Abstract: Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalls. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.

Abstract: A semiconductor light-emitting device includes a junction or active layer between doped semiconductor layers coextensive over a contiguous device area, corresponding sets of electrical contacts connected to the semiconductor layers, and multiple nanostructured optical elements at a surface of one semiconductor layer opposite the other semiconductor layer. Composite electrical contacts of one set include a conductive layer, a transparent dielectric layer between the conductive and semiconductor layers, and vias through the dielectric layer connecting the conductive and semiconductor layers. The nanostructured elements redirect light, propagating laterally in optical modes supported by the semiconductor layers, to exit the device. The composite electrical contacts can be independent and define independently addressable pixel areas of the device. The nanostructured elements and thin semiconductor layers can yield high contrast between adjacent pixel areas without trenches between them.

Abstract: LED arrays with diffusing elements are disclosed. In various embodiments, diffusing elements in the form of one or more structures of a diffuser material may be provided between an LED array and an optical element that collects light emitted by the array and directs the light to an optical far field. The optical element may image or approximately image the LED array. The diffusing elements at least partially blur patterning in the far field illumination that may otherwise arise from the optical element imaging the array. Each LED may be a wavelength-converting LED in that it may include a light emitter arrangement and a wavelength-converter structure.

Abstract: Apparatuses and methods are disclosed for controlling a multicolor LED array. The light engine includes a dimming emulator that supplies high and low supply voltages to a driver dependent on a duty cycle of PWM signals from a control unit. An optical coupler isolates the low supply voltage from ground of the dimming emulator. The control unit receives power for the array from the driver dependent on the supply voltages and controls the array based thereon. The coupler is coupled to a control terminal of an NPN transistor, the PWM signals change the average impedance of the coupler based on the duty cycle and change a voltage divider ratio applied to the control terminal. Other apparatuses and methods are disclosed.

Abstract: A lighting device includes a flexible housing, at least two light emitting elements, and at least one mounting member. The flexible housing extends along a length direction of the lighting device and has an inner surface configured to reflect light. The at least two light emitting elements are arranged along the length direction of the lighting device and are mounted to the flexible housing. The at least one mounting member is an integral component of the flexible housing and extends continuously along the length direction of the lighting device. The at least one mounting member includes a base section and a sequence of mounting sections. At least two of the mounting sections are separated from each other by a recess. The sequence of mounting sections extends from the base section of the at least one mounting member.

Abstract: Phosphor converted LEDs (pcLEDs) are color tuned by temporal saturation of an electronic transition from which the phosphor emission arises. A single such pcLED is individually color tunable. In an array of such pcLEDs each pixel may be separately color tunable.

Abstract: An LED lighting system, an automotive lighting system and a method of detecting failure in an LED lighting system are described herein. An LED lighting system includes an LED lighting circuit and a failure detection circuit. The LED lighting circuit includes a first string of a first plurality of LEDs electrically coupled in series with a first inductor and a second string of a second plurality of LEDs electrically coupled in series with a second inductor. The first and second strings each have an equal total forward voltage. The failure detection circuit is configured to detect a failure in the LED lighting circuit based on detection of a voltage difference between the first inductor and the second inductor.

Abstract: A light spreading lens, an automotive lighting system, and method of manufacturing a light spreading lens are described. The light spreading lens includes an outer surface. The outer surface is defined by a Boolean intersection of a first cylindrical lens overlaid with a second cylindrical lens. The first cylindrical lens is configured to distribute light along a first axis. The second cylindrical lens is configured to distribute light along a second axis.

Abstract: An electrical contact, a 3D LED and a method of manufacturing 3D LEDs are described. The electrical contact includes a printed circuit board (PCB) bridge and a PCB connector. The PCB bridge comprises at least one electrical contact. The at least one electrical contact is configured for electrical coupling with at least one interposer of a string of LEDs. The PCB connector is electrically coupled to the PCB bridge. The PCB connector comprises an electrical contact configured for electrical coupling with at least one external electrical wire.

Abstract: A light-emitting array includes a semiconductor LED structure, multiple transparent dielectric bodies, a set of multiple, independent first electrical contacts, and a set of second electrical contacts. The LED structure extends contiguously over the array. The second electrical contacts are in electrical contact with the second semiconductor layer. Each dielectric body protrudes away from the first semiconductor layer and has on its surface an electrically conductive layer in electrical contact with the first semiconductor layer, forming a portion of a corresponding one of the first electrical contacts. Each dielectric body and corresponding first electrical contact define a corresponding discrete, circumscribed pixel region within the contiguous area of the array, each pixel region separate from the others.

