includes a first portion adjacent the top surface and a second portion adjacent the bottom surface that is wider than the first portion such that portions of the substrate overhang the second portion of the opening. Pads are provided on a bottom surface of the portions of the substrate that overhang the second portion of the opening. The assembly also includes a hybridized device in the opening. The hybridized device includes a silicon backplane that has a top surface, a bottom surface and interconnects on the top surface. The interconnects are electrically coupled to the pads. The hybridized device also includes an LED array on the top surface of the silicon backplane.

Abstract: A light source includes an array of light emitters, with at least some light emitters having a central patterned surface and an unpatterned border; a light blocking metal layer positioned between each of the array of light emitters; and down-converter material positioned on each of the array of light emitters.

Abstract: Described at light emitting diode (LED) devices emitting different colors on the same wafer, which facilitates their integration with close packing density (not requiring transfer of devices from two different wafers to a third substrate module). The LED devices and driving methods allow light of different colors and similar luminance levels to be emitted for given input current.

Abstract: An electronic device includes a heat dissipation structure that includes one or more openings. An electronic component is disposed on a surface of the heat dissipation structure and over the one or more openings. The electronic component is coupled to the heat dissipation structure by an adhesion material in the one or more openings.

Abstract: A cluster of lighting devices, a display and a method of manufacturing a display are described. The lighting device includes a mixing box, a light source, a transparent layer and a light diffusing layer. The light source is embedded in the mixing box. The transparent layer is adjacent to the light source. The light diffusing layer is adjacent to the transparent layer. A surface emitter display includes a cluster of surface emitters including a plurality of surface emitters. At least one circuit board is electrically coupled to at least one surface emitter of the plurality of surface emitters.

Abstract: A micro-light emitting diode (uLED) device comprises: a mesa comprising: a plurality of semiconductor layers including an n-type layer, an active layer, and a p-type layer; a p-contact layer contacting the p-type layer; a cathode contacting the first sidewall of the n-type layer; a first region of dielectric material that insulates the p-contact layer, the active layer, and a first sidewall of the p-type layer from the cathode; an anode contacting the top surface of the p-contact layer; and a second region of dielectric material that insulates the active layer, a second sidewall of the p-type layer, and the second sidewall of the n-type layer from the anode. The top surface of the p-contact layer has a different planar orientation compared to the first and second sidewalls of the n-type layer. Methods of making and using the uLED devices are also provided.

Abstract: An automotive lighting system for a vehicle includes a light source, a refraction lens and a projection lens. The light source includes a first sub light source. The refraction lens includes a light entrance surface and a light exit surface. The light entrance surface has a first protrusion that has a first light entrance face adjacent the first sub light source and a first light exit face on the light entrance surface of the first refraction lens. The first protrusion is located at a periphery of the light entrance surface of the refraction lens with respect to an optical axis of the automotive lighting system.

Abstract: A system includes a first primary optics that receives light from a first light source and projects it onto a transparent shutter and a secondary optics. A second primary optics receives light from the second light source and projects it onto the transparent shutter. The transparent shutter receives light from the first light source via the first primary optics and prevents a lower part of it from entering the secondary optics. The transparent shutter further receives light from the second light source via the second primary optics and projects it onto the secondary optics. The secondary optics receives light from the first primary optics and the transparent shutter and projects it onto a road in front of the vehicle. The transparent shutter includes an air-exposed slit that redirects the light received by the transparent shutter from the second light source toward a middle axis of the transparent shutter.

Abstract: A light-emitting device includes a semiconductor diode structure with one or more light-emitting active layers, an anti-reflection coating on its front surface, and a redirection layer on its back surface. Active-layer output light propagates within the diode structure. The anti-reflection coating on the front surface increases transmission of active-layer output light incident below the critical angle ?c. Active-layer output light incident on the redirection layer at an incidence angle greater than ?c is redirected to propagate toward the front surface at an incidence angle that is less than ?c. Device output light is transmitted by the front surface to propagate in an ambient medium, and includes first and second portions of the active-layer output light incident on the front surface at an incidence angle less than ?c, the first portion without redirection by the redirection layer and the second portion with redirection by the redirection layer.

Abstract: A semiconductor light-emitting device includes a junction or active layer between doped semiconductor layers coextensive over a contiguous device area, corresponding sets of electrical contacts connected to the semiconductor layers, and multiple nanostructured optical elements at a surface of one semiconductor layer opposite the other semiconductor layer. Composite electrical contacts of one set include a conductive layer, a transparent dielectric layer between the conductive and semiconductor layers, and vias through the dielectric layer connecting the conductive and semiconductor layers. The nanostructured elements redirect light, propagating laterally in optical modes supported by the semiconductor layers, to exit the device. The composite electrical contacts can be independent and define independently addressable pixel areas of the device. The nanostructured elements and thin semiconductor layers can yield high contrast between adjacent pixel areas without trenches between them.