Abstract: A semiconductor LED includes p-doped, n-doped, and active layers, and has anode and cathode electrical contacts, a lateral dielectric layer on the side surfaces of the LED, and an electrically conductive bonding layer on the lateral dielectric layer. The bonding layer is electrically coupled to the anode electrical contact and electrically insulated from side surfaces of the active and n-doped layers by the lateral dielectric layer. The LED has a cross-sectional area that increases monotonically with increasing distance from its anode contact surface toward its light-exit surface. Side-surface shape is arranged so that internal reflection within the LED or lateral dielectric layer redirects a portion of light, emitted by the active layer and propagating within the LED outside an escape cone, to propagate toward the exit surface of the n-doped layer within the escape cone.

Abstract: The output spectrum of a light emitting device comprising LEDs and/or pcLEDs is tunable by controlling emission from an activating LED to activate absorption by a photochromic material in the light output optical path of the device, or to induce emission from a wavelength converting material not otherwise active during operation of the light emitting device, or to activate absorption by a photochromic material in the light output optical path of the device and to induce emission from a wavelength converting material not otherwise active during operation of the light emitting device.

Abstract: A light-emitting device comprising VCSELs formed in a die. The VCSEL distribution is characterized by an essentially linear decrease in VCSEL density over the die from a highest VCSEL density in a first die region to a lowest VCSEL density in another die region. The VCSELs share a common anode and a common cathode for collective switching of the plurality of VCSELs. A method of manufacturing such a VCSEL die is also described.

Abstract: An apparatus projecting light onto a projection surface comprises: a substrate having disposed thereon two or more LED clusters and two or more micro-lenses, each LED cluster comprising a plurality of LEDs and each of the micro-lenses being disposed the plurality of LEDs. Each of the LED clusters is arranged to emit light through each of the micro-lenses in a pattern of dots. A center of at least one LED cluster is off-set from an optical center of the micro-lens of its LED cluster. A projected image includes arrangements of individual dots and/or areas of smooth light resulting from the pattern of dots.

Abstract: Described are light emitting diode (LED) devices including a combination of electroluminescent quantum wells and photo-luminescent active regions in the same wafer. A first group of QWs with shortest emission wavelength is placed between the p- and n-layers of a p-n junction. Other groups of QWs with longer wavelengths are placed outside the p-n junction in a part of the LED structure where electrical injection of minority carriers does not occur. Electroluminescence emitted by the first group of QWs is absorbed by other group(s) and re-emitted as longer wavelength light. The color of an individual die made on the wafer can be controlled by either etching away unwanted groups of longer-wavelength QWs at the position of that die, or keeping them intact. Wavelength-selective mirrors that increase down conversion efficiency may be selectively applied to die where longer wavelength emission is desired.

Abstract: A semiconductor light-emitting device has an emitter matrix with an arrangement of emitter cells interspersed with non-emitter cells. The emitter cell has a semiconductor emitter, and a non-emitter cell does not have a semiconductor emitter. A number of bond pads for connection to a power supply and a plurality of wirebonds are present. Each wirebond extends from a bond pad to the semiconductor emitter of an emitter cell. An imaging arrangement includes a light source for illuminating a scene. The light source has a pair of such semiconductor light-emitting devices. A method of manufacturing such a semiconductor light-emitting device is also described.

Abstract: A lighting device is disclosed that includes a plurality of light emitting diodes arranged in an array, trenches disposed between the light emitting diodes, and a scattering layer disposed in the trenches, the scattering layer including a binder matrix, a plurality of scattering particles disposed in the binder matrix, and a plurality of porous particles containing a gas, the porous particles disposed in the binder matrix.

Abstract: Described is a light-emitting device and methods of manufacturing thereof. The light-emitting device comprises unpackaged light-emitting diodes arranged in a grid. The unpackaged light-emitting diodes in the are fixed in place by the reflective coating material. Each of the plurality of unpackaged light-emitting diodes are surrounded by a reflective coating material and may be separated by a layer of light absorbing material.

Abstract: An illumination system can produce a dynamically variable illumination pattern. The illumination system can include a light guide. The illumination system can include projection optics, which can contribute to the illumination pattern at relatively low beam angles (i.e., beam angles formed with respect to a surface normal of the light guide). The projection optics can include individually addressable light-producing elements that can direct light through one or more focusing elements. A controller can control which of the light-producing elements are electrically powered and can therefore control the illumination pattern contribution from the projection optics. The illumination system can also include scattering optics, which can contribute to the illumination pattern at relatively high beam angles. The scattering optics can direct light out of the light guide over a relatively large surface area, which can help reduce glare when the light guide is viewed directly.

Abstract: An electrical power converter can include a plurality of layers disposed on a substrate. An emitter, including a first semiconductor junction that is formed at an interface between a first pair of adjacent layers, can produce light in response to a first electrical signal. An absorber, including a second semiconductor junction that is formed at an interface between a second pair of adjacent layers, can absorb at least some of the light. Circuitry can produce a second electrical signal in response to the absorbed light. The second electrical signal can be substantially proportional to the first electrical signal and can be electrically isolated from the first electrical signal. Because the light can remain within the layers during use, the electrical power converter can have a higher efficiency than a comparable device that propagates the light through at least one interface between air and a semiconductor material